Search Results for laser surface processing

This chapter discusses surface engineering treatments, including flame hardening, induction hardening, high-energy beam hardening, laser melting, and shot peening. It describes the basic implementation of each method, the materials for which they are suited, and their effect on surface metallurgy.

This chapter is a compilation of terms and definitions related to surface engineering for corrosion and wear resistance.

This chapter discusses the fusion welding processes, namely oxyfuel gas welding, oxyacetylene braze welding, stud welding (stud arc welding and capacitor discharge stud welding), high-frequency welding, electron beam welding, laser beam welding, hybrid laser arc welding, and thermit welding.

This chapter describes surface modification processes that go beyond conventional heat treatments, including plasma nitriding, plasma carburizing, low-pressure carburizing, ion implantation, physical and chemical vapor deposition, salt bath coating, and transformation hardening via high-energy laser and electron beams. The chapter compares methods and includes several example applications.

Surface modification technologies improve the performance of tool steels. This chapter discusses the processes involved in oxide coatings, nitriding, ion implantation, chemical and physical vapor deposition processing, salt bath coating, laser and electron beam surface modification, and boride coatings that improve the performance of hot-work and high-speed tool steels.

The orientation of the devices within a package determine the best chosen approach for access to a select component embedded in epoxy both in package or System in Package and multi-chip module (MCM). This article assists the analyst in making decisions on frontside access using flat lapping, chemical decapsulation, laser ablation, plasma reactive ion etching (RIE), CNC based milling and polishing, or a combination of these coupled with optical or electrical endpoint means. This article discusses the general characteristics, advantages, and disadvantages of each of these techniques. It also presents a case study illustrating the application of CNC milling to isolate MCM leakage failure.

This chapter gives a brief review of the development of additive manufacturing (AM) and the appeal of different of different AM methods.

This chapter begins with a brief review of the different types of surface treatments and coatings used in industry and their effect on properties and performance. It then discusses the importance of corrosion and wear treatments and the consequences of failing to properly implement them in critical industries such as mining, energy production, transportation, and mineral and chemical processing. The chapter also describes basic approaches to dealing with corrosion and wear in steel.

This chapter reviews some of the differences between powder metallurgy and additive manufacturing and explains how they influence the microstructure and properties of various alloys and the formation of defects in manufactured parts.

This chapter covers various consolidation techniques used in powder metallurgy, including laser sintering (pressureless sintering), hot pressing, high-pressure torsion, microwave sintering, spark plasma sintering, and pulse plasma sintering. It also discusses the effect of milling parameters on mechanically alloyed powders, their consolidation characteristics, and the properties of bulk components.

Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.

This chapter covers the different types of wear encountered in metalworking processes. It discusses the mechanisms involved in adhesive, abrasive, chemical, and fatigue wear and key contributing factors, including the composition and structure of tool and workpiece materials, the characteristics of contact surfaces, and loading forces imposed by the process. It describes the nature of metal transfer between tool and workpiece surfaces and the role of lubricants, coatings, and textures. It also discusses the use of wear maps, the effects of adhesion, and material-lubricant interactions.

This chapter describes case depth and discusses flame hardening, laser heat treatment, electron beam hardening, induction heat treatment, and induction hardening.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.

This chapter begins with a review of some of the terms used in the gear industry to describe the design of gears and gear geometries. It then discusses the types of gears that operate on parallel shafts, intersecting shafts, and nonparallel and nonintersecting shafts. Next, the processes involved in the selection of gear are discussed, followed by information on the basic stresses applied to a gear tooth, the strength of a gear tooth, and the most widely used gear materials. Further, the chapter briefly reviews gear manufacturing methods and the heat treating processing steps including prehardening processes, through hardening, and case hardening processes.

This chapter provides an overview of sintering techniques and the microstructures and properties that can be achieved in different material systems. It covers conventional furnace sintering, microwave and laser sintering, hot and hot-isostatic pressing, and spark plasma sintering. It describes the advantages and disadvantages of each method, the mechanisms involved, and the effect of sintering parameters on the density, grain size, and mechanical properties of titanium and tungsten heavy alloys, stainless steel, cemented carbides, ceramics, composites, and rare earth magnets.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.