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in Overview of Wafer-level Electrical Failure Analysis Process for Accelerated Yield Engineering
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 7 Components involved in navigating a wafer using (a) a wafer manipulator ring and (b) wafer holder ring [13] .
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Published: 01 April 2004
Fig. 5.37 Schematic illustration of the steps involved in making a diffusion-soldered joint
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Published: 01 December 1989
Fig. 4.1. (a) Nomenclature for test parameters involved in cyclic stress testing, and (b) typical S-N curve for fatigue.
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Published: 01 December 1996
Fig. 5-50 Schematic illustration of the heat treatments involved in tempered martensite embrittlement (TME) [or one-step temper embrittlement (OSTE)]. (From C.L. Briant and S.K. Banerji, Int. Metals Reviews , Vol 23, p 164 (1978), Ref 24 )
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Published: 01 December 1996
Fig. 5-59 Schematic illustration of the heat treatment involved in temper embrittlement (TE) [two-step temper embrittlement (TSTE)]. (From C.L. Briant and S.K. Banerji, Int. Metals Reviews , Vol 23, p 164 (1978), Ref 24 )
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Published: 01 August 2005
Fig. 6.1 Schematic illustration of the steps involved in making a diffusion-brazed joint
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Published: 01 January 2015
Fig. 12.31 Schematic representation of the steps involved in hot stamping. The part, formed hot in the austenitic condition, is quenched in the die to martensite. Courtesy of Ronald Hughes, SeverStal North America
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Published: 01 December 2003
Fig. 1 Interrelated factors involved in the design process. Source: Ref 1
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Published: 01 November 2013
Fig. 27 Fundamentals of the techniques involved in the four methods of stretch forming. Source: Ref 17
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in Melting, Casting, and Powder Metallurgy[1]
> Titanium: Physical Metallurgy, Processing, and Applications
Published: 01 January 2015
Fig. 8.57 Schematic of the steps involved in powder injection molding, in which a polymer binder and metal powder are mixed to form the feedstock, which is molded, debound, and sintered
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Published: 01 August 2012
Fig. 7.34 Steps involved in casting cooling ducts. DMD, direct metal deposition. Source: Ref 7.34
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Published: 01 July 2000
Fig. 4.24 Representation of variables involved in galvanic interaction between iron and zinc
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Published: 01 March 2012
Fig. 10.23 Sequence of equilibria involved in freezing of an alloy, showing gross composition in each isotherm. Adapted from Ref 10.3
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Published: 01 July 2009
Fig. 20.11 Illustrations of techniques involved in the four basic methods of stretch forming: (a) and (b) stretch draw forming, (c) stretch wrapping, (d) compression forming, and (e) radial-draw forming. Source: ASM 1988b
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Published: 01 March 2000
Fig. 2 Functional block diagram showing the principal process steps involved in a soft aluminum alloy extrusion plant
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Published: 01 March 2000
Fig. 3 Functional block diagram showing the principal process steps involved in a harder aluminum alloy extrusion plant
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Published: 01 March 2000
Fig. 4 Functional block diagram showing the principal process steps involved in a harder aluminum alloy extrusion plant with an annealing process
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Published: 01 January 2000
Fig. 8 Schematic diagram of electrochemical and microbial processes involved in tuberculation. Not all of these processes may be active in any given situation. Cl − , chlorides.
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Published: 01 January 2000
Fig. 1 Processes, materials, and engineering disciplines involved in manufacturing a battery
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in Stress-Corrosion Cracking of High-Strength Steels (Yield Strengths Greater Than 1240 MPa)[1]
> Stress-Corrosion Cracking: Materials Performance and Evaluation
Published: 01 January 2017
Fig. 3.8 Schematic illustration of various sequential processes involved in external hydrogen embrittlement. Source: Ref 3.21
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