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histograms
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Image
in LADA and SDL: Powerful Techniques for Marginal Failures
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 8 Three types of jitter histograms biased at the 50% fail rate, showing how the distribution moves with the laser illumination. (a) A well-behaved jitter histogram with a modest variance can be completely moved into the pass region by the laser for a 0% fail rate. (b) A large random
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Image
Published: 01 November 2012
Fig. 13 Histograms showing fatigue-life distribution for 57 specimens of a 75S-T6 aluminum alloy tested at 207 MPa (30 ksi). Note the influence of a (a) linear or (b) logarithmic plot of cycles to failure N on the shape of the histogram. Source: Ref 9
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in Role of Advanced Circuit Edit for First Silicon Debug
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 18 Histogram of the deposition data from analysis of 4 process technology nodes (180nm, 65nm, 45nm, 28nm). [28]
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in Role of Advanced Circuit Edit for First Silicon Debug
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 20 Histogram of FIB metal deposition length during the debug of a 90nm logic process [46] .
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in Role of Advanced Circuit Edit for First Silicon Debug
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 22 A histogram of the silicon cut minimum length geometry showing the predominance of the geometries below 1 micron. [28]
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in Role of Advanced Circuit Edit for First Silicon Debug
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 23 A zoomed in histogram of the silicon cut data showing the occurrences from 0 to 5 microns on the minimum length geometry. [28]
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Image
Published: 01 December 1984
Figure 6-12 Arithmetic frequency histogram of the random intercept measurements of the duplex grain structure shown in Fig. 6-11 .
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Published: 01 December 1984
Figure 6-25 Frequency histogram of shape factors measured on flake, compacted, and nodular graphite samples.
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in Aerospace Applications—Example Fatigue Problems
> Fatigue and Durability of Metals at High Temperatures
Published: 01 July 2009
Fig. 10.9 Histogram showing fractional fatigue crack-initiation life used to date of existing disks
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Published: 01 December 1995
Fig. 16-11 Histogram and statistically determined distribution curve of actual casting dimensions held on dimension B of the bearing retainer pictured. The pattern was pine, mounted on cope and drag boards.
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Published: 01 December 1995
Fig. 16-12 Histogram and distribution curve of actual casting dimensions obtained on dimension G of the valve body shown. The casting was made from an aluminum pattern and mounted on cope and drag boards.
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Published: 01 December 1995
Fig. 16-13 Histogram and distribution curve for casting weights. 94.88% of the distribution is within ±5% of the average casting weight.
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Published: 01 October 2012
Fig. 10.9 Increase in fracture toughness ( K Ic ) observed upon inclusion of zirconia particles in the ceramic matrix. The volume of zirconia added is shown in the shaded histogram. The toughness of the matrix material is shown in the adjacent white histogram bars. S, sintered. HP, hot
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Published: 01 April 2013
Fig. 5 Schematic of energy dispersive x-ray detector. Detector measures the energy of each incoming x-ray photon by counting the number of electron hole pairs it produces. A histogram is then developed and plotted of the x-ray energies of the many (typically tens to hundreds of thousands
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Image
Published: 01 January 2015
Fig. 17.19 (a) Carbon atom map associated with a cementite crystal (arrow) formed in martensite of 4340 steel during tempering at 325 °C (615 °F) for 2 hours, and (b) the proximity histogram showing concentrations of carbon, chromium, manganese, and molybdenum through the interface
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Published: 01 January 2015
Fig. 17.20 Atom maps for carbon (red) (a), chromium (blue) (b), manganese (green) (c), and molybdenum (yellow) (d) at a cementite crystal (arrow) formed in martensite of 4340 steel after tempering at 575 °C (1065 °F) for 2 hours. The proximity histogram at the bottom (e) shows concentrations
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1995
DOI: 10.31399/asm.tb.sch6.t68200206
EISBN: 978-1-62708-354-6
... in future production may be predicted. Fig. 16-11 Histogram and statistically determined distribution curve of actual casting dimensions held on dimension B of the bearing retainer pictured. The pattern was pine, mounted on cope and drag boards. Fig. 16-12 Histogram and distribution curve...
Abstract
Users of steel castings establish performance requirements for specific characteristics of the castings based on the planned use. They express tolerance for variation in those characteristics to the producer of the castings. One issue which should never be taken for granted in considering capability and tolerances is the ability to measure with accuracy and precision (repeatability and reproducibility). This chapter discusses the methods for measuring accuracy and precision. It describes the variation of process characteristics, capability indices in general use, and factors related to process performance and tolerance specification.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... and capacitance, the length and width of these interconnects can vary from submicron to hundreds of microns long. Figure 18 shows a histogram of the deposition data required on 180 nm, 65 nm, 45 nm, and 28 nm IC FIB CE requests. The range of deposition lengths is shown on the x-axis of the graph starting...
Abstract
Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1995
DOI: 10.31399/asm.tb.sch6.t68200220
EISBN: 978-1-62708-354-6
... unacceptable loss of control of the critical aspects of casting quality occurs. Fig. 17-5 Xbar chart for active clay Other statistical techniques include histogram and other process capability studies which serve to describe the capability of a process to meet the specification or tolerance range...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2015
DOI: 10.31399/asm.tb.spsp2.t54410373
EISBN: 978-1-62708-265-5
... maps and proximity histograms for carbon and substitutional alloying elements are shown. The proximity histograms are based on a constructed interface between the ferrite matrix and a cementite crystal, and the closest distance of each atom to this interface is calculated and the atoms made a part...
Abstract
Most steels that are hardened are subjected to a subcritical heat treatment referred to as tempering. Tempering improves the toughness of as-quenched martensitic microstructures but lowers strength and hardness. This chapter describes the microstructural changes that occur during tempering and their effect on the mechanical properties of steel. It also discusses the effect of alloying elements and the formation of oxide colors.