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Book Chapter
Filler Metals for Carat Gold and Hallmark Silver Jewelry
Available to PurchaseBook: Principles of Brazing
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230189
EISBN: 978-1-62708-351-5
... carat gold solders. brazing carat filler metals gold alloys gold jewelry gold solders silver jewelry silverware BRAZES FOR JEWELRY, silverware, and objets d’art merit separate consideration from industrial brazing alloys because, in addition to providing joints that are mechanically...
Abstract
Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.
Image
Metallographic cross section of a T-joint made to 22 carat gold jewelry usi...
Available to PurchasePublished: 01 August 2005
Fig. 5.14 Metallographic cross section of a T-joint made to 22 carat gold jewelry using a true gold solder (i.e., melting point <450 °C, or 840 °F)
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Image
Progressive recovery of the ductility of strip-cast foils of the 22 carat g...
Available to PurchasePublished: 01 August 2005
Fig. 5.13 Progressive recovery of the ductility of strip-cast foils of the 22 carat gold solder 91.6Au-6.8Ge-1.6Si, during heat treatment at 285 °C (545 °F)
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Image
(a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn,...
Available to PurchasePublished: 01 April 2004
Fig. 5.21 (a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn, and the substrate is copper plated with 5 μm (200 μin.) of nickel and then 5 μm (200 μin.) of gold. At least three distinct microstructural bands are visible. (b) Micrograph of a joint made using the same
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Image
Fluxless wetting of Pb-62Sn solder on copper and gold-on-nickel metallizati...
Available to PurchasePublished: 01 April 2004
Fig. 3.25 Fluxless wetting of Pb-62Sn solder on copper and gold-on-nickel metallizations, using acetic acid vapor of varying concentration as an active reductant in the atmosphere
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Image
Solderability shelf life of gold-coated components. Thicker and denser coat...
Available to PurchasePublished: 01 April 2004
Fig. 4.1 Solderability shelf life of gold-coated components. Thicker and denser coatings are more impervious to oxygen and water vapor and therefore confer greater protection to the underlying metal.
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Image
Oxygen concentration at 3 nm (0.1 μin.) depth in the gold surface of solder...
Available to PurchasePublished: 01 April 2004
Fig. 5.22 Oxygen concentration at 3 nm (0.1 μin.) depth in the gold surface of solderability reference standard material as a function of the heat treatment condition. The substrate material is nickel sheet, electroplated with 10 μm (390 μin.) nickel, overlaid with 5μm (200 μin.) gold.
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Book Chapter
Solders and Their Metallurgy
Available to PurchaseBook: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... not automatically imply a lack of wetting. For example, all solders will wet platinum, but only gold-base solders will spread on this metal. Limited erosion of the parent metals at the joint interface. The associated alloying, which must occur to form a metallic bond, should not result in the formation of either...
Abstract
This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.
Book Chapter
A Brief Review of the History of Brazing and Soldering
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110005
EISBN: 978-1-62708-483-3
... Abstract This chapter presents a brief review of the history of brazing and soldering. It illustrates complicated soldering techniques and masterful goldsmith work, as demonstrated by the famous gold mask of the Egyptian Pharaoh Tutankhamun. The chapter includes the image of a painting from...
Abstract
This chapter presents a brief review of the history of brazing and soldering. It illustrates complicated soldering techniques and masterful goldsmith work, as demonstrated by the famous gold mask of the Egyptian Pharaoh Tutankhamun. The chapter includes the image of a painting from Egypt circa 1475 B.C. that shows a goldsmith soldering with a blowpipe. Numerous similar images have been found in the tombs of ancient Egypt that offer insight into the practices of gold workers from the period, including the use of processes such as smelting, forging, and joining with both brazing and soldering.
Book Chapter
Advances in Soldering Technology
Available to PurchaseBook: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
..., after alloying with any metallizations present on the board and component leads, should notbe substantially below 170 °C (340 °F). Physical and chemical characteristics: The new lead-free solder must wet and spread on the common engineering metals and metallizations, namely, gold, silver, platinum...
Abstract
This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.
Book Chapter
The Role of Materials in Defining Process Constraints
Available to PurchaseBook: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... dissolved, it does not give rise to brittle phases by reaction with the filler and parent materials. Copper, silver, and gold are the principal elements used as wettable metallizations because of their nobility, metallurgical compatibility with most solder alloys, and ease of deposition. Tin is also...
Abstract
This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.
