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Image
in Laser Voltage Probing of Integrated Circuits: Implementation and Impact
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 6 Hardware schematic for LVP implementation.
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Image
in Laser Voltage Probing of Integrated Circuits: Implementation and Impact
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 9 Hardware schematic for LVI implementation.
More
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180127
EISBN: 978-1-62708-256-3
... as unacceptable behavior. Everyone needs help eventually. Returning the Part to the Supplier Returning the part to the supplier is another cost-effective way to deal with hardware failures. This “solution” is popular with company management because the time, labor, and cost of the failure investigation...
Abstract
This chapter describes some common pitfalls encountered in failure investigations and provides guidance to help engineers recognize processes and “quick fixes” that companies often try to substitute for failure analysis. It discusses three important skills and characteristics that a professional engineer must improve to conduct an effective and successful failure investigation, namely technical skills, communication skills, and technical integrity. The chapter also provides information on the additional basic tools available for failure investigation and root cause determination: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC.
Image
in Corrosion in Petroleum Refining and Petrochemical Operations[1]
> Corrosion in the Petrochemical Industry
Published: 01 December 2015
Fig. 49 Montage showing interrelationship between a petrochemical plant process engineer and corrosion/materials specialist using online, real-time corrosion monitoring. Distributed corrosion-monitoring hardware provides a preprocessed data signal at point of monitoring. This, in turn
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Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.t56000001
EISBN: 978-1-62708-292-1
... Abstract This chapter discusses the principles of scanning transmission electron microscopy (STEM) as implemented using conventional scanning electron microscopes (SEMs). It describes the pros and cons of low-energy imaging and diffraction, addresses basic hardware requirements, and provides...
Abstract
This chapter discusses the principles of scanning transmission electron microscopy (STEM) as implemented using conventional scanning electron microscopes (SEMs). It describes the pros and cons of low-energy imaging and diffraction, addresses basic hardware requirements, and provides information on imaging modes, detector positioning and alignment, and the effect of contrast reversal. It also discusses beam convergence and angular selectivity, the use of application-specific masks, and how to generate grain orientation maps for different material systems.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.t52860065
EISBN: 978-1-62708-338-6
... Abstract This chapter addresses the hardware requirements for filament winding, from elementary processing equipment to more advanced systems. The chapter describes the equipment, defines how it is best used, and presents real-life examples. It describes a helical horizontal filament winding...
Abstract
This chapter addresses the hardware requirements for filament winding, from elementary processing equipment to more advanced systems. The chapter describes the equipment, defines how it is best used, and presents real-life examples. It describes a helical horizontal filament winding machine system and a vertical winding machine. The chapter provides information on in-plane (polar) winders and several types of creels, namely stationary and no twist, rotating, braking, and combinations thereof. Comprehensive descriptions of mandrel designs used in filament winding are presented in text and illustration. The chapter also reviews process control of filament winding parameters, including for some specialized winding processes and unique component types.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.t52860081
EISBN: 978-1-62708-338-6
... Abstract The technology of fabricating composite hardware and structures by filament winding has evolved empirically through the development and manufacturing of specific components. This chapter reviews areas of technology used in building composite parts and discusses the processes from which...
Abstract
The technology of fabricating composite hardware and structures by filament winding has evolved empirically through the development and manufacturing of specific components. This chapter reviews areas of technology used in building composite parts and discusses the processes from which the current technology was derived. The discussion covers quality control requirements for composite fabrication technology and cleanliness standards in the workplace. It describes technology developed for specific components, including satellites struts, aircraft hydraulic cylinders, drill pipe, drive shafts, couplings, and cryogenic tubing.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170520
EISBN: 978-1-62708-297-6
... and instrument bezels, steering wheel hubs, alternator brackets, exterior and interior hardware, instrument panels and body moldings. The average U.S. manufactured passenger car contains about 7.7 kg (17 lb) of die cast parts. Zinc castings are also extensively used in general hardware and electronic...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180091
EISBN: 978-1-62708-256-3
... Resources and constraints may simply involve the same three items: money, labor, and time. Clarifying these items ahead of time saves frustration in the long run, especially when trying to get personnel to dedicate time to your project. Constraints can also include the inability to destroy the hardware...
Abstract
This chapter describes the nine steps of a failure investigation. The steps add detail to the problem-solving process introduced in Chapter 3. The first five steps are (1) understanding and negotiating the investigation goals, (2) obtaining an understanding of the failure, (3) objectively and clearly identifying all possible root causes, (4) evaluating the likelihood of each root cause, and (5) converging on the most likely root cause(s). Many failure investigations stop at this point, but significant value is provided in the next four steps, which are (6) identifying all possible corrective actions, (7) evaluating each corrective action, (8) selecting the optimal corrective action(s), and (9) evaluating the effectiveness of each corrective action. Each step is discussed in detail with examples along with information on the procedures to be followed and resources needed for the investigation.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... to analyze failed hardware, the topic must be considered from two perspectives: One possibility is that the system failed because parts were nonconforming to drawing requirements, they were assembled improperly, contaminants were present, or the system operated outside its intended environment...
Abstract
This chapter focuses on common failure characteristics exhibited by mechanical and electrical components. The topic is considered from two perspectives: one possibility is that the system failed because parts were nonconforming to drawing requirements and another possibility is that the system failed even though all parts in the system met their drawing requirements. The common failures discussed in this chapter include those associated with metallic components, composite materials, plastic components, ceramic components, and electrical and electronic components.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270031
EISBN: 978-1-62708-301-0
... analysis on the system hardware ( Ref 21 , 22 ), often after the design was nearly complete and thus when changes would be difficult or expensive. More recently, refinements in the methodology have expanded the types of failures that can be analyzed, and FMEA procedures have become a “traditional...
