This chapter focuses on the transfer of energy between the power supply and the induction heating coil. The most efficient transfer requires that the induction heated load and coil be matched to the power supply and that the electrical circuit containing these elements be properly tuned. The chapter describes these procedures, including the processes involved in tuning induction heating circuits and load matching, impedance matching by means of a transformer, and tuning used for specific types of power supplies.

Besides the induction coil and workpiece, the induction generator (source of ac power) is probably the most important component of an overall induction heating system. Such equipment is typically rated in terms of its frequency and maximum output power (in kilowatts). This chapter addresses the selection of power supplies in terms of these two factors as well as the operational features of different types of sources. The six different types of power supplies for induction heating applications covered in this chapter are line-frequency supplies, frequency multipliers, motor-generators, solid-state (static) inverters, spark-gap converters, and radio-frequency power supplies. The chapter discusses the design and characteristics of each of the various types of power supplies.

This chapter discusses the basic components in an induction heat treating system. It describes the design and operating characteristics of power supplies, load-matching transformers, tuning capacitors, power regulators, controllers, process monitors, and diagnostic systems. It also provides information on fixtures and work-handling devices, quench systems, and load matching and tuning procedures.

This chapter discusses the processes involved in heat treating of stainless steels, providing information on the classification, chemical compositions, and corrosion resistance of stainless steels. Five groups of stainless steels are discussed: austenitic, ferritic, martensitic, precipitation-hardening, and duplex grades. The chapter also describes the heat treatment conditions that should be followed for processing of stainless steels.

To a large extent, the induction coil and its coupling to the workpiece determine the precise heating pattern that is developed. However, it is often desirable to modify this pattern in order to produce a special heating distribution or to increase energy efficiency. At other times, the high heating rates of induction are needed for processing nonconductors. This chapter describes broad methods of accomplishing such objectives: modification of the field of magnetic induction, use of devices to prevent auxiliary equipment or certain portions of a workpiece from being heated, and techniques to apply heating to electrically nonconductive materials. These methods make use of devices such as flux concentrators, shields, and susceptors. The chapter provides a description of the materials for these devices and guidelines for their application.

Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.

In a perfect crystalline structure, there is an orderly repetition of the lattice in every direction in space. Real crystals contain a considerable number of imperfections, or defects, that affect their physical, chemical, mechanical, and electronic properties. Defects play an important role in processes such as deformation, annealing, precipitation, diffusion, and sintering. All defects and imperfections can be conveniently classified under four main divisions: point defects, line defects, planar defects, and volume defects. This chapter provides a detailed discussion on the causes, nature, and impact of these defects in metals. It also describes the mechanisms that cause plastic deformation in metals.

This chapter discusses the basic principles of precipitation hardening, an important strengthening mechanism in nonferrous alloys as well as stainless steel. It begins with a detailed review of the theory of precipitation hardening, then describes its application to aluminum alloys and nickel-base superalloys.

Ultrasonic inspection is a nondestructive method in which beams of high frequency acoustic energy are introduced into a material to detect surface and subsurface flaws, to measure the thickness of the material, and to measure the distance to a flaw. This chapter begins with an overview of ultrasonic flaw detectors, ultrasonic transducers, and search units and couplants. It then discusses the principles of operation, presentation, and interpretation of data of pulse echo and transmission methods. This is followed by sections providing information on general characteristics of ultrasonic waves and the factors influencing ultrasonic inspection. The advantages, disadvantages, and applications of ultrasonic inspection are finally compared with other methods of nondestructive inspection of metal parts.

The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.

This chapter discusses the selection, use, and integration of methods to control process variables in induction heating, including control of workpiece and processing temperature and materials handling systems. The discussion of temperature control includes a review of proportional controllers and heat-regulating devices. Integration of control functions is illustrated with examples related to heating of steel slabs, surface hardening of steel parts, vacuum induction melting for casting operations, and process optimization for electric-demand control. Distributed control within larger manufacturing systems is discussed. The chapter also covers nondestructive techniques for process control and methods for process simulation.

Stainless steel base metals and the welding filler metals used with them are chosen on the basis of suitable corrosion resistance for the intended application. This article describes several constitution diagrams that that have been developed to predict microstructures and properties. This is followed by discussions of weldability, cracking, and the engineering properties of stainless steel welds, namely martensitic stainless steels, ferritic stainless steel welds, austenitic stainless steels, and duplex stainless steels.

Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.

Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small details. It begins with the basic microscope column and construction. The article discusses microscope adjustments, brightfield and darkfield illumination, and microscope concepts important to liquid crystal techniques. It also discusses solid immersion lenses, infrared and ultraviolet microscopy and concludes with laser microscopy techniques such as thermal induced voltage alteration and external induced voltage alteration.

Coil design for induction heating has been developed and refined over time based on the theoretical principles applied in practice to several simple inductor geometries such as the classical solenoidal coil. This chapter reviews the fundamental considerations in the design of inductors and describes some of the most widely used coils and common design modifications. Specialty coil designs for specific applications are also discussed. The chapter concludes with sections devoted to coil fabrication and design of power-supply leads.

This chapter discusses thermoplastic composite fabrication processes and related equipment and procedures. The discussion covers consolidation and thermoforming operations as well as joining methods.

The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.