Book Chapter
History of Brazing
Available to PurchaseBook: Principles of Brazing
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t5123000x
EISBN: 978-1-62708-351-5
... the earliest forms of metalwork often required joints, and the ingredients of common brazes were either of noble metals or base metals extracted from readily winnable ores, brazing appears to predate soldering heritage by 2 to 3 millennia, despite the higher temperatures involved. Brazing of gold...
Abstract
This chapter briefly reviews the history of brazing from ancient times to the early 20th century.
Book Chapter
History
Available to PurchaseBook: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t6244000x
EISBN: 978-1-62708-352-2
... for joining metal pipes [Pliny, Natural History xxxiv 161 ( Rackham 1952 )]. Pliny also remarks that the price of this alloy is 20 denarii per pound. With 25 denarii (silver pieces weighing approximately 4 gm, or 0.14 oz, each) to 1 gold aureaus of close to 8 gm (0.28 oz), the price of Roman solder works...
Abstract
This chapter describes the origins of solders and soldering, covering the composition of solders and applications of soldering.
Book Chapter
Strength of Soldered Joints
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 31 December 2024
DOI: 10.31399/asm.tb.hisppa.t56110119
EISBN: 978-1-62708-483-3
... diminishes with higher-melting-temperature gold-base solders. The use of surface finishes—protective and solderable layers—on the base material, such as gold and silver, impacts the strength of the joint via compositional changes to the filler metal and the integrity of the solder/solderable finish interface...
Abstract
This chapter focuses on factors that influence the mechanical properties of a soldered joint, including solder material, base material, solder joint design, soldering surface, soldering temperature, and test methodology.
Image
Parts of an 18 carat gold bracelet and matching earring set assembled using...
Available to PurchasePublished: 01 April 2004
Fig. 5.39 Parts of an 18 carat gold bracelet and matching earring set assembled using the gold-tin diffusion-soldering process at 450 °C (842 °F). The unusually low process temperature enables the face plates to retain much of their work-hardened strength and thereby accept a particularly high
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Book Chapter
Miscellaneous Nonferrous Metals
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240597
EISBN: 978-1-62708-251-8
... in nuclear reactors. Beryllium is an extremely lightweight metal that, as a result of its high specific modulus, is used in high-value aerospace structures. Lead and tin form the most widely used solders, and lead is the most important of the battery materials. Gold, silver, and the platinum group are all...
Abstract
This chapter discusses the compositions, properties, and applications of nonferrous metals, including zirconium, hafnium, beryllium, lead, tin, gold, silver, and platinum group metals. It also addresses fusible alloys and provides melting temperatures for several compositions.
Image
Erosion of a gold metallization by molten indium as a function of reaction ...
Available to PurchasePublished: 01 April 2004
Fig. 2.2 Erosion of a gold metallization by molten indium as a function of reaction time and temperature. Similar results are obtained for indium-base solders, including gold-indium, silver-indium, indium-lead, and indium-tin.
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Image
Continued growth of gold-indium intermetallic phases at the interface betwe...
Available to PurchasePublished: 01 April 2004
Fig. 2.37 Continued growth of gold-indium intermetallic phases at the interface between a gold metallization and indium-lead solder at elevated temperature but below the solidus temperature. Adapted from Frear, Jones, and Kinsman [1990 ]
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Book Chapter
The Joining Environment
Available to PurchaseBook: Principles of Soldering
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440103
EISBN: 978-1-62708-352-2
... is sometimes referred to reciprocally as the dissociation potential of the oxide. The least stable metal oxides are those of the noble metals, gold, silver, and members of the platinum group. These metals are therefore the most readily soldered, while the refractory metals and the light metals—notably aluminum...
Abstract
Materials used in joining, whether solders, fluxes, or atmospheres, are becoming increasingly subjected to restrictions on the grounds of health, safety, and pollution concerns. These regulations can limit the choice of materials and processes that are deemed acceptable for industrial use. The chapter addresses this issue with a focus on soldering fluxes. The chapter also describes factors related to soldering under a protective atmosphere, provides information on chemical fluxes for soldering of various metals, and discusses the processes involved in fluxless soldering processes.
Image
Shear strength of joints approximately 10 × 5 mm (0.4 × 0.2 in.) in area ma...
Available to PurchasePublished: 01 April 2004
Fig. 3.29 Shear strength of joints approximately 10 × 5 mm (0.4 × 0.2 in.) in area made fluxless using In-48Sn solder at process temperature of 150 °C (302 °F) to gold-metallized components, as a function of the applied compressive load, showing also the effect of atmosphere quality
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