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infrared soldering

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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... or bit Flame or torch soldering Hot dip soldering Induction soldering Resistance soldering Furnace soldering Infrared soldering Ultrasonic soldering Wave soldering Laser soldering Hot gas soldering Vapor-phase soldering The proper application of heat is of paramount...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110545
EISBN: 978-1-62708-247-1
... circuit loading or with an external power supply and minimal illumination. Poor solder contacts will have a higher than normal resistance and will exhibit joule heating as illustrated in the thermal image in Figure 3 . Bright spots correspond to high infrared emission due to heating. A poor solder...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... has a similar shoulder peak to the bare substrate unit indicating the location of open to be in the solder bump. Figure 4 3D X-Ray tomography of the failing solder bump interface. Missing solder observed between the interposer and the laminate at the fail location. Figure 6...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... contaminant to be Tin Figure 12 Scanning electron micrograph of a cracked solder bump; ion beam milling was used to clean up the smear caused by manual cross sectioning and reveal the details of the failure. This device was subject to a temperature cycle stress. Figure 1 Red circle...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... Tools/Equipment: XRF, environmental scanning electron microscope (E-SEM), energy dispersive spectroscopy (EDS), differential scanning calorimetry (DSC), thermomechanical analyzer (TMA), thermomechanical analyzer (TMA), dynamic mechanical analyzer (DMA), hardness testers, Fourier transform infrared...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220281
EISBN: 978-1-62708-341-6
... of semiconductors. From S. Berkman, V. S. Ban, and N. Goldsmith, Heteroepitaxial Semiconductors for Electronic Devices , G. W. Cullen and C. C. Wang, eds., Springer-Verlag, New York, 1978, p 264 ( Ref 2 ) Fig. 11.20 Hermetic solder sealing of electronic case assemblies Source: Lepel Corp. Fig...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
...Abstract Abstract This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders. This is followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240597
EISBN: 978-1-62708-251-8
... in nuclear reactors. Beryllium is an extremely lightweight metal that, as a result of its high specific modulus, is used in high-value aerospace structures. Lead and tin form the most widely used solders, and lead is the most important of the battery materials. Gold, silver, and the platinum group are all...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
..., interference fits, poor welds or solder joints, porosity, cuts, scrapes, witness marks, and other conditions. In many cases, hypothesized failure causes may be visible to the naked eye. In these situations, a simple visual examination can reveal the presence of cracks, mechanical disconnects or disbonds...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060117
EISBN: 978-1-62708-261-7
..., plasma, laser, electron beam Furnace, induction, flame, infrared, chemical reaction, flame Soldering iron, ultrasonic, infrared, flame, resistance, oven Furnace, resistance, pressure deformation, exploration, friction, flame Chemical reaction, oven, or not applicable Usually not required Typical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290001
EISBN: 978-1-62708-306-5
... Resistance welding Flash welding Oxyfuel welding Diffusion welding Friction welding Electron beam welding Laser beam welding Torch brazing Furnace brazing Induction brazing Resistance brazing Dip brazing Infrared brazing Diffusion brazing Soldering Carbon steel...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230401
EISBN: 978-1-62708-298-3
...Abstract Abstract Beryllium has been successfully joined by fusion welding, brazing, solid-state bonding, and soldering. This chapter describes these processes in detail along with their advantages and disadvantages. It also addresses application considerations such as surface preparation...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... in the area, it is an indication that the bond area was contaminated. The failure analysis team can also use Fourier transform infrared (FTIR) spectroscopy (as outlined in Chapter 11 ) to assess if contaminants were present. FTIR is commonly used for this purpose, and it is particularly well suited...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780383
EISBN: 978-1-62708-281-5
...-of-flight secondary ion mass spectrometry; FTIR, Fourier transform infrared (spectroscopy) Comparison summary of scanning electron beam instruments equipped with secondary electron and x-ray detectors Table 2 Comparison summary of scanning electron beam instruments equipped with secondary electron...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870191
EISBN: 978-1-62708-299-0
... a magnetic probe to scan surface Detects surface defects, such as pits and cracks, with basic instrumentation of only moderate cost. Frequent Infrared imaging (thermography) Spot surface temperatures or surface temperature pattern as indicator of physical state of object Used most effectively...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060315
EISBN: 978-1-62708-261-7
... (Ga) Germanium (Ge) Uranium (U) Vanadium (V) Magnetic Alloys Electrical Contact Materials Thermocouple Materials Low-Expansion Alloys Shape Memory Alloys Fusible Alloys Alloys of Lead Forms of Lead Terneplate Solders Organ Pipes Pewter Bearing Materials...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... circular features corresponds to the solder bump locations of the die [13] . Figure 40 Image at ambient showing typical convex warp curvature in the mirrored surface of the silicon die. Figure 41 Image at 110 °C at which the surface is flat. Increasing the temperature further...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870183
EISBN: 978-1-62708-314-0
... Consolidation of melt-fusible thermoplastics consists of heating, consolidation, and cooling, as depicted schematically in Fig. 6.1 . As with thermoset composites, the main processing variables are time ( t ), temperature ( T ), and pressure ( P ). Heating can be accomplished with infrared heaters, convection...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050025
EISBN: 978-1-62708-311-9
... A. , Rodriquez C. , Warner G. , and Williams T. , Power Supplies for Induction Heat Treating, Brazing, and Soldering , Induction Heating and Heat Treatment , Vol 4C , ASM Handbook , ASM International , 2014 , p 578 – 588 10.31399/asm.hb.v04c.a0005838 7. Specht F. , Water...