This chapter discusses the role of inverse analysis in providing input data for finite element simulations of metal forming processes. It describes the basic procedures for determining flow stress and friction by inverse analysis and for comparing experimental measurements with corresponding computed data. It also includes an example in which flow stress and friction were measured in compressed aluminum rings and the results used to verify the accuracy of predicted values.

This chapter discusses the use of finite-element methods for modeling cold forging processes. The discussion covers process modeling inputs, such as geometric parameters, material properties, and interface conditions, and includes several application examples.

Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field analysis have proven the validity of using MFI for 3D FI and 3D current mapping. This article briefly discusses the fundamentals of the technique, paying special attention to critical capabilities like sensitivity and resolution, limitations of the standard technique, sensor requirements and, in particular, the solution to the 3D problem, along with examples of its application to real failures in devices.

The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.

Quantifying a fault-tree analysis is a useful tool for assessing the most likely causes of a system failure. This chapter addresses fault-tree analysis event probabilities and ranking of failure causes based on these probabilities. Failure rates, failure-rate sources, probability determinations, mean times between failure, and related topics are also discussed. The discussion covers the practices observed in fault-tree analysis quantification and processes involved in calculating the probability of the top undesired event.

Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.

This article addresses the ancillary issues regarding the nanoprobing and characterization of transistors, probing copper metallization layers, and the various imaging techniques. The discussion includes several characterization examples of known transistor failure types, namely four probe transistor characterization, two probe transistor characterization, and probing and characterizing metallization issues. The imaging techniques discussed are those that are specific to atomic force nanoprober or scanning electron microscope based tools. They are current contrast imaging, scanning capacitance imaging, e-beam absorbed current imaging, e-beam induced current imaging, e-beam induced resistance change imaging, and active voltage contrast imaging.

This chapter addresses the issue of die failures in hot and cold forging operations. It describes failure classifications, fatigue fracture and wear mechanisms, analytical wear models, and the various factors that limit die life. It also includes several case studies in which finite-element modeling is used to predict die failure and extend die life.

This chapter discusses the use of modeling and simulation technology in the development of sheet metal forming processes. It describes the five major steps involved in finite-element analysis and the various ways functions of interest can be approximated at each point or node in a finite-element mesh. It explains how to obtain input data, what to expect in terms of output data, and how to predict specific types of defects. In addition, it presents several case studies demonstrating the use of finite elements in blanking and piercing, deep drawing of round and rectangular cups, progressive die sequencing, blank holder force optimization, sheet hydroforming, hot stamping, and springback and bending of advanced high-strength steels. It also discusses the factors that affect the accuracy of finite element simulations such as springback, thickness variations, and nonisothermal effects.

The overall chemical composition of metals and alloys is most commonly determined by x-ray fluorescence (XRF) and optical emission spectroscopy (OES). High-temperature combustion and inert gas fusion methods are typically used to analyze dissolved gases (oxygen, nitrogen, and hydrogen) and, in some cases, carbon and sulfur in metals. This chapter discusses the operating principles of XRF, OES, combustion and inert gas fusion analysis, surface analysis, and scanning auger microprobe analysis. The details of equipment set-up used for chemical composition analysis as well as the capabilities of related techniques of these methods are also covered.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.

This chapter focuses on some of the facts of mechanical properties of metals that must be understood to successfully undertake the task of failure analysis. The discussion begins by describing the causes and effects of elastic and plastic deformation followed by a section describing the effects of temperature variations on mechanical properties, both in tension and in compression. The nonlinear behavior of gray cast iron caused by the graphite flakes is then described. Finally, the effect of stress concentrations on high-strength metals is considered.

This article addresses some established protocols in characterizing thermoplastics, whether they are homogeneous resins, alloyed or blended compositions, or highly modified thermoplastic composites. It begins with a description of various approaches used for the determination of molecular weight (MW) by viscosity measurements. This is followed by a discussion of the use of cone and plate and parallel plate geometries in determining the viscoelastic properties of a polymer melt. Details on some of the chromatographic techniques that allow determination of MW and MW distribution of polymers are then provided. The article concludes with information on three distinctive, but complementary operations of thermoanalytical techniques, namely differential scanning calorimetry, thermogravimetric analysis, and thermomechanical testing.

This chapter covers the analytical methods developed to characterize ordering phenomena in crystal structures. The chapter gives examples of ordering phenomena and discusses models for long-range ordering, such as the Bragg-Williams-Gorsky (B-W-G) model, and for short-range ordering. Examples of ordering and phase separation due to ordering by the B-W-G model are described. The chapter includes an appendix covering the effect of phase separation inversion type.

Fracture mechanics is a well-developed quantitative approach to the study of failures. This chapter discusses fracture toughness and fracture mechanics, linear-elastic fracture mechanics, and modes of loading. The discussion also covers plane strain and stress and crack growth kinetics. The chapter presents a case history that illustrates the use of fracture mechanics in failure analysis. An appendix provides a more detailed discussion of fracture mechanics concepts.

The orientation of the devices within a package determine the best chosen approach for access to a select component embedded in epoxy both in package or System in Package and multi-chip module (MCM). This article assists the analyst in making decisions on frontside access using flat lapping, chemical decapsulation, laser ablation, plasma reactive ion etching (RIE), CNC based milling and polishing, or a combination of these coupled with optical or electrical endpoint means. This article discusses the general characteristics, advantages, and disadvantages of each of these techniques. It also presents a case study illustrating the application of CNC milling to isolate MCM leakage failure.

In this overview of diagnosis of scan logic and diagnosis driven failure analysis, the authors explore the world of diagnosis of digital semiconductors devices. After shortly outlining the technology behind diagnosis, the main part of this article describes key improvements to the basic diagnosis tools, discussing their merits for the failure analysis engineer. The article also describes the various requirements and other considerations that typically need to be taken into account to set up a full working scan diagnosis system. It summarizes the principles of design with embedded compression technologies. Finally, several successful industrial applications of diagnosis are presented.