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Image
in Accepted Practice for Recognizing Artifacts in Air Plasma Spray Thermal Barrier Coating Microstructures
> Thermal Spray Technology: Accepted Practices
Published: 01 June 2022
Image
in X-Ray Imaging Tools for Electronic Device Failure Analysis[1]
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 9 Stacked die interconnect analysis. Projection image of extracted volume (center); 3D image of 25 μm diameter Cu-pillar microbump and virtual cross section (left); 3D image and virtual plan-view slice (right) of BEOL metal 6 interconnect (28 nm Si node). [14] .
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Image
in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 24 An “interference image” produced by attempted pulse-echo analysis of the die attach in an overmolded BGA package.
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Image
in 3D Hot-Spot Localization by Lock-in Thermography
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 9 LIT analysis using machine learning algorithms: (A) amplitude image at the fundamental frequency of TRTR data and (B) parametric image of the weighting coefficients of a principal component of the TRTR-data set. Two separated thermal sources can be identified (denoted by the arrows).
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Image
in Transmission Electron Microscopy
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 29 Example of the EDS line-scan analysis. (a) STEM-BF image of residual material. (b) A plot of Cu-Kα and Ti-Kα x-ray signal intensities extracted from energy dispersive spectral data recorded in the STEM-EDS line-scan mode. Residual material clearly shows higher copper signal
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Image
in 2.5D and 3D Packaging Failure Analysis Techniques
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 10 Image (a) is the EBAC analysis performed post sample preparation. No discontinuity noted. Images (b) & (c) are ELITE analysis performed to isolate the defect location (possible smearing from sample preparation). A hotspot is noted in the micropillar region. Image (d
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Image
in Failure Analysis Techniques and Methods for Microelectromechanical Systems (MEMS)[1]
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 32 a) SEM image of a failed comb drive. Failure analysis revealed b) a MEMS element spot welded to the ground plane, and c) a MEMS element that contacted the ground plane and popped back.
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720063
EISBN: 978-1-62708-305-8
... Abstract Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing...
Abstract
Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing, image analysis, and image interpretation. Details of the processes involved, equipment used, and the factors to be considered are also presented. In addition, the applications of machine vision are discussed.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.fibtca.t52430107
EISBN: 978-1-62708-253-2
... spectroscopy. It explains how the tools work and what they reveal. It also covers the topic of image analysis and its application in the measurement of grain size, phase/volume fraction, delta ferrite and retained austenite, inclusion rating, depth of carburization/decarburization, scale thickness, pearlite...
Abstract
This chapter describes some of the most effective tools for investigating boiler tube failures, including scanning electron microscopy, optical emission spectroscopy, atomic absorption spectroscopy, x-ray fluorescence spectroscopy, x-ray diffraction, and x-ray photoelectron spectroscopy. It explains how the tools work and what they reveal. It also covers the topic of image analysis and its application in the measurement of grain size, phase/volume fraction, delta ferrite and retained austenite, inclusion rating, depth of carburization/decarburization, scale thickness, pearlite banding, microhardness, and hardness profiles. The chapter concludes with a brief discussion on the effect of scaling and deposition and how to measure it.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... Abstract X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray...
Abstract
X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.
Image
in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 42 A flip chip was imaged by TT-SAM analysis prior to removing the lid (A) and then imaged post-lid removal using high-frequency PE-SAM inspection (B).
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Image
in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 46 SAM analysis showing four types of images acquired from a two-die stacked package and focused at the top die surface. (A) Peak amplitude image (B) Phase inversion image (C) Time of flight image (D) Transmission image.
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Image
Published: 01 December 2009
Fig. 15.1 Tolerance analysis and x-ray images. A mechanism designer and manufacturer experienced pin jamming in one of its products. A fault-tree analysis hypothesized the existence of an interference fit. The tolerance analysis drawing on the left showed that this could occur under certain
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Image
Published: 01 December 1984
Figure 6-29 (a) Leitz TAS PLUS automatic image analyzer. (Courtesy ofE. Leitz Inc.) ( b ) Omnimet Image Analyzer. (Courtesy of Buehler Ltd.) (c) MOP-30 digital semiautomatic tracing device for image analysis. (Courtesy of C. Zeiss, Inc.)
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Image
Published: 01 December 1984
Figure 6-29 (a) Leitz TAS PLUS automatic image analyzer. (Courtesy ofE. Leitz Inc.) ( b ) Omnimet Image Analyzer. (Courtesy of Buehler Ltd.) (c) MOP-30 digital semiautomatic tracing device for image analysis. (Courtesy of C. Zeiss, Inc.)
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400149
EISBN: 978-1-62708-258-7
.... For example, a scanning electron microscope (SEM) is quite useful in conducting failure analysis. An image analysis system can be justified when large numbers of grain size and volume fraction measurements are required. Chapter 4 introduced the basic equipment required for typical large and small...
Abstract
Several specialized instruments are available for the metallographer to use as tools to gather key information on the characteristics of the microstructure being analyzed. These include microscopes that use electrons as a source of illumination instead of light and x-ray diffraction equipment. This chapter describes how these instruments can be used to gather important information about a microstructure. The instruments covered include image analyzers, transmission electron microscopes, scanning electron microscopes, electron probe microanalyzers, scanning transmission electron microscopes, x-ray diffractometers, microhardness testers, and hot microhardness testers. A list of other instruments that are usually located in a research laboratory or specialized testing laboratory is also provided.
Image
in The Art of Revealing Microstructure
> Metallographer’s Guide: Practices and Procedures for Irons and Steels
Published: 01 March 2002
Fig. 8.46 Annealed AISI/SAE 316 austenitic stainless steel showing grain boundaries but the absence of twins. Ideal for grain size measurements by image analysis. Electrolytically etched with 60% nitric acid and 40% water using a platinum cathode at 5 V. 500×
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Image
Published: 01 December 1984
Figure 6-23 Inclusion volume fraction measurements of nine samples with varying sulfur contents using image analysis with 16×, 32×, and 80 × objectives. The trend line shown was plotted by using the least-squares method to fit all the data points. (From Vander Voort, Ref. 61, courtesy
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Image
in The Expanded Metallographic Laboratory
> Metallographer’s Guide: Practices and Procedures for Irons and Steels
Published: 01 March 2002
Fig. 6.2 Micrograph of AISI/SAE 1020 steel shown on the video monitor in Fig. 6.1 . Pearlite is the gray-appearing constituent, and ferrite is the white-appearing constituent. Marshall’s reagent was specifically used to delineate the ferrite grain boundaries for image analysis. The pearlite
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Image
Published: 01 June 2016
Fig. 5.1 Representative optical micrographs showing (a, b) comparison of overall coating thickness and top layer thickness between a nitrogen-sprayed and a helium-sprayed copper coating, respectively; (c, d) image analysis to evaluate porosity in pure copper coating; and (e, f) interface
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