1-20 of 214 Search Results for

gold plating

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Image
Published: 30 April 2021
Fig. 13.13 Corrosion on nickel-silver eyewear frames. The shiny area is gold plating. 50× optical magnification More
Image
Published: 01 December 2015
Fig. 7 Fretting of cobalt-gold-plated copper flats in contact with solid gold in an electrical contact. (a) After 1000 cycles. (b) After 10 4 cycles. (c) After 10 5 cycles. (d) After 10 6 cycles. Source: Ref 8 More
Image
Published: 01 April 2004
Fig. 4.5 Melting behavior of gold-plated tin foil having an effective composition of Au-30Sn More
Image
Published: 01 April 2004
Fig. 4.6 Remelting behavior of gold-plated tin foil More
Image
Published: 01 April 2004
Fig. 5.21 (a) Solder spread sample on a gold-plated substrate. The solder is Pb-60Sn, and the substrate is copper plated with 5 μm (200 μin.) of nickel and then 5 μm (200 μin.) of gold. At least three distinct microstructural bands are visible. (b) Micrograph of a joint made using the same More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030117
EISBN: 978-1-62708-282-2
... of penetrating nearby buildings. Electrical connectors for low-current circuits are generally gold or gold-base alloys. Because of the high cost of gold, very thin electroplated gold coatings are used for contacts. Gold plate thicknesses as small as 0.25 μm (0.01 mil) are used. When electric contacts...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t5123000x
EISBN: 978-1-62708-351-5
... the earliest forms of metalwork often required joints, and the ingredients of common brazes were either of noble metals or base metals extracted from readily winnable ores, brazing appears to predate soldering heritage by 2 to 3 millennia, despite the higher temperatures involved. Brazing of gold...
Image
Published: 01 April 2004
Fig. 5.39 Parts of an 18 carat gold bracelet and matching earring set assembled using the gold-tin diffusion-soldering process at 450 °C (842 °F). The unusually low process temperature enables the face plates to retain much of their work-hardened strength and thereby accept a particularly high More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230189
EISBN: 978-1-62708-351-5
..., with respect to the eutectic valley linking the Au-3Si and Au-12.5Ge binary eutectics. It is coated with a gold plating to inhibit formation of dross and thereby facilitate wetting and spreading of the solder. The thinness of the plating means that preforms have a finite shelf life, although it is several...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
... that electroplating is the preferred method for applying gold coatings, the components should be provided with typically 3 to 4 μm (120 to 160 μin.) thick platings of gold to confer an adequate solderable shelf life. Then, immediately prior to the soldering operation, the level of gold can be considerably reduced...
Image
Published: 01 April 2004
Fig. 2.27 Microsection through a joint of varying width made using the 1.5Ag-92.5Pb-5Sn solder in the form of a paste to two electronic packaging components in lightweight Al-70Si (Osprey CE7 alloy), plated with nickel and gold. The blackish region constituting the joint is the solder, which More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440049
EISBN: 978-1-62708-352-2
... not automatically imply a lack of wetting. For example, all solders will wet platinum, but only gold-base solders will spread on this metal. Limited erosion of the parent metals at the joint interface. The associated alloying, which must occur to form a metallic bond, should not result in the formation of either...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850538
EISBN: 978-1-62708-260-0
..., gold, beryllium, aluminum, carbon, vanadium, molybdenum, tungsten, chromium, selenium, titanium, and uranium. Cannot be plated . Bismuth, cadmium, tin, lead, and zinc (electroplate with copper, then use electroless nickel). A wide variety of nonmetals such as plastics, wood, glass, carbide...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300227
EISBN: 978-1-62708-323-2
... are expensive: Au at $1226, Ag at $15, and Pt at $847 per ounce on August 15, 2018. Unfortunately, these metals have industrial importance; there are essential technologies that depend on them. Gold is often necessary for electrical contacts. Silver has many uses in plating processes, and platinum can...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230047
EISBN: 978-1-62708-351-5
... ratios of 400:1, without intermediate annealing. Production of wire and foil preforms is, therefore, particularly easy. Other cadmium-free alternatives to silver-copper-zinc-cadmium brazes are mentioned in section 2.1.12 . 2.1.8 Gold-Base Brazes For many years, gold-bearing brazing alloys were...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 January 2023
DOI: 10.31399/asm.tb.itfdtktmse.t56060001
EISBN: 978-1-62708-440-6
... is for decorative coatings, such as gold leaf that was used in ancient India more than 5000 years ago. Thin films are used for decoration to a lesser extent today, as paints and plating are both easier to apply and less costly. There are, however, still some aesthetic uses for thin films. As an example, thin-film...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... conductivity (77 W/m · K) than high-lead solders, lower thermal expansivity (20 × 10 –6 /K), and, moreover, foil can be produced by hot rolling at 250 °C (482 °F). Fluxless attachment of gold-metallized silicon die to silver-plated copper leadframes has been demonstrated with this solder using a die-bonding...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240597
EISBN: 978-1-62708-251-8
... Abstract This chapter discusses the compositions, properties, and applications of nonferrous metals, including zirconium, hafnium, beryllium, lead, tin, gold, silver, and platinum group metals. It also addresses fusible alloys and provides melting temperatures for several compositions...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 January 2023
DOI: 10.31399/asm.tb.itfdtktmse.9781627084406
EISBN: 978-1-62708-440-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060073
EISBN: 978-1-62708-261-7
... Jordan 5000–3000 B.C. Chalcolithic period: melting of copper; experimentation with smelting Near East 3000–1500 B.C. Bronze Age: arsenical copper and tin bronze alloys Near East 3000–2500 B.C. Lost-wax casting of small objects Near East 2500 B.C. Granulation of gold and silver...