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Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040083
EISBN: 978-1-62708-300-3
... Abstract This chapter discusses the role of inverse analysis in providing input data for finite element simulations of metal forming processes. It describes the basic procedures for determining flow stress and friction by inverse analysis and for comparing experimental measurements...
Abstract
This chapter discusses the role of inverse analysis in providing input data for finite element simulations of metal forming processes. It describes the basic procedures for determining flow stress and friction by inverse analysis and for comparing experimental measurements with corresponding computed data. It also includes an example in which flow stress and friction were measured in compressed aluminum rings and the results used to verify the accuracy of predicted values.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040237
EISBN: 978-1-62708-300-3
.... 18.1a ) and comparing the experimental data with FEM predictions, it is possible to obtain more reliable flow stress data at higher strain levels. This method, called the inverse analysis technique, has been used to simultaneously determine friction and stress/strain data using a ring test [ Altan et al...
Abstract
This chapter discusses the use of finite-element methods for modeling cold forging processes. The discussion covers process modeling inputs, such as geometric parameters, material properties, and interface conditions, and includes several application examples.
Image
in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 46 SAM analysis showing four types of images acquired from a two-die stacked package and focused at the top die surface. (A) Peak amplitude image (B) Phase inversion image (C) Time of flight image (D) Transmission image.
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Image
Published: 01 January 2015
Fig. 5.29 Map of blocks, each with internal crystallographic misorientations of the martensitic crystals within the blocks of less than 10 degrees, in as-quenched low-carbon steel. Inverse pole figure map obtained from FE-SEM/EBSD analysis. Courtesy of Professor N. Tsuji, Kyoto University
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... Abstract Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field...
Abstract
Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field analysis have proven the validity of using MFI for 3D FI and 3D current mapping. This article briefly discusses the fundamentals of the technique, paying special attention to critical capabilities like sensitivity and resolution, limitations of the standard technique, sensor requirements and, in particular, the solution to the 3D problem, along with examples of its application to real failures in devices.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... gate was positioned properly, whether the transducer had sufficient resolution to separate echoes of interest, whether a phase inversion truly occurs, and at what depth a feature occurs. A C-scan produces the PE-SAM images found most frequently in failure analysis reports. As shown in Fig. 4 , a C...
Abstract
The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780057
EISBN: 978-1-62708-268-6
... Abstract Quantifying a fault-tree analysis is a useful tool for assessing the most likely causes of a system failure. This chapter addresses fault-tree analysis event probabilities and ranking of failure causes based on these probabilities. Failure rates, failure-rate sources, probability...
Abstract
Quantifying a fault-tree analysis is a useful tool for assessing the most likely causes of a system failure. This chapter addresses fault-tree analysis event probabilities and ranking of failure causes based on these probabilities. Failure rates, failure-rate sources, probability determinations, mean times between failure, and related topics are also discussed. The discussion covers the practices observed in fault-tree analysis quantification and processes involved in calculating the probability of the top undesired event.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
... Abstract Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior...
Abstract
Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110285
EISBN: 978-1-62708-247-1
... on the surface of the die Focused Ion Beam (FIB) deposited tungsten microprobe pads on which to land microprobe needles. Microprobing was required in the failure analysis of defective semiconductor devices to access specific functional nodes in the device to track down and localize the point of functional signal...
Abstract
This article addresses the ancillary issues regarding the nanoprobing and characterization of transistors, probing copper metallization layers, and the various imaging techniques. The discussion includes several characterization examples of known transistor failure types, namely four probe transistor characterization, two probe transistor characterization, and probing and characterizing metallization issues. The imaging techniques discussed are those that are specific to atomic force nanoprober or scanning electron microscope based tools. They are current contrast imaging, scanning capacitance imaging, e-beam absorbed current imaging, e-beam induced current imaging, e-beam induced resistance change imaging, and active voltage contrast imaging.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.9781627083003
EISBN: 978-1-62708-300-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smfpa.t53500051
EISBN: 978-1-62708-317-1
... occur. A circular viscous pressure bulge test was developed by the Engineering Research Center at The Ohio State University to estimate the flow stress of the material in a biaxial state through inverse analysis. Using the bulge test would give more reliable stress-strain data that are applicable...
Abstract
This chapter discusses the use of modeling and simulation technology in the development of sheet metal forming processes. It describes the five major steps involved in finite-element analysis and the various ways functions of interest can be approximated at each point or node in a finite-element mesh. It explains how to obtain input data, what to expect in terms of output data, and how to predict specific types of defects. In addition, it presents several case studies demonstrating the use of finite elements in blanking and piercing, deep drawing of round and rectangular cups, progressive die sequencing, blank holder force optimization, sheet hydroforming, hot stamping, and springback and bending of advanced high-strength steels. It also discusses the factors that affect the accuracy of finite element simulations such as springback, thickness variations, and nonisothermal effects.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040295
EISBN: 978-1-62708-300-3
... is proportional to interface pressure, a material with a lower flow stress will produce less pressure at the die/workpiece interface and thus less die wear [ Dahl et al., 1998 ]. In addition, adhesive wear is inversely proportional to the workpiece material hardness. Therefore, a material with a high hardness...
Abstract
This chapter addresses the issue of die failures in hot and cold forging operations. It describes failure classifications, fatigue fracture and wear mechanisms, analytical wear models, and the various factors that limit die life. It also includes several case studies in which finite-element modeling is used to predict die failure and extend die life.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.tb.tm.t52320197
EISBN: 978-1-62708-357-7
.... Examples of ordering and phase separation due to ordering by the B-W-G model are described. The chapter includes an appendix covering the effect of phase separation inversion type. atomic ordering Bragg-Williams-Gorsky model copper-gold alloys copper-zinc alloys phase separation statistical...
