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A system failure occurs when a system does not do what it is supposed to do when it is supposed to do it, or it does something it is not supposed to do. This chapter provides a basic understanding of how failures occur, how systems operate, and the types of failures, namely intermittent and inadvertent system failures.

This chapter describes the different aluminum products used to manufacture modern automobile components. It discusses how automakers use these products to reduce weight, improve performance, and manage production costs. It also reflects on the changes in the aluminum industry, automakers, and their relationships. Organized by product type—castings, sheet, and extrusions—each section of the chapter describes the relevant alloys, tempers, and properties required to meet specific needs for component parts and final assembly.

Coal-based thermal power plants play a major role in the welfare of many nations and the overall global economy. This chapter describes the basic equipment requirements and operating principles of thermal power plants, particularly subcritical, supercritical, and ultra-supercritical types.

This chapter provides an overview of the rolling and finishing processes required to create a sheet, plate, or foil product from a direct chill (DC) cast ingot. The flow paths, equipment, and operations are described with a view to the basic evolution of the microstructure, surface characteristics, and dimensions.

This chapter focuses on the evolution of steel production from 1870 to 1900. It begins with a review of the life of the inventor of the air-boiling process, William Kelly. This is followed by a discussion on how Bessemer's air-blowing process entered the steel production industry and the development of the Kelly-Bessemer process by Alexander Holley. The chapter then discusses how Andrew Carnegie lowered the cost to produce steel, how he entered the iron and steelmaking industry, and how Captain Billy Jones joined Carnegie to expand Carnegie steel. The chapter further provides information on the great strike of 1892 at Homestead and the rapid growth in steel markets. It ends with a discussion about the factors that led Carnegie to sell his steel empire.

This chapter describes some common pitfalls encountered in failure investigations and provides guidance to help engineers recognize processes and “quick fixes” that companies often try to substitute for failure analysis. It discusses three important skills and characteristics that a professional engineer must improve to conduct an effective and successful failure investigation, namely technical skills, communication skills, and technical integrity. The chapter also provides information on the additional basic tools available for failure investigation and root cause determination: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC.

There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main six methods used in semiconductor industry are: Auger spectroscopy, dynamic secondary ion mass spectroscopy, time of flight static secondary ion mass spectroscopy (ToF-SIMS), X-ray photoelectron spectroscopy, scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDX), and transmission electron microscope-EDX. This review specifically addresses ToF-SIMS and describes some typical examples of the application of Auger and SEM-EDX.