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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... of packaging failure analysis with 2D projection type x-ray imaging system. Images provided by Phoenix |x-ray, a division of GE Sensing and Inspection Technology. Figure 6 Live overlay of CAD design in the X-ray image. Missing heel fillet and complete missing solder can be identified at two gullwing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... Figure 1 Trend overview for semiconductor packaging integration on board and system level. [2] Figure 2 Failure Analysis flow chart for advanced board level analysis using non-destructive testing methods. [5] Figure 4 Thermal imaging on board level illustrating...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400109
EISBN: 978-1-62708-258-7
... microscope is a remarkably versatile instrument, and the more the metallographer knows about the microscope illumination system, the more tools that become available to achieve the perfect image. Not only can the metallographer magnify the image of the microstructure to 1000× and beyond, but the image can...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720063
EISBN: 978-1-62708-305-8
...Abstract Abstract Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations...
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.t56000001
EISBN: 978-1-62708-292-1
..., and provides information on imaging modes, detector positioning and alignment, and the effect of contrast reversal. It also discusses beam convergence and angular selectivity, the use of application-specific masks, and how to generate grain orientation maps for different material systems. diffraction...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2016
DOI: 10.31399/asm.tb.ascaam.t59190035
EISBN: 978-1-62708-296-9
... Al 7 Cr, Al 13 Cr 2 , θ 4 , 5 , 7 , 8 θ Cr Al 3 Cr, ν ν Cr Al 9 Cr 4 , αAl 9 Cr 4 , βAl 9 Cr 4 , γAl 9 Cr 4 α Cr , β Cr , γ Cr Al 8 Cr 5 , αAl 8 Cr 5 , βAl 8 Cr 5 8 , 10 , 11 … Characteristics of the crystal lattice of intermetallic phases in the Al-Cr system...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110209
EISBN: 978-1-62708-247-1
... are sensitive over the range of 8 µm to 12 µm. Both detectors offer similar temperature sensitivities and ranges, but InSb operates at shorter wavelengths and should have somewhat better spatial resolution. IR thermal imaging systems have excellent potential for temperature resolution but they suffer from...
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.9781627082921
EISBN: 978-1-62708-292-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... for current imaging systems which are inter-linked: The main advantage of magnetic imaging is that is a fully non-destructive, non-invasive, contactless technique. In addition, magnetic signals generated by the current in the device under test pass unaffected by virtually all materials used in modern...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... silicon from a conventional sample. An example is shown in Figure 25 . The resolution of the SEM used is about 1nm and orders of magnitude better than commonly used optical systems for chip debug and fault isolation. The comparison of an SEM image with an image from a state-of-the art optical system...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720233
EISBN: 978-1-62708-305-8
... by structure visibility, resolution, variable radiographic magnification, and optical distortions Excellent; affected by resolution, enhanced by low contrast detectability Source: (a) General characteristics of real-time radiography with fluorescent screen-TV camera system or an image intensifier...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Versa – Your 3D Submicron Imaging System with Breakthrough Flexibility,” 2018. [Online]. Available: https://www.zeiss.com/microscopy/us/products/x-ray-microscopy/zeiss-xradia-510-versa.html . [Accessed 29 November 2018]. Introduction Packaging FA Workflow Fault Isolation Techniques Non...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... background from inelastically scattered electrons. The contrast in thick samples can be significantly enhanced in a zero-loss image (as is demonstrated in Figures 31 and 32 ). STEM-EELS is a technique in which transmitted electrons are collected by the EELS spectrometer. The EELS system processes...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... Figure 1 Typical SPM configuration showing the basic elements and reference axes. Figure 2 Scanning electron microscope (SEM) images of a typical single crystal silicon SPM probe. Figure 5 AFM configuration with a laser/photodetector detection system. (Image courtesy...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.9781627082587
EISBN: 978-1-62708-258-7
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720293
EISBN: 978-1-62708-305-8
... to computer-assisted image processing systems. With the development of high sensitivity cameras having exposure times of 1/1000 s, components can be inspected on moving belts. Flexibility for examining three-dimensional components can be achieved with an array of cameras multiplexed to a common image...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110219
EISBN: 978-1-62708-247-1
..., and a multi-sine signal containing energy at the frequencies 7 Hz, 24 Hz, 40 Hz, 58 Hz and 81 Hz. The results show excellent agreement confirming the theoretical considerations above. Current LIT systems are based on direct thermal imaging techniques in combination with a two-phase, lock-in amplification...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2020
DOI: 10.31399/asm.tb.bpapp.t59290169
EISBN: 978-1-62708-319-5
.... Dimensional change is measured by using micrometers, calipers, video imaging systems, or coordinate-measuring machines. These measurements are usually accurate to ±0.01% of the true size. Shrinkage and density measurements during sintering are made by using a recording dilatometer, with similar accuracy...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
... and subassemblies from the failed system. There are numerous techniques and technologies available for examining and analyzing components and subassemblies, which are categorized as follows: optical approaches, dimensional inspection and related approaches, nondestructive test approaches, mechanical...