The temperature and atmosphere conditions must be precisely controlled in order to achieve the desired metallurgical results during heat treating operations. In order to ensure the repeatability of operation, a heat treating system must have the necessary sensors, timers, and variable (temperature, atmosphere, etc.) controllers to hold the process within prescribed or specified limits. This chapter discusses temperature and atmosphere sensors used in a heat treating system. The temperature sensors covered are contact and noncontact types. The atmosphere sensors covered are oxygen probe, dew point, and infrared. The chapter concludes with an overview of the development of integrated control systems.

This chapter focuses on what can cause a system to fail and addresses the challenge in approaching a system failure. It then examines the steps involved in the four-step problem-solving process: defining the problem, identifying all potential failure causes and evaluating the likelihood of each, identifying the potential solutions, and identifying the best solution. The chapter concludes by describing the responsibilities of a failure analysis team.

This chapter discusses the types of sensors used in sheet forming operations and the information they provide. It explains how force sensors protect equipment from overloads due to tool wear, friction, and misfeeds, how displacement and proximity sensors help to prevent die crashes, how acoustic emission, ultrasonic, and eddy current sensors detect tool breakage and part defects such as cracks, and how roller ball and optical sensors measure material flow. It also discusses the role of draw-in, wrinkle, oil-monitoring, and vision sensors and explains how material properties can be derived in real time from various sensor outputs.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

Many defects generate excessive heat during operation; this is due to the power dissipation associated with the excess current flow at the defect site. There are several thermal detection techniques for failure analysis and this article focuses on infrared thermography with lock-in detection, which detects an object's temperature from its infrared emission based on blackbody radiation physics. The basic principles and the interpretation of the results are reviewed. Some typical results and a series of examples illustrating the application of this technique are also shown. Brief sections are devoted to the discussion on liquid-crystal imaging and fluorescent microthermal imaging technique for thermal detection.

This chapter discusses the selection, use, and integration of methods to control process variables in induction heating, including control of workpiece and processing temperature and materials handling systems. The discussion of temperature control includes a review of proportional controllers and heat-regulating devices. Integration of control functions is illustrated with examples related to heating of steel slabs, surface hardening of steel parts, vacuum induction melting for casting operations, and process optimization for electric-demand control. Distributed control within larger manufacturing systems is discussed. The chapter also covers nondestructive techniques for process control and methods for process simulation.

Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field analysis have proven the validity of using MFI for 3D FI and 3D current mapping. This article briefly discusses the fundamentals of the technique, paying special attention to critical capabilities like sensitivity and resolution, limitations of the standard technique, sensor requirements and, in particular, the solution to the 3D problem, along with examples of its application to real failures in devices.

This article introduces procedures an engineer or materials scientist can use to investigate failures. It provides a brief survey of polymer systems and key properties that need to be measured during failure analysis. The article begins with an overview of the problem-solving approach pertinent to structure analysis. This is followed by a review of the characterization of plastics by infrared and nuclear magnetic resonance spectroscopy. The article then provides information on the distribution of molecular weight of an engineering plastic. It further discusses the methods used in thermal analysis, namely differential thermal analysis, thermogravimetric analysis, thermal-mechanical analysis, and dynamic mechanical analysis. The following sections provide details on X-ray diffraction for analyzing crystalline phases and on a minimal scheme for polymer analysis and characterization to assist the design engineer. The article ends with a discussion on the thermal-analytical scheme for analyzing the milligram quantities of polymer samples.

Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing, image analysis, and image interpretation. Details of the processes involved, equipment used, and the factors to be considered are also presented. In addition, the applications of machine vision are discussed.

The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.

This chapter presents a step-by-step approach for analyzing the causes of nonconforming workpieces and determining potential solutions. The discussion covers a wide range of issues, including testing errors, latent and process-related defects, examination and testing techniques, defect characterization, and effective remedial actions.

This chapter provides an overview of the thermodynamics of extrusion. It begins by presenting a thermodynamic model of the extrusion process expressed in the form of finite difference equations. It then explains how the model accounts for multiple sources of heat generation, the influence of principal variables on temperature rise, and different types of temperature measurements. It also discusses the benefits of isothermal extrusion and how it achieves consistent mechanical properties in extruded components.

This chapter discusses the basic components in an induction heat treating system. It describes the design and operating characteristics of power supplies, load-matching transformers, tuning capacitors, power regulators, controllers, process monitors, and diagnostic systems. It also provides information on fixtures and work-handling devices, quench systems, and load matching and tuning procedures.

This chapter discusses some important factors involved in the atmospheric corrosion of engineering materials. The discussion begins with a description of elements necessary for the operation of a galvanic corrosion cell and corrosion reactions, followed by the types of atmospheric corrosion attack. Some of the atmospheric parameters and their effects on the corrosion of several metals are then reviewed. The following sections provide information on air chemistry, principal pollutants inducing corrosion, thermodynamics as well as models for prediction of atmospheric corrosion, and use of Pourbaix diagrams. The phenomenon of precipitation runoff on the corroded metal surface is then discussed. The chapter also describes the role of microbes or bacteria in the corrosion of metals. It concludes by providing information on the trends in atmospheric corrosion research and methods.

Most iron and steel castings are produced by casting into sand molds. Sand cores are needed primarily to form hollow cavities in castings for collapsibility and ease of cleaning. This chapter begins with an overview of the classification of molding and core-making systems. This is followed by a section discussing the process involved in shell molding, along with its applications. A brief description of the special casting processes is then presented. Next, the chapter discusses the processes involved in core making. Further, it provides an overview of casting manufacturing. Finally, the chapter provides information on the factors that influence a casting facility layout.

This chapter discusses corrosion prevention methods used with aluminum and its alloys. The methods range from relatively straightforward measures, such as proper handling and storage, to advanced early warning corrosion monitoring systems for military aircraft. The chapter summarizes the basic factors that influence design for corrosion resistance and discusses the use of conversion coatings, organic coatings, porcelain enameling, and electroplating. It also discusses corrosion monitoring methods used in chemical processing and refining industries.