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inverse heat-conduction problem

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040237
EISBN: 978-1-62708-300-3
... determination and inverse analysis can be found in Chapter 8, “Inverse Analysis of Simultaneous Determination of Flow Stress and Friction,” of this book. 18.2.3 Interface Conditions (Friction and Heat Transfer) The friction and heat-transfer coefficient are not readily available in literature. The most...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420429
EISBN: 978-1-62708-310-2
... in the liquid: planar, cellular, or dendritic. As shown in Fig. B.1 , the type of growth is controlled by the manner in which heat is removed from the system. When the liquid ahead of the solid-liquid interface has a positive temperature gradient, heat is removed from the liquid by conduction through...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050139
EISBN: 978-1-62708-311-9
... for cooling from austenite. The very hot surface temperature of the workpiece vaporizes the quenchant, and a thin vapor pocket forms around the workpiece. Heat transfer occurs by radiation and conduction through the vapor blanket, which acts essentially as an insulating layer because of the relatively poor...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050025
EISBN: 978-1-62708-311-9
..., plugging, and reduced heat transfer. Professional help should be used for assistance in dealing with suspected biological problems. Dissolved solids: These are the most significant factor in cooling electrical equipment. Total dissolved solids directly affect the conductivity of the cooling water...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smfpa.t53500051
EISBN: 978-1-62708-317-1
... modulus ( E ), constant, GPa (10 6 psi) 100 (14.5) Poisson’s ratio ( v ), constant 0.3 Thermal expansion (α), constant, 10 –6 /K (10 –6 /°F) 13 (7.2) Heat conductivity ( k ), constant, W/m·K (Btu/h·ft·°F) 32 (18) Heat capacity ( c p ), constant, J/kgK 650 Initial sheet thickness ( t...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110285
EISBN: 978-1-62708-247-1
.... The first is good planarity and the second is a clean conductive surface for either the tungsten contacts or the copper metallization of the targeted metal layer. Good planarity is desired because it may be required to analyze multiple locations on the chip. An example is when a device has multiple SRAM...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2024
DOI: 10.31399/asm.tb.phtpp.t59380085
EISBN: 978-1-62708-456-7
... problems. In many instances (e.g., in mass-produced identical parts), the use of steels that respond to conventional heating and quenching may be more economical, depending on the service application. Also, in some instances, the depth of the hardened surface may be insufficient to withstand the service...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260119
EISBN: 978-1-62708-336-2
..., and the mold system, which means it is dependent on the heat transfer during solidification. In the Wagstaff AirSlip ( Ref 14 ) technology, lubricant and compressed gas exist between the mold wall and the solidified shell. The heat conduction through the mold wall decreases, and heat is extracted...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240095
EISBN: 978-1-62708-251-8
... the liquid ahead of the solid-liquid interface, x 0 , has a positive temperature gradient, heat is removed from the liquid by conduction through the growing solid. Since the temperature gradient is linear and uniform perpendicular to the interface, a smooth interface is maintained, and the growth is planar...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.t59340179
EISBN: 978-1-62708-427-7
... of tensile tests required. When used with eddy current testing of EC, mapping of hardness and conductivity ( Fig. 9.7b ) can be indicative of the extent of heat-treatment or quenching problems by detecting any soft areas on the product surface. Specifications such as Aerospace Materials Specification, AMS...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630237
EISBN: 978-1-62708-270-9
..., and combinations of these as modified by environment. Elevated-temperature problems are real concerns in industrial applications such as boilers, steam and gas turbine parts, containers in contact with molten metal, heat-treating furnaces and equipment, cement mills, incinerators, exhaust valves and manifolds...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 January 2023
DOI: 10.31399/asm.tb.itfdtktmse.9781627084406
EISBN: 978-1-62708-440-6
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2020
DOI: 10.31399/asm.tb.bpapp.t59290085
EISBN: 978-1-62708-319-5
... to reach steady-state homogeneity. As the scale of scrutiny increases, the average properties emerge, and the mixture moves from granular to homogeneous. In feedstock, average properties (such as density, strength, or thermal conductivity) are needed for computer simulations. For these properties...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220253
EISBN: 978-1-62708-341-6
... manufacturers. This chapter deals with materials handling and automation. First, it summarizes basic considerations such as generic system designs, fixture materials, and special electrical problems to be avoided. Next, it describes and provides examples of materials-handling systems in induction billet heating...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280079
EISBN: 978-1-62708-267-9
... of dissolution in an appropriate base (e.g., KOH) to clean passages or external surfaces with no metal deformation by mechanical processing. The shell must be strong enough to resist deformation but thin enough to let heat of solidification be transferred away by conduction and radiation. Mold design...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.t62860133
EISBN: 978-1-62708-348-5
... Abstract This chapter presents basic principles and the theoretical results of heat transport in solids. Thermal conductivity and thermal diffusivity are the principal properties discussed. Discussions are also included on the effects of temperature, magnetic field, and metallurgical variations...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220085
EISBN: 978-1-62708-341-6
..., frequencies as close as possible to the critical frequency should be selected. Lower frequencies lead to low heating efficiencies. Use of high frequencies is more expensive from an equipment standpoint and mandates the use of soaking time after the heating cycle to allow for heat conduction from the shallow...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2024
DOI: 10.31399/asm.tb.phtpp.t59380121
EISBN: 978-1-62708-456-7
..., the higher carbon content at the surface decreases the M s temperature. During quenching, the surface begins cooling, but because of the lower M s temperature, the surface does not begin to transform immediately. As heat flows out of the component by conduction, the temperature profile crosses the M s...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.tb.cub.t66910021
EISBN: 978-1-62708-250-1
... that resistivity and conductivity are inverse relationships; that is, higher resistivities are equivalent to lower conductivities. Electrical resistivities of metals Table 1 Electrical resistivities of metals Metal Temperature Resistivity, μΩ · cm °C °F Aluminum 20 70 2.828 100 212...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110545
EISBN: 978-1-62708-247-1
...] . Lock-in Thermal Imaging One fundamental problem with static infrared thermal imaging is thermal spreading. The heat generated from a localized hot spot will eventually reach thermal equilibrium with its environment to minimize temperature gradients. Therefore, when a bias is first applied...