Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.

This article discusses the compositions, properties, and uses of silver, gold, and platinum group metals, including platinum, rhodium, iridium, ruthenium, and osmium. It describes the role of various alloying elements and explains how they affect physical, mechanical, and electrical properties as well as corrosion resistance.

This chapter discusses the compositions, properties, and applications of nonferrous metals, including zirconium, hafnium, beryllium, lead, tin, gold, silver, and platinum group metals. It also addresses fusible alloys and provides melting temperatures for several compositions.

The discovery and use of materials have shaped civilization since ancient times. This chapter traces the history of the use of metals from hammered copper estimated to be 11,000 years old to the development of electrolytically refined aluminum in 1884. The discussion covers the advent of the Bronze Age, extraction of metals from their respective ores, and the discovery of modern metals such as chromium, vanadium, platinum, and titanium.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

This chapter presents an overview of families of brazing alloys that one is likely to encounter in a manufacturing environment. It discusses the metallurgical aspects of brazing and includes a survey of brazing alloy systems. A discussion of deleterious and beneficial impurities is provided with examples. The chapter also describes the application of phase diagrams to brazing.

Nonferrous metals are of commercial interest both as engineering materials and as alloying agents. This chapter addresses both roles, discussing the properties, processing characteristics, and applications of several categories of nonferrous metals, including light metals, corrosion-resistance alloys, superalloys, refractory metals, low-melting-point metals, reactive metals, precious metals, rare earth metals, and metalloids or semimetals. It also provides a brief summary on special-purpose materials, including uranium, vanadium, magnetic alloys, and thermocouple materials.

This article discusses the general purpose of alloying and identifies some of the material properties and behaviors that can be improved by adding various elements to the base metal. It explains how alloying can make metals stronger and more resistant to corrosion and wear as well as easier to cast, weld, form, and machine. It also discusses some of the alloying techniques that have been developed to address problems stemming from dissimilarities between the base metal and alloying or inoculate material.

This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.

This chapter provides an account of the pre-Columbian history of metal discovery in America and then reviews the development of metallurgy in the Middle Ages from early wrought iron practices to the use of coke in iron casting. It discusses the influence of the family of Abraham Darby in England in the development of ironmaking.

This chapter presents the theory and practice associated with the application of thin films. The first half of the chapter describes physical deposition processes in which functional coatings are deposited on component surfaces using mechanical, electromechanical, or thermodynamic techniques. Physical vapor deposition (PVD) techniques include sputtering, e-beam evaporation, arc-PVD, and ion plating and are best suited for elements and compounds with moderate melting points or when a high-purity film is required. The remainder of the chapter covers chemical vapor deposition (CVD) processes, including atomic layer deposition, plasma-enhanced and plasma-assisted CVD, and various forms of vapor-phase epitaxy, which are commonly used for compound films or when deposit purity is less critical. A brief application overview is also presented.

This chapter provides a brief review of the history of metal working processes, the use of lubricants, and the study of friction and wear. It also explains how the book is organized and describes the method of treatment used by the authors.

This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.

This chapter covers the tribological properties of stainless steel and other corrosion-resistant alloys. It describes the metallurgy and microstructure of the basic types of stainless steel and their suitability for friction and wear applications and in environments where they are subjected to liquid, droplet, and solid particle erosion. It also discusses the tribology of nickel- and cobalt-base alloys as well as titanium, zinc, tin, aluminum, magnesium, beryllium, graphite, and different types of wood.

Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.