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gold plating

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030117
EISBN: 978-1-62708-282-2
.... Waterhouse, University of Nottingham Fig. 7 Fretting of cobalt-gold-plated copper flats in contact with solid gold in an electrical contact. (a) After 1000 cycles. (b) After 10 4 cycles. (c) After 10 5 cycles. (d) After 10 6 cycles. Source: Ref 8 Fig. 21 Micrograph showing cracking...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... for applying gold coatings, the components should be provided with typically 3 to 4 μm (120 to 160 μin.) thick platings of gold to confer an adequate solderable shelf life. Then, immediately prior to the soldering operation, the level of gold can be considerably reduced to suit, in particular, high-tin solders...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.fdmht.t52060231
EISBN: 978-1-62708-343-0
... to this point because of the intentional use of a 0.075 to 0.127 mm (0.003 to 0.005 in.) thick hydrogen-barrier gold plating that covered the entire surface of the wrought nickel-base superalloy (Waspaloy) disk. Cracking occurred in the nickel alloy substrate beneath the gold, but because the gold was so soft...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230189
EISBN: 978-1-62708-351-5
... successfully developed for use with yellow gold jewelry alloys. It comprises a core that is slightly deficient in gold and also the light element, silicon, with respect to the eutectic valley linking the Au-3Si and Au-12.5Ge binary eutectics. It is coated with a gold plating to inhibit formation of dross...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... in lead-tin solder. The addition of 0.5 to 0.6% Bi to the Au-20Sn solder is said to improve the wettability when the alloy is used for joining gold-plated products [ Rapson and Groenewald 1978 ]. Although the presence of aluminum is undesirable in conventional solders, as it greatly exacerbates...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
.../BF03214726 • Hunt C. and Wallis D. , 1995 . Solderability Standard: A Gold-Plated Nickel Reference Material , Solder. Surf. Mt. Technol. , Vol 21 (No. 1 ), p 6 – 9 10.1108/eb037904 • Hwang J.S. , 1996 . Environment Friendly Electronics: Lead-Free Technology...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230047
EISBN: 978-1-62708-351-5
...–1265 … 63.0 28.5 0 6.0 2.5 … 690–800 1275–1470 BAg-21 Industrial gold brazing alloys Table 2.5 Industrial gold brazing alloys Composition, wt% Melting range AWS designation Au Ag Cu Ni Pd °C °F 20.0 … 80.0 … … 1020–1040 1865–1905 … 29.0 45.0 26.0...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300421
EISBN: 978-1-62708-323-2
.... Silver plating of stainless steel fasteners has been widely used to reduce stainless-to-stainless galling in fasteners. A 25 μm plating of silver on one member often prevents thread galling. Gold plating of electrical contacts has become a popular treatment for preventing fretting wear and erosion...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300227
EISBN: 978-1-62708-323-2
... was not obtained in metallic form until about 1850. It was more expensive than gold at that time because of the difficulty in extracting it from its ores. Around 1875, it was discovered that metallic aluminum could be plated out of molten salts made from aluminum ores. That is essentially the process still...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300335
EISBN: 978-1-62708-323-2
... member and slips on the mating surface. Gold plating is commonly used to mitigate fretting corrosion damage. Gold does not oxidize, and fretting corrosion usually involves damage by oxidation of metal surfaces made nascent by rubbing. Metal oxides are usually abrasive, so abrasion becomes conjoint...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t5123000x
EISBN: 978-1-62708-351-5
...Abstract Abstract This chapter briefly reviews the history of brazing from ancient times to the early 20th century. brazing Origins of Brazes and Brazing References References • Bradbury F. , 1912 . History of Old Sheffield Plate , MacMillan 10.5479/sil...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240597
EISBN: 978-1-62708-251-8
...Abstract Abstract This chapter discusses the compositions, properties, and applications of nonferrous metals, including zirconium, hafnium, beryllium, lead, tin, gold, silver, and platinum group metals. It also addresses fusible alloys and provides melting temperatures for several compositions...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060073
EISBN: 978-1-62708-261-7
... Jordan 5000–3000 B.C. Chalcolithic period: melting of copper; experimentation with smelting Near East 3000–1500 B.C. Bronze Age: arsenical copper and tin bronze alloys Near East 3000–2500 B.C. Lost-wax casting of small objects Near East 2500 B.C. Granulation of gold and silver...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2000
DOI: 10.31399/asm.tb.fec.t65940451
EISBN: 978-1-62708-302-7
... by the Corrodkote Procedure • B 457, Method for Measurement of Impedance of Anodic Coatings on Aluminum • B 537, Practice for Rating of Electroplated Panels Subjected to Atmospheric Exposure • B 577, Test Methods for Hydrogen Embrittlement of Copper • B 583, Test Methods for Porosity in Gold...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440001
EISBN: 978-1-62708-352-2
... joint gap pressure welding soldering surface energy surface roughness surface tension wetting 1.1 Joining Methods 1.2 Key Parameters of Soldering 1.3 The Design and Application of Soldering Processes Appendix A1.1: Solid-State Joining with Gold, Indium, and Solder Constituents...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.tb.cub.t66910049
EISBN: 978-1-62708-250-1
... Chromium Cr 3+ + 3 e − ↔ Cr Cr 2+ + 2 e − ↔ Cr Cobalt Co 2+ + 2 e − ↔ Co Copper Cu + + e − ↔ Cu Cu 2+ + 2 e − ↔ Cu Gallium Ga 3+ + 3 e − ↔ Ga Gold Au 3+ + 3 e − ↔ Au Hafnium Hf 4+ + 4 e − ↔ Hf Hydrogen 2H + + 2 e − ↔ H 2 Indium In 3+ + 3 e...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270053
EISBN: 978-1-62708-301-0
... WC and TiC formed a solid-solution series. The carbide company claimed a single compound WTiC. Ultimately, the case hinged upon an expert testimony that WC and TiC do indeed form a solid-solution series ( Ref 4 ). Popular Yellow Metal Gold Adulteration of Antiques Icons and Art Treasures...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.9781627083232
EISBN: 978-1-62708-323-2
Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630211
EISBN: 978-1-62708-270-9
...Galvanic series in seawater at 25 °C (77 °F) Table 1 Galvanic series in seawater at 25 °C (77 °F) Cathodic end (least easily corroded) Platinum Gold Graphite Titanium Silver Chlorimet 3 Hastelloy C Inconel alloy 625 Incoloy alloy 825 Type 316 stainless steel...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850538
EISBN: 978-1-62708-260-0
..., osmium, iridium, and platinum. Galvanic initiation . Copper, silver, gold, beryllium, aluminum, carbon, vanadium, molybdenum, tungsten, chromium, selenium, titanium, and uranium. Cannot be plated . Bismuth, cadmium, tin, lead, and zinc (electroplate with copper, then use electroless nickel...