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image analyzers

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Image
Published: 01 March 2002
Fig. 6.1 A typical image analyzer setup showing light microscope with camera attachment at the left, video monitor in the center, and microprocessor with command monitor at the right. The microstructure displayed on the center monitor is the AISI/SAE 1020 steel shown in Fig. 6.2 . More
Image
Published: 01 December 1984
Figure 6-29 (a) Leitz TAS PLUS automatic image analyzer. (Courtesy ofE. Leitz Inc.) ( b ) Omnimet Image Analyzer. (Courtesy of Buehler Ltd.) (c) MOP-30 digital semiautomatic tracing device for image analysis. (Courtesy of C. Zeiss, Inc.) More
Image
Published: 01 December 1984
Figure 6-29 (a) Leitz TAS PLUS automatic image analyzer. (Courtesy ofE. Leitz Inc.) ( b ) Omnimet Image Analyzer. (Courtesy of Buehler Ltd.) (c) MOP-30 digital semiautomatic tracing device for image analysis. (Courtesy of C. Zeiss, Inc.) More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400149
EISBN: 978-1-62708-258-7
... equipment. This chapter describes how these instruments can be used to gather important information about a microstructure. The instruments covered include image analyzers, transmission electron microscopes, scanning electron microscopes, electron probe microanalyzers, scanning transmission electron...
Image
Published: 01 November 2019
Figure 26 An interference image produced when analyzing the die attach layer using a 50 MHz transducer. More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720063
EISBN: 978-1-62708-305-8
... vision system senses information about an image and analyzes the information to make a useful decision about its content; in much the same way, the eye acts as the body’s image sensor, with the brain analyzing this information and taking action based on the analysis. Therefore, a machine vision...
Image
Published: 01 December 2016
Fig. 4.3 Microstructure of the AlSi12CuNiMg alloy. (a) Bright-field image. (b) Polarized light contrast, first set polarizer vs. analyzer. (c) Polarized light contrast, second set polarizer vs. analyzer. LM, polished cross section More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110545
EISBN: 978-1-62708-247-1
... Abstract Post-mortem analysis of photovoltaic modules that have degraded performance is essential for improving the long term durability of solar energy. This article focuses on a general procedure for analyzing a failed module. The procedure includes electrical characterization followed...
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.t56000020
EISBN: 978-1-62708-292-1
... it is directed by the user to either a CMOS sensor (to record diffraction patterns) or a photomultiplier tube (to observe real-space images). The chapter discusses some of the nuances of digital imaging and diffraction and includes examples in which transmission electron detectors are used to analyze gold films...
Image
Published: 01 November 2019
Figure 51 Spectrally imaged area (in false color) superimposed on an acoustic image of the bond interface of a structured glass wafer. The effect on the enhancement of the lateral resolution obtained by split-spectral analysis can be seen in the clearly visible gaps between the squares More
Image
Published: 01 November 2019
Figure 24 a) C-AFM current image of the suspect site with positive stage bias. b) C-AFM current image of the suspect site with negative stage bias, note the appearance of a leaking contact (indicated by the arrow). c) Schematic layout of the area analyzed [17] . More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.fibtca.t52430107
EISBN: 978-1-62708-253-2
... an image analyzer, SEM in conjunction with EDS, XRD, emission spectroscopy, XRF, atomic absorption spectrometry (AAS), and surface analysis techniques such as XPS or electron spectroscopy for chemical analysis. While some of these techniques are qualitative in nature, others provide quantitative...
Image
Published: 01 November 2019
Figure 52 Area of a flip chip analyzed by the automated acoustic inspection method. Left: Decision map obtained by the classifier. Green corresponds to intact and red to defective interconnects. Center: Acoustic image indicating acoustically-detected defects (yellow), defects confirmed by 2D X More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
...-destructive imaging semiconductor chips Introduction The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. As silicon features reduce in size into the 7nm node and beyond, the packages that support them have become larger. With larger...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110219
EISBN: 978-1-62708-247-1
... Abstract This chapter describes three approaches for 3D hot-spot localization of thermally active defects by lock-in thermography (LIT). In the first section, phase-shift analysis for analyzing stacked die packages is performed. The second example employs defocusing sequences...
Image
Published: 01 November 2019
Figure 3 Optical images of typical QFP leads (left) and BGA sphere (right). The green squares indicate areas that were analyzed with AES surface and AES depth profiling. More
Image
Published: 01 November 2019
Figure 19 A three-dimensional reconstruction of a 14nm commercial logic chip, (Left)) 3D rendering of the entire analyzed structure, (Right) cross-section image and orthogonal planar view of the 3D structure. More
Image
Published: 01 November 2019
Figure 19 a) Contact level SCM image showing defect area (red box) and reference area (green box). Three contacts in the defect area show no SCM response. b) Layout of the analyzed area [13] . More
Image
Published: 01 November 2019
Figure 87 Schematic view of the equivalent circuit for interpreting EBAC and the RCI images: (a) no defect in the interconnect shown as a blue line, (b) a defect breaks the interconnect into two portions shown as red and blue lines-used for Case 1A and 1B discussions, and (c) a defect More