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inverse analysis

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040083
EISBN: 978-1-62708-300-3
... Abstract This chapter discusses the role of inverse analysis in providing input data for finite element simulations of metal forming processes. It describes the basic procedures for determining flow stress and friction by inverse analysis and for comparing experimental measurements...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040237
EISBN: 978-1-62708-300-3
.... 18.1a ) and comparing the experimental data with FEM predictions, it is possible to obtain more reliable flow stress data at higher strain levels. This method, called the inverse analysis technique, has been used to simultaneously determine friction and stress/strain data using a ring test [ Altan et al...
Image
Published: 01 November 2019
Figure 46 SAM analysis showing four types of images acquired from a two-die stacked package and focused at the top die surface. (A) Peak amplitude image (B) Phase inversion image (C) Time of flight image (D) Transmission image. More
Image
Published: 01 January 2015
Fig. 5.29 Map of blocks, each with internal crystallographic misorientations of the martensitic crystals within the blocks of less than 10 degrees, in as-quenched low-carbon steel. Inverse pole figure map obtained from FE-SEM/EBSD analysis. Courtesy of Professor N. Tsuji, Kyoto University More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... Abstract Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... gate was positioned properly, whether the transducer had sufficient resolution to separate echoes of interest, whether a phase inversion truly occurs, and at what depth a feature occurs. A C-scan produces the PE-SAM images found most frequently in failure analysis reports. As shown in Fig. 4 , a C...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780057
EISBN: 978-1-62708-268-6
... Abstract Quantifying a fault-tree analysis is a useful tool for assessing the most likely causes of a system failure. This chapter addresses fault-tree analysis event probabilities and ranking of failure causes based on these probabilities. Failure rates, failure-rate sources, probability...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
... Abstract Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110285
EISBN: 978-1-62708-247-1
... on the surface of the die Focused Ion Beam (FIB) deposited tungsten microprobe pads on which to land microprobe needles. Microprobing was required in the failure analysis of defective semiconductor devices to access specific functional nodes in the device to track down and localize the point of functional signal...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.9781627083003
EISBN: 978-1-62708-300-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smfpa.t53500051
EISBN: 978-1-62708-317-1
... occur. A circular viscous pressure bulge test was developed by the Engineering Research Center at The Ohio State University to estimate the flow stress of the material in a biaxial state through inverse analysis. Using the bulge test would give more reliable stress-strain data that are applicable...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040295
EISBN: 978-1-62708-300-3
... is proportional to interface pressure, a material with a lower flow stress will produce less pressure at the die/workpiece interface and thus less die wear [ Dahl et al., 1998 ]. In addition, adhesive wear is inversely proportional to the workpiece material hardness. Therefore, a material with a high hardness...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630013
EISBN: 978-1-62708-270-9
... Abstract This chapter focuses on some of the facts of mechanical properties of metals that must be understood to successfully undertake the task of failure analysis. The discussion begins by describing the causes and effects of elastic and plastic deformation followed by a section describing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... This article discusses the state-of-the-art in commercially available Laser Voltage Probing (LVP) technology for the purpose of integrated-circuit failure analysis. An overview of LVP history, theory, system architecture, and application extensions will be reviewed. Current limitations and future work...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.tb.tm.t52320197
EISBN: 978-1-62708-357-7
.... Examples of ordering and phase separation due to ordering by the B-W-G model are described. The chapter includes an appendix covering the effect of phase separation inversion type. atomic ordering Bragg-Williams-Gorsky model copper-gold alloys copper-zinc alloys phase separation statistical...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720139
EISBN: 978-1-62708-305-8
...) and, in some cases, carbon and sulfur in metals. This chapter discusses the operating principles of XRF, OES, combustion and inert gas fusion analysis, surface analysis, and scanning auger microprobe analysis. The details of equipment set-up used for chemical composition analysis as well as the capabilities...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780105
EISBN: 978-1-62708-281-5
... of polymers are then provided. The article concludes with information on three distinctive, but complementary operations of thermoanalytical techniques, namely differential scanning calorimetry, thermogravimetric analysis, and thermomechanical testing. differential scanning calorimetry...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630257
EISBN: 978-1-62708-270-9
.... The chapter presents a case history that illustrates the use of fracture mechanics in failure analysis. An appendix provides a more detailed discussion of fracture mechanics concepts. crack propagation failure analysis fracture mechanics linear-elastic fracture mechanics plane strain plane stress...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.fdmht.t52060223
EISBN: 978-1-62708-343-0
.... A wide variety of fiber/matrix systems have been demonstrated with increased structural performance, which has, on occasion, sharply offset higher fabrication, evaluation, and structural analysis costs. Greatest successes have been achieved when the stress state is predominately for mechanical loading...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110545
EISBN: 978-1-62708-247-1
... Abstract Post-mortem analysis of photovoltaic modules that have degraded performance is essential for improving the long term durability of solar energy. This article focuses on a general procedure for analyzing a failed module. The procedure includes electrical characterization followed...