1-20 of 127

Search Results for gold solders

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230189
EISBN: 978-1-62708-351-5
... carat gold solders. brazing carat filler metals gold alloys gold jewelry gold solders silver jewelry silverware BRAZES FOR JEWELRY, silverware, and objets d’art merit separate consideration from industrial brazing alloys because, in addition to providing joints that are mechanically...
Image
Published: 01 August 2005
Fig. 5.14 Metallographic cross section of a T-joint made to 22 carat gold jewelry using a true gold solder (i.e., melting point <450 °C, or 840 °F) More
Image
Published: 01 August 2005
Fig. 5.13 Progressive recovery of the ductility of strip-cast foils of the 22 carat gold solder 91.6Au-6.8Ge-1.6Si, during heat treatment at 285 °C (545 °F) More
Image
Published: 01 April 2004
Fig. 5.21 (a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn, and the substrate is copper plated with 5 μm (200 μin.) of nickel and then 5 μm (200 μin.) of gold. At least three distinct microstructural bands are visible. (b) Micrograph of a joint made using the same More
Image
Published: 01 April 2004
Fig. 3.25 Fluxless wetting of Pb-62Sn solder on copper and gold-on-nickel metallizations, using acetic acid vapor of varying concentration as an active reductant in the atmosphere More
Image
Published: 01 April 2004
Fig. 4.1 Solderability shelf life of gold-coated components. Thicker and denser coatings are more impervious to oxygen and water vapor and therefore confer greater protection to the underlying metal. More
Image
Published: 01 April 2004
Fig. 5.22 Oxygen concentration at 3 nm (0.1 μin.) depth in the gold surface of solderability reference standard material as a function of the heat treatment condition. The substrate material is nickel sheet, electroplated with 10 μm (390 μin.) nickel, overlaid with 5μm (200 μin.) gold. More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... not automatically imply a lack of wetting. For example, all solders will wet platinum, but only gold-base solders will spread on this metal. Limited erosion of the parent metals at the joint interface. The associated alloying, which must occur to form a metallic bond, should not result in the formation of either...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110005
EISBN: 978-1-62708-483-3
... Abstract This chapter presents a brief review of the history of brazing and soldering. It illustrates complicated soldering techniques and masterful goldsmith work, as demonstrated by the famous gold mask of the Egyptian Pharaoh Tutankhamun. The chapter includes the image of a painting from...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
..., after alloying with any metallizations present on the board and component leads, should notbe substantially below 170 °C (340 °F). Physical and chemical characteristics: The new lead-free solder must wet and spread on the common engineering metals and metallizations, namely, gold, silver, platinum...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... dissolved, it does not give rise to brittle phases by reaction with the filler and parent materials. Copper, silver, and gold are the principal elements used as wettable metallizations because of their nobility, metallurgical compatibility with most solder alloys, and ease of deposition. Tin is also...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t5123000x
EISBN: 978-1-62708-351-5
... the earliest forms of metalwork often required joints, and the ingredients of common brazes were either of noble metals or base metals extracted from readily winnable ores, brazing appears to predate soldering heritage by 2 to 3 millennia, despite the higher temperatures involved. Brazing of gold...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t6244000x
EISBN: 978-1-62708-352-2
... for joining metal pipes [Pliny, Natural History xxxiv 161 ( Rackham 1952 )]. Pliny also remarks that the price of this alloy is 20 denarii per pound. With 25 denarii (silver pieces weighing approximately 4 gm, or 0.14 oz, each) to 1 gold aureaus of close to 8 gm (0.28 oz), the price of Roman solder works...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110119
EISBN: 978-1-62708-483-3
... diminishes with higher-melting-temperature gold-base solders. The use of surface finishes—protective and solderable layers—on the base material, such as gold and silver, impacts the strength of the joint via compositional changes to the filler metal and the integrity of the solder/solderable finish interface...
Image
Published: 01 April 2004
Fig. 5.39 Parts of an 18 carat gold bracelet and matching earring set assembled using the gold-tin diffusion-soldering process at 450 °C (842 °F). The unusually low process temperature enables the face plates to retain much of their work-hardened strength and thereby accept a particularly high More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240597
EISBN: 978-1-62708-251-8
... in nuclear reactors. Beryllium is an extremely lightweight metal that, as a result of its high specific modulus, is used in high-value aerospace structures. Lead and tin form the most widely used solders, and lead is the most important of the battery materials. Gold, silver, and the platinum group are all...
Image
Published: 01 April 2004
Fig. 2.2 Erosion of a gold metallization by molten indium as a function of reaction time and temperature. Similar results are obtained for indium-base solders, including gold-indium, silver-indium, indium-lead, and indium-tin. More
Image
Published: 01 April 2004
Fig. 2.37 Continued growth of gold-indium intermetallic phases at the interface between a gold metallization and indium-lead solder at elevated temperature but below the solidus temperature. Adapted from Frear, Jones, and Kinsman [1990 ] More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440103
EISBN: 978-1-62708-352-2
... is sometimes referred to reciprocally as the dissociation potential of the oxide. The least stable metal oxides are those of the noble metals, gold, silver, and members of the platinum group. These metals are therefore the most readily soldered, while the refractory metals and the light metals—notably aluminum...
Image
Published: 01 April 2004
Fig. 3.29 Shear strength of joints approximately 10 × 5 mm (0.4 × 0.2 in.) in area made fluxless using In-48Sn solder at process temperature of 150 °C (302 °F) to gold-metallized components, as a function of the applied compressive load, showing also the effect of atmosphere quality More