This chapter describes surface modification processes that go beyond conventional heat treatments, including plasma nitriding, plasma carburizing, low-pressure carburizing, ion implantation, physical and chemical vapor deposition, salt bath coating, and transformation hardening via high-energy laser and electron beams. The chapter compares methods and includes several example applications.

Organic coatings (paints and plastic or rubber linings), metallic coatings, and nonmetallic inorganic coatings (conversion coatings, cements, ceramics, and glasses) are used in applications requiring corrosion protection. These coatings and linings may protect substrates by three basic mechanisms: barrier protection, chemical inhibition, and galvanic (sacrificial) protection. This chapter begins with a section on organic coating and linings, providing a detailed account of the steps involved in the coating process, namely, design and selection, surface preparation, application, and inspection and quality assurance. The next section discusses the methods by which metals, and in some cases their alloys, can be applied to almost all other metals and alloys: electroplating, electroless plating, hot dipping, thermal spraying, cladding, pack cementation, vapor deposition, ion implantation, and laser processing. The last section focuses on nonmetallic inorganic coatings including ceramic coating materials, conversion coatings, and anodized coatings.

This chapter provides practical information on surface treatments that work by altering the surface chemistry of metals and alloys. It discusses the use of phosphate and chromate conversion coatings as well as anodizing, steam oxidation, diffusion coatings, and pack cementation. The chapter also covers ion implantation and laser alloying.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.

With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.

There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main six methods used in semiconductor industry are: Auger spectroscopy, dynamic secondary ion mass spectroscopy, time of flight static secondary ion mass spectroscopy (ToF-SIMS), X-ray photoelectron spectroscopy, scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDX), and transmission electron microscope-EDX. This review specifically addresses ToF-SIMS and describes some typical examples of the application of Auger and SEM-EDX.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

This chapter covers the corrosion behavior of beryllium in aqueous environments. It describes the chemical reactions that drive the corrosion process, the conditions required for equilibrium, and the factors that affect corrosion resistance. It discusses the stability of the native oxides that form on the surface of beryllium and their ability to withstand acids, bases, and corrosive agents found in rain and seawater. It explains how carbides, inclusions, ions, and impurities contribute to corrosion damage, particularly pitting, and how corrosion reduces the ductility and fracture strength of certain beryllium alloys.

This chapter familiarizes readers with the basic concepts of corrosion, discussing chemical reactions, ion transfer mechanisms, electrochemical processes and variables, and the formation of solid corrosion products. It presents a simple but effective teaching tool, the elementary electrochemical corrosion circuit, using it to explain how electric potential differences drive the corrosion process and how corrosion rates vary in proportion to current density. The chapter concludes with a discussion on the importance of corrosion products, such as oxides and hydroxides, and how their formation can be a major factor in controlling corrosion.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.

This chapter discusses coating technologies that are applicable to beryllium, including physical and chemical vapor deposition, thermal evaporation, electroplating, sputtering, ion plating, and plasma arc spraying. It describes the advantages and disadvantages of each method and the effect of temperature, pressure, and other process variables on the microstructures and properties developed.

This chapter explains how to achieve accurate, sharp delineation of the microstructure of metals using appropriate etching and contrasting techniques. It covers a variety of methods, including chemical etching, heat tinting, gas contrasting, vapor deposition, magnetic etching, ion bombardment, and dislocation etch pitting.

Cleaning procedures serve to remove scale, tarnish films, and other contaminants that form or are otherwise deposited on the surface of titanium during processing operations such as hot working and heat treatment. This chapter explains what makes titanium susceptible to the formation of scale and how it can be removed via belt grinding, abrasive blasting, and molten salt descaling baths. It also discusses the role of acid pickling, barrel finishing, polishing, and buffing as well as the use of chemical conversion coatings and protective platings.

This chapter compares and contrasts surface-engineering processes based on process availability, corrosion and wear performance, distortion effects, penetration depth or attainable coating thickness, and cost. It provides both quantitative and qualitative information as well as measured property values.

This chapter covers a wide range of finishing and coating operations, including cleaning, honing, polishing and buffing, and lapping. It discusses the use of rust-preventative compounds, conversion coatings, and plating metals as well as weld overlay, thermal spray, and ceramic coatings and various pack cementation and deposition processes. It also discusses the selection and use of industrial paints and paint application methods.

This article discusses the general purpose of alloying and identifies some of the material properties and behaviors that can be improved by adding various elements to the base metal. It explains how alloying can make metals stronger and more resistant to corrosion and wear as well as easier to cast, weld, form, and machine. It also discusses some of the alloying techniques that have been developed to address problems stemming from dissimilarities between the base metal and alloying or inoculate material.

This chapter begins with a brief review of the different types of surface treatments and coatings used in industry and their effect on properties and performance. It then discusses the importance of corrosion and wear treatments and the consequences of failing to properly implement them in critical industries such as mining, energy production, transportation, and mineral and chemical processing. The chapter also describes basic approaches to dealing with corrosion and wear in steel.

Titanium and its alloys are used chiefly for their high strength-to-weight ratio, but they also have excellent corrosion resistance, better even than stainless steels. Titanium, as the chapter explains, is protected by a tenacious oxide film that forms rapidly on exposed surfaces. The chapter discusses the factors that influence the growth and quality of this naturally passivating film, particularly the role of oxidizing and inhibiting species, temperature, and alloying elements. It also discusses the effect of different corrosion processes and environments as well as hydrogen, stress-corrosion cracking, liquid metal embrittlement, and surface treatments.

Amorphous alloys, because of their lack of crystallographic slip planes, are assumed to be insensitive to the selective corrosion attack that causes stress-corrosion cracking (SCC) in crystalline alloys. However, under certain conditions, melt-spun amorphous alloys have proven vulnerable to SCC due to hydrogen embrittlement. This chapter presents findings from several studies on this phenomenon, describing test conditions as well as cracking and fracture behaviors. It also discusses the effect of deformation on corrosion behavior, particularly for alloys without strongly passivating elements.