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Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130111
EISBN: 978-1-62708-284-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130151
EISBN: 978-1-62708-284-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smfpa.t53500289
EISBN: 978-1-62708-317-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110678
EISBN: 978-1-62708-247-1
... Technology Roadmap for Semiconductors definite ions are reprinted with permission from Semiconductor Industry Association (SIA), 4300 Stevens Creek Boulevard, Suite 271, San Jose, CA, 95129 SEMI definitions are reprinted by SEMATECH with permission from Semicondcutor Equipment and Materials International...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
... and Performing Solder Rework and Reballing for ATE Testing ”, by Chin Cheong Kah [7] ISTFA 2017 Technical Program, “ Case Study of a DDR Loopback Test Failure Encountered on a Map Ball Grid Array Packaged Device ”, by Garcia Jose Z. III and Dickson Kris [8] ECTC 2015 Technical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... Int’l Symp for Testing and Failure Analysis , San Jose, CA , November 2009 , pp. 21 - 26 . [15] Tan S. , Livengood R. H. , Scott D. , Hallstein R. , Pardy P. , Giacobbe J. , “ VIS-NIR LED Illumination in Backside Circuit Edit and Optical Probing ”, Proc 38th Int’l...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... analysis for MEMS motion sensor ”, Proc. 39th Int'l Symp. for Testing and Failure Analysis , San Jose, CA , 2013 , pp. 540 - 543 . [13] Israelachvili J.N. , Intermolecular and Surface Forces , 3rd Ed. , Elsevier , ( Boston , 2011 ). [14] Bowling R.A. , “ An Analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110545
EISBN: 978-1-62708-247-1
.... , Hudgings J. A. , Mayer P. M. , and Ram R. J. , “ Nanoscale Thermoreflectance With 10mK Temperature Resolution Using Stochastic Resonance ,” in Proceedings of the 21st IEEE SEMI-THERM Symposium , San Jose , 2004 . [8] Tessier G. , Hole S. , and Fournier D...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110144
EISBN: 978-1-62708-247-1
... , San Jose, CA , November 2007 , pp. 226 - 230 • Aubert A. et al. , “ Failure analysis case study on a Cu/Lowk technology in package: new frontside approach using laser and plasma de-processing ”, Microelectronics Reliability , vol. 50 ( 2010 ), pp. 1688 - 1691 10.1016/j.microrel...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
...-Destructive Fault Isolation Technique for 3D Flip Chip Packages ,” Proc. 39th Int. Symp. Test. Fail. Anal. (ISTFA) , Nov. 3-7, 2013 ( San Jose, CA ). [13] Brand S. , et al , “ Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications ,” 36th International Symposium...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110228
EISBN: 978-1-62708-247-1
... International Symposium for Testing and Failure Analysis: November 13-17, 2011 , San Jose Convention Center, San Jose, California, USA (p. 158 ). ASM International . [14] Shaw J. , Christopher M. , Yin S. N. , & Felix B. , ( 2008 , November ). Dual Port RAM MBIST Failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060149
EISBN: 978-1-62708-261-7
... arise from the preparation in many ways. In particular, Jose Ramon Vilella ( Fig. 7.2 ) was the first to realize that artifacts were sometimes being observed due to the presence of a layer of “distorted or disturbed” metal formed during the early stages of surface preparation and not during polishing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110032
EISBN: 978-1-62708-247-1
... • Saatv Thomas L. , Decision Making for leaders , 2nd Edition , RWS Publications , Pittsburgh, PA , 1990 • Semiconductor Industry Association , “The National Technology Roadmap for Semiconductors”, SIA , San Jose, CA , 2003 • Silverman Melvin , The Technical Manager’s...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... . [11] Orozco A. , Gaudestad J. , Gagliolan N. , Rowlett C. and Wong E. , “ 3D Magnetic Field Imaging for Non-destructive Fault Isolation ,” in ISTFA 2013: Conference Proceedings from the 39th International Symposium for Testing and Failure Analysis , San Jose , 2013...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... of Subsurface Anomalies in Semiconductor Device Wiring Levels ,” Proc. 39th Int'l Symp for Testing and Failure Analysis , San Jose, CA , November 2013 . [22] Bumm L. , Dahanayaka D. , Kaszuba P. , Moszkowicz L. , Slinkman J. , U. S. Patent 7, 944,550 B2 . [23...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110643
EISBN: 978-1-62708-247-1
... [18] Jenkins K. , Jose A. , Heidel D. , “ An On-chip Jitter Measurement Circuit with Sub-picosecond Resolution ”, Proc. of ESSCIRC , pp. 157 - 160 , 2005 [19] Nose K. , Kajita M. , Mizuno M. , “ A 1-ps Resolution Jitter-Measurement Macro Using Interpolated...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110132
EISBN: 978-1-62708-247-1
... isolation technique for 3D flip chip packages ”, Pp 264 - 269 ; ISTFA 2013, Proceedings from the 39th International Symposium for Testing and Failure Analysis , November 3-7, 2013 , San Jose, CA, USA . [11] Devarajulu Hemachandar Tanukonda , Xie Mayue , Hu Chengqing , and Goyal...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230027
EISBN: 978-1-62708-298-3
... Company , 1984 . “ Chart of the Nuclides with Physical Constants, Conversion Factors and Period Table ,” 13th ed. , San Jose, CA Hausner H.H. , 1965c . Nuclear Properties , Beryllium: Its Metallurgy and Properties , Hausner H.H. , Ed., University of California Press , Berkeley...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780089
EISBN: 978-1-62708-281-5
... System: BSL 913 ,” Technical Report 76138, Royal Aircraft Establishment , 1976 115. Dusi M.R. , “ Chemorheological Characterization and Processing Science of an Epoxy/Amine Thermosetting Matrix ,” M.S. thesis, San Jose State University, 1984 116. Parker B.G. and Smith C.H...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2015
DOI: 10.31399/asm.tb.spsp2.t54410233
EISBN: 978-1-62708-265-5