Abstract
This chapter discusses some of the more advanced methods and procedures used in failure analysis, including in-service material sampling, in situ microstructure analysis, and a form of punch testing that can determine the fracture toughness of any material from a tiny specimen. The chapter also covers quantitative fractography, fracture surface topography analysis, and the use of oxide dating as well as fault tree and failure modes and effects analysis (FMEA) and computational techniques.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780189
EISBN: 978-1-62708-268-6
...” technique, or fault-tree analysis. List each potential failure cause in a failure mode assessment and assignment. Use appropriate documentation reviews, interviews, design analyses, hardware analyses, and designed experiments to converge on the root cause. Identify potential interim and long-term...
Abstract
At the conclusion of a systems failure analysis, the people involved should have a much more in-depth understanding of how the system is supposed to work. The analysis should help understand shortfalls in the design, production, testing, and use of the system. The failure analysis team will have identified other potential failure causes and actions required to preclude future failures. This is valuable knowledge, and it should not be set aside or ignored when the failure analysis team concludes its activities. This chapter is a brief account of the creation of failure analysis libraries, of process guidelines based on previous failure analyses, and of troubleshooting and repair guidelines. Also provided is a listing of the various steps that should be included in a failure analysis procedure.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170457
EISBN: 978-1-62708-297-6
... as the alloy content. Typical applications of cold-worked wrought alloys (cold-worked tempers) include springs; fasteners, hardware, small gears, cams, electrical contacts, and electronic components, such as connectors and lead frames. Certain types of parts, most notably plumbing fittings and valves...
Abstract
This article discusses the composition, properties, and behaviors of copper and its alloys. It begins with an overview of the characteristics, applications, and commercial grades of wrought and cast copper. It then discusses the role of alloying, explaining how zinc, tin, aluminum, silicon, and nickel affect the physical and mechanical properties of coppers and high-copper alloys as well as brasses, bronzes, copper-nickels, and nickel silvers. It also explains how alloying affects electrical conductivity, corrosion resistance, stress-corrosion cracking, and processing characteristics.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780089
EISBN: 978-1-62708-281-5
... materials. Using these materials to fabricate hardware depends on a chemical process, in contrast to the more conventional metallic techniques, such as machining, heat forming, and mechanical fastening. Thermoset processing is further complicated in that its chemical reactions convert the materials...
Abstract
This article focuses on characterization techniques used for analyzing the physical behavior and chemical composition of thermoset resins, namely chromatography and infrared spectroscopy. The main purpose is to give sufficient detail to permit the reader understand a particular test technique and its value to the thermoset resin field. Epoxy resins are emphasized in the examples because they dominate the airframe and aerospace industries. The article also provides information on two categories of characterization of the processing behavior of thermoset. The first studies the thermal properties of reactive thermoset systems, while the second utilizes these thermal characteristics as the basis for monitoring and control during processing.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110673
EISBN: 978-1-62708-247-1
... analyst also faces more complex equipment sets. In addition to the curve tracer, optical microscope and decapsulation tools, the analyst must be familiar with a variety of electrical testing hardware, endless electrical fixture configurations, x-ray and acoustic microscopy, electron beam tools, optical...
Abstract
Education and training play an important role if the failure analyst is to be successful in his or her work. This article discusses the history of training activities in the failure/product analysis discipline and describes where this area is heading. It provides information on three areas of education and training that should be given to the analyst for him or her to be successful developing and fielding modern semiconductor components: analysis process, technology, and technique training.
Book Chapter
Book: Corrosion of Weldments
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.cw.t51820115
EISBN: 978-1-62708-339-3
...) in continuous service. Scaling becomes excessive above approximately 760 °C (1400 °F) in intermittent service. Turbine blades and highly stressed sections in gas turbines, furnace parts, and burners operating below 650 °C (1200 °F), valve parts, cutlery, fasteners, hardware, oil refinery equipment, mining...
Abstract
Martensitic stainless steels are essentially iron-chromium-carbon alloys that possess a body-centered tetragonal crystal structure (martensitic) in the hardened condition. Martensitic stainless steels are similar to plain carbon or low-alloy steels that are austenitized, hardened by quenching, and then tempered for increased ductility and toughness. This chapter provides a basic understanding of grade designations, properties, corrosion resistance, and general welding considerations of martensitic stainless steels. It also discusses the causes for hydrogen-induced cracking in martensitic stainless steels and describes sulfide stress corrosion resistance of type 410 weldments.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870001
EISBN: 978-1-62708-299-0
Abstract
Aluminum is the second most widely used metal in the world. It is readily available, offers a wide range of properties, and can be shaped, coated, and joined using a variety of methods. This chapter discusses some of the key attributes of wrought and cast aluminum alloys and the classifications, designations, and grades of available product forms. It also explains how aluminum alloys are used in aerospace, automotive, rail, and marine applications as well as in building and construction, electrical products, manufacturing equipment, packaging, and consumer durables such as appliances and furniture.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.sap.t53000117
EISBN: 978-1-62708-313-3
... GTE casings, shrouds, vanes, and shafts Low CTE. Silicon addition improves notch-rupture and tensile properties with less restrictive processing and shorter heat treatments Incoloy 925 Surface and down-hole hardware in sour gas wells, oil-production equipment Excellent resistance to general...
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