Abstract
This chapter covers the analytical methods developed to characterize ordering phenomena in crystal structures. The chapter gives examples of ordering phenomena and discusses models for long-range ordering, such as the Bragg-Williams-Gorsky (B-W-G) model, and for short-range ordering. Examples of ordering and phase separation due to ordering by the B-W-G model are described. The chapter includes an appendix covering the effect of phase separation inversion type.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630013
EISBN: 978-1-62708-270-9
... Abstract This chapter focuses on some of the facts of mechanical properties of metals that must be understood to successfully undertake the task of failure analysis. The discussion begins by describing the causes and effects of elastic and plastic deformation followed by a section describing...
Abstract
This chapter focuses on some of the facts of mechanical properties of metals that must be understood to successfully undertake the task of failure analysis. The discussion begins by describing the causes and effects of elastic and plastic deformation followed by a section describing the effects of temperature variations on mechanical properties, both in tension and in compression. The nonlinear behavior of gray cast iron caused by the graphite flakes is then described. Finally, the effect of stress concentrations on high-strength metals is considered.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... This article discusses the state-of-the-art in commercially available Laser Voltage Probing (LVP) technology for the purpose of integrated-circuit failure analysis. An overview of LVP history, theory, system architecture, and application extensions will be reviewed. Current limitations and future work...
Abstract
Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720139
EISBN: 978-1-62708-305-8
...) and, in some cases, carbon and sulfur in metals. This chapter discusses the operating principles of XRF, OES, combustion and inert gas fusion analysis, surface analysis, and scanning auger microprobe analysis. The details of equipment set-up used for chemical composition analysis as well as the capabilities...
Abstract
The overall chemical composition of metals and alloys is most commonly determined by x-ray fluorescence (XRF) and optical emission spectroscopy (OES). High-temperature combustion and inert gas fusion methods are typically used to analyze dissolved gases (oxygen, nitrogen, and hydrogen) and, in some cases, carbon and sulfur in metals. This chapter discusses the operating principles of XRF, OES, combustion and inert gas fusion analysis, surface analysis, and scanning auger microprobe analysis. The details of equipment set-up used for chemical composition analysis as well as the capabilities of related techniques of these methods are also covered.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780105
EISBN: 978-1-62708-281-5
... of polymers are then provided. The article concludes with information on three distinctive, but complementary operations of thermoanalytical techniques, namely differential scanning calorimetry, thermogravimetric analysis, and thermomechanical testing. differential scanning calorimetry...
Abstract
This article addresses some established protocols in characterizing thermoplastics, whether they are homogeneous resins, alloyed or blended compositions, or highly modified thermoplastic composites. It begins with a description of various approaches used for the determination of molecular weight (MW) by viscosity measurements. This is followed by a discussion of the use of cone and plate and parallel plate geometries in determining the viscoelastic properties of a polymer melt. Details on some of the chromatographic techniques that allow determination of MW and MW distribution of polymers are then provided. The article concludes with information on three distinctive, but complementary operations of thermoanalytical techniques, namely differential scanning calorimetry, thermogravimetric analysis, and thermomechanical testing.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630257
EISBN: 978-1-62708-270-9
.... The chapter presents a case history that illustrates the use of fracture mechanics in failure analysis. An appendix provides a more detailed discussion of fracture mechanics concepts. crack propagation failure analysis fracture mechanics linear-elastic fracture mechanics plane strain plane stress...
Abstract
Fracture mechanics is a well-developed quantitative approach to the study of failures. This chapter discusses fracture toughness and fracture mechanics, linear-elastic fracture mechanics, and modes of loading. The discussion also covers plane strain and stress and crack growth kinetics. The chapter presents a case history that illustrates the use of fracture mechanics in failure analysis. An appendix provides a more detailed discussion of fracture mechanics concepts.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.fdmht.t52060223
EISBN: 978-1-62708-343-0
.... A wide variety of fiber/matrix systems have been demonstrated with increased structural performance, which has, on occasion, sharply offset higher fabrication, evaluation, and structural analysis costs. Greatest successes have been achieved when the stress state is predominately for mechanical loading...
Abstract
Fiber-reinforced metal-matrix composites have carved out a niche in applications requiring high strength to weight ratios, but they are susceptible to failure when exposed to high temperatures and cyclic loads. This chapter discusses the obstacles that must be overcome to improve the creep-fatigue behavior of these otherwise promising materials. It addresses six areas that have been the focus of intense research, including thermal-expansion and elastic-viscoplastic mismatch, thermally induced biaxiality and interply stresses, creep and cyclic relaxation of residual stresses, and enhanced interfaces for oxidation.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110545
EISBN: 978-1-62708-247-1
... Abstract Post-mortem analysis of photovoltaic modules that have degraded performance is essential for improving the long term durability of solar energy. This article focuses on a general procedure for analyzing a failed module. The procedure includes electrical characterization followed...
Abstract
Post-mortem analysis of photovoltaic modules that have degraded performance is essential for improving the long term durability of solar energy. This article focuses on a general procedure for analyzing a failed module. The procedure includes electrical characterization followed by thermal imaging such as forward bias, reverse bias, and lock-in, and emission imaging such as electroluminescence and photoluminescence imaging.
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