This chapter describes surface modification processes that go beyond conventional heat treatments, including plasma nitriding, plasma carburizing, low-pressure carburizing, ion implantation, physical and chemical vapor deposition, salt bath coating, and transformation hardening via high-energy laser and electron beams. The chapter compares methods and includes several example applications.

Surface modification technologies improve the performance of tool steels. This chapter discusses the processes involved in oxide coatings, nitriding, ion implantation, chemical and physical vapor deposition processing, salt bath coating, laser and electron beam surface modification, and boride coatings that improve the performance of hot-work and high-speed tool steels.

This chapter discusses the types, methods, and advantages of heat treating procedures, including annealing, normalizing, tempering, and case hardening. It describes the iron-carbon system, the formation of equilibrium and metastable phases, and the effect of alloy elements on hardenability and tempering response. It discusses the significance of critical temperatures, the use of transformation diagrams, and types of annealing treatments. It also provides information on heat treating furnaces, the effect of heating rate on transformation temperatures, quench and temper procedures, and the use of cold treating.

This chapter discusses surface engineering treatments, including flame hardening, induction hardening, high-energy beam hardening, laser melting, and shot peening. It describes the basic implementation of each method, the materials for which they are suited, and their effect on surface metallurgy.

This chapter discusses the fusion welding processes, namely oxyfuel gas welding, oxyacetylene braze welding, stud welding (stud arc welding and capacitor discharge stud welding), high-frequency welding, electron beam welding, laser beam welding, hybrid laser arc welding, and thermit welding.

This chapter discusses the processes involved in heat treating of stainless steels, providing information on the classification, chemical compositions, and corrosion resistance of stainless steels. Five groups of stainless steels are discussed: austenitic, ferritic, martensitic, precipitation-hardening, and duplex grades. The chapter also describes the heat treatment conditions that should be followed for processing of stainless steels.

The orientation of the devices within a package determine the best chosen approach for access to a select component embedded in epoxy both in package or System in Package and multi-chip module (MCM). This article assists the analyst in making decisions on frontside access using flat lapping, chemical decapsulation, laser ablation, plasma reactive ion etching (RIE), CNC based milling and polishing, or a combination of these coupled with optical or electrical endpoint means. This article discusses the general characteristics, advantages, and disadvantages of each of these techniques. It also presents a case study illustrating the application of CNC milling to isolate MCM leakage failure.

This chapter covers the welding characteristics of titanium along with the factors that determine which welding method is most appropriate for a given application. It discusses the joinability of titanium alloys, the effect of heat on microstructure, the cause of various defects, and the need for contaminant-free surfaces and atmospheres. It describes common forms of fusion, arc, and solid-state welding along with the use of filler metals, shielding gases, and stress-relief treatments. It also discusses the practice of titanium brazing and the role of filler metals.

This chapter discusses the factors that influence the cost and complexity of machining titanium alloys. It explains how titanium compares to other metals in terms of cutting force and power requirements and how these forces, along with cutting speeds and the use of cutting fluids, affect tool life, surface finish, and part tolerances. The chapter also includes a brief review of nontraditional machining methods.

This chapter begins with a review of some of the terms used in the gear industry to describe the design of gears and gear geometries. It then discusses the types of gears that operate on parallel shafts, intersecting shafts, and nonparallel and nonintersecting shafts. Next, the processes involved in the selection of gear are discussed, followed by information on the basic stresses applied to a gear tooth, the strength of a gear tooth, and the most widely used gear materials. Further, the chapter briefly reviews gear manufacturing methods and the heat treating processing steps including prehardening processes, through hardening, and case hardening processes.

Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small details. It begins with the basic microscope column and construction. The article discusses microscope adjustments, brightfield and darkfield illumination, and microscope concepts important to liquid crystal techniques. It also discusses solid immersion lenses, infrared and ultraviolet microscopy and concludes with laser microscopy techniques such as thermal induced voltage alteration and external induced voltage alteration.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.

This chapter begins with a brief review of the different types of surface treatments and coatings used in industry and their effect on properties and performance. It then discusses the importance of corrosion and wear treatments and the consequences of failing to properly implement them in critical industries such as mining, energy production, transportation, and mineral and chemical processing. The chapter also describes basic approaches to dealing with corrosion and wear in steel.

This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.

Cast irons, like steels, are iron-carbon alloys but with higher carbon levels than steels to take advantage of eutectic solidification in the binary iron-carbon system. Like steel, heat treatment of cast iron includes stress relieving, annealing, normalizing, through hardening, and surface hardening. This chapter introduces solid-state heat treatment of iron castings, covering general considerations for heat treatment and discussing the processes, advantages, and disadvantages of heat treatment of cast iron.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

This chapter discusses the types of failures that can occur in sheet metal forming tools and explains how to mitigate their effects. It describes the factors that influence galling and wear and the benefits of special treatments and coatings. It provides information on through hardening, case (surface) hardening, and nitriding as well as hard chrome plating, vapor deposition, and thermal diffusion coating. It explains how to measure wear resistance using various tests and provides guidelines for selecting tool materials, treatments, and coatings.

Induction heating, in most applications, is used to selectively heat only a portion of the workpiece that requires treatment. This chapter covers the basic principles, features, and metallurgical aspects of induction heating. The discussion includes the conditions required for induction heating and quenching, the use of magnetic flux concentrators to improve the efficiency of surface heating, and the quenching systems used for induction hardening. The discussion also provides information on time-temperature dependence in induction heating, workpiece distortion in induction surface hardening, residual stresses after induction surface hardening and finish grinding, and input and output control of steel for induction surface hardening of gears.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.