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Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.t56000001
EISBN: 978-1-62708-292-1
... Abstract This chapter discusses the principles of scanning transmission electron microscopy (STEM) as implemented using conventional scanning electron microscopes (SEMs). It describes the pros and cons of low-energy imaging and diffraction, addresses basic hardware requirements, and provides...
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.t56000020
EISBN: 978-1-62708-292-1
... it is directed by the user to either a CMOS sensor (to record diffraction patterns) or a photomultiplier tube (to observe real-space images). The chapter discusses some of the nuances of digital imaging and diffraction and includes examples in which transmission electron detectors are used to analyze gold films...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... Abstract X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... Abstract Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field...
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Published: 01 November 2019
Figure 3 Demonstration of magnetic current imaging on PCB level. The method allows the tracing of the current across the board and several components [7] . In the picture a sub-surface short at the top end is visualized where the current dissipates into the ground plane. More
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Published: 01 November 2019
Figure 4 Thermal imaging on board level illustrating the individual hot spot areas during operation [11] . More
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Published: 01 November 2019
Figure 7 Magnetic current imaging illustrates the current flow within the net list (left) and pin point the location of the electrical short within the circuit path. NIR imaging at different magnification confirm the root cause due to extra pattern (right) [22]. More
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Published: 01 November 2019
Figure 10 Thermal imaging (left) and 2D X-Ray microscopy (right) at high magnification further isolate the defect area to a single capacitor unit and show a fine crack within the bulk material. More
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Published: 01 April 2004
Fig. 5.11 (a) Semiconductor component of a pixelated imaging device. (b) Close-up view of a single solder ball. The imaging device utilizes a 16 by 128 array of 33 μm (1.3 mil) diameter solder bumps for the interconnects. Each pixel is connected to its own amplifier and processing circuitry More
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Published: 01 August 2018
Fig. 12.21 EBSD orientation map (orientation imaging microscopy, or OIM: for a good tutorial see Ref 16 ) of the extra low carbon steel in Fig. 12.16 annealed at 540 °C (1000 °F). (a) Orientation map, reproduced in grayscale. (Generally orientation maps are done in color, so More
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Published: 01 December 2015
Fig. 3 Components of a real-time radiographic imaging profiler system for measuring pipe wall thicknesses. The monitor displays the signal pulse readout. Source: Ref 27 More
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Published: 01 November 2023
Fig. 19 Bump crack imaging at 0.7 μm/voxel. Copyright 2022 IEEE ( Ref 11 ) More
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Published: 01 November 2023
Fig. 22 Ptychographic laminography imaging of a 22 nm chip. Copyright IEEE ( Ref 14 ) More
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Published: 01 November 2023
Fig. 24 GMR used for high-resolution current imaging ( Ref 16 ). Source: IMAPS More
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Published: 01 November 2019
Figure 18 Schematics of an acoustic lens imaging through opaque materials. More
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Published: 01 November 2019
Figure 37 SAM imaging shows shorted flip chip bumps (A). The contrast variation of white or dark in the bridging area in the SAM image is caused by solder thickness variations. X-ray confirms the shorting defect (B). More
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Published: 01 November 2019
Figure 54 Acoustic imaging of a bond interface using different focus positions and wave modes. More
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Published: 01 November 2019
Figure 62 GHz-SAM imaging of the hybrid-bond interface. Left: Acoustic GHz-image showing delamination defects in the bond interface. The magnification at the bottom shows the appearance of ring-shaped delaminations. Right: Electron micrographs through the bond interface. The presence of ring More
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Published: 01 November 2019
Figure 15 Side view camera of dispense and suction enables imaging and cooling during thinning operations and keeps the fluid off the motherboard. More
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Published: 01 November 2019
Figure 12 Local electrical probing of the investigated TSV structure and imaging of the resulting thermal emission at various focus positions. More