Organic coatings (paints and plastic or rubber linings), metallic coatings, and nonmetallic inorganic coatings (conversion coatings, cements, ceramics, and glasses) are used in applications requiring corrosion protection. These coatings and linings may protect substrates by three basic mechanisms: barrier protection, chemical inhibition, and galvanic (sacrificial) protection. This chapter begins with a section on organic coating and linings, providing a detailed account of the steps involved in the coating process, namely, design and selection, surface preparation, application, and inspection and quality assurance. The next section discusses the methods by which metals, and in some cases their alloys, can be applied to almost all other metals and alloys: electroplating, electroless plating, hot dipping, thermal spraying, cladding, pack cementation, vapor deposition, ion implantation, and laser processing. The last section focuses on nonmetallic inorganic coatings including ceramic coating materials, conversion coatings, and anodized coatings.

This chapter discusses the fusion welding processes, namely oxyfuel gas welding, oxyacetylene braze welding, stud welding (stud arc welding and capacitor discharge stud welding), high-frequency welding, electron beam welding, laser beam welding, hybrid laser arc welding, and thermit welding.

This chapter discusses surface engineering treatments, including flame hardening, induction hardening, high-energy beam hardening, laser melting, and shot peening. It describes the basic implementation of each method, the materials for which they are suited, and their effect on surface metallurgy.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

Surface modification technologies improve the performance of tool steels. This chapter discusses the processes involved in oxide coatings, nitriding, ion implantation, chemical and physical vapor deposition processing, salt bath coating, laser and electron beam surface modification, and boride coatings that improve the performance of hot-work and high-speed tool steels.

This chapter describes surface modification processes that go beyond conventional heat treatments, including plasma nitriding, plasma carburizing, low-pressure carburizing, ion implantation, physical and chemical vapor deposition, salt bath coating, and transformation hardening via high-energy laser and electron beams. The chapter compares methods and includes several example applications.

This chapter covers the practical aspects of machining, particularly for turning, milling, drilling, and grinding operations. It begins with a discussion on machinability and its impact on quality and cost. It then describes the dimensional and surface finish tolerances that can be achieved through conventional machining methods, the mechanics of chip formation, the factors that affect tool wear, the selection and use of cutting fluids, and the determination of machining parameters based on force and power requirements. It also includes information on nontraditional machining processes such as electrical discharge, abrasive jet, and hydrodynamic machining, laser and electron beam machining, ultrasonic impact grinding, and electrical discharge wire cutting.

With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove layers of material in order to locate and identify the area of interest. Several of the top-down delayering techniques include wet chemical etching, dry reactive ion etching, top-down parallel lapping (including chemical-mechanical polishing), ion beam milling and laser delayering techniques. This article discusses the general procedure, types, advantages, and disadvantages of each of these techniques. In this article, two types of different semiconductor die level backend of line technologies are presented: aluminum metallization and copper metallization.

This chapter focuses on what can cause a system to fail and addresses the challenge in approaching a system failure. It then examines the steps involved in the four-step problem-solving process: defining the problem, identifying all potential failure causes and evaluating the likelihood of each, identifying the potential solutions, and identifying the best solution. The chapter concludes by describing the responsibilities of a failure analysis team.

A successful heat treating operation is determined by the ability to satisfy the customer's quality requirements consistently and economically. This chapter reviews the steps that are important to produce quality parts in heat treating with a brief practical explanation of each. The steps include selecting proper material and design of the part being treated; determining whether the process is capable of heat treatment; using statistical process control, control charting, and in-process inspection and testing; and applying statistical quality control and final testing (sampling) to verify the results.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.

The orientation of the devices within a package determine the best chosen approach for access to a select component embedded in epoxy both in package or System in Package and multi-chip module (MCM). This article assists the analyst in making decisions on frontside access using flat lapping, chemical decapsulation, laser ablation, plasma reactive ion etching (RIE), CNC based milling and polishing, or a combination of these coupled with optical or electrical endpoint means. This article discusses the general characteristics, advantages, and disadvantages of each of these techniques. It also presents a case study illustrating the application of CNC milling to isolate MCM leakage failure.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications. The article presents examples that demonstrate the benefits of the enhanced wafer-level FA process. It also introduces the setup of the wafer-level fault localization system. The application of the wafer-level FA process on a 22 nm technology device failing memory test is studied and some common design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system.

This chapter discusses coating technologies that are applicable to beryllium, including physical and chemical vapor deposition, thermal evaporation, electroplating, sputtering, ion plating, and plasma arc spraying. It describes the advantages and disadvantages of each method and the effect of temperature, pressure, and other process variables on the microstructures and properties developed.

Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.

This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change are also discussed. The article concludes by providing information on soft defect localization techniques.

Corrective action means the implementation or modification of things designed to eliminate or reduce failure causes. This chapter addresses developing potential solutions and selecting the best solution. It discusses the special operations that should be used only as temporary or interim corrective actions to overcome design, process, and other failure causes. The chapter concludes by describing the process of corrective action implementation.

The analysis of composite materials using optical microscopy is a process that can be made easy and efficient with only a few contrast methods and preparation techniques. This chapter is intended to provide information that will help an investigator select the appropriate microscopy technique for the specific analysis objectives with a given composite material. The chapter opens with a discussion of macrophotography and microscope alignment, and then goes on to describe various illumination techniques that are useful for specific analysis requirements. These techniques include bright-field illumination, dark-field illumination, polarized-light microscopy, interference and contrast microscopy, and fluorescence microscopy. The chapter also provides a discussion of sample preparation materials such as dyes, etchants, and stains for the analysis of composite materials using optical microscopy.