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Book Chapter
Filler Metals for Carat Gold and Hallmark Silver Jewelry
Available to PurchaseBook: Principles of Brazing
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230189
EISBN: 978-1-62708-351-5
... Abstract Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry...
Abstract
Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.
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Fretting of cobalt-gold-plated copper flats in contact with solid gold in a...
Available to PurchasePublished: 01 December 2015
Fig. 7 Fretting of cobalt-gold-plated copper flats in contact with solid gold in an electrical contact. (a) After 1000 cycles. (b) After 10 4 cycles. (c) After 10 5 cycles. (d) After 10 6 cycles. Source: Ref 8
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Gold-nickel phase diagram. The erosion of a nickel substrate by a gold-nick...
Available to PurchasePublished: 01 August 2005
Fig. 2.30 Gold-nickel phase diagram. The erosion of a nickel substrate by a gold-nickel braze and the associated change to the composition of the filler metal are indicated.
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Two micrographs at different magnifications of porous gold created by deall...
Available to Purchase
in Effects of Metallurgical Variables on Dealloying Corrosion[1]
> Corrosion in the Petrochemical Industry
Published: 01 December 2015
Fig. 1 Two micrographs at different magnifications of porous gold created by dealloying Ag 0.75 Au 0.25 in 0.1 M HClO 4 at 650 mV saturated mercury-mercury sulfate (MSE). The sample was then heat treated at 250 °C (480 °F) for 30 min to coarsen the porosity.
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in Effects of Metallurgical Variables on Dealloying Corrosion[1]
> Corrosion in the Petrochemical Industry
Published: 01 December 2015
Fig. 6 Current-potential behavior of various silver-gold alloys in the 1 M AgClO 4 + 1 M HClO 4 solution. Percent silver is given on curves. No selective dissolution was observed for alloys containing less than 60 at.% Ag. Source: Ref 26
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Summary of critical potentials as a function of the atomic percent of gold ...
Available to Purchase
in Effects of Metallurgical Variables on Dealloying Corrosion[1]
> Corrosion in the Petrochemical Industry
Published: 01 December 2015
Fig. 8 Summary of critical potentials as a function of the atomic percent of gold in the alloy for all alloys in various M AgClO 4 + 1 M HClO 4 . The points correspond to the data, and the curves are fits using Eq 3 . Source: Ref 26
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Published: 01 March 2012
Fig. 14.8 The aluminum-gold phase diagram. Source: Ref 14.6 as published in Ref 14.2
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Published: 01 July 2009
Fig. 15.3 Binary phase diagram of beryllium-gold. Source: Okamoto and Massalski 1987
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Color chart for gold-silver-copper alloys for jewelry and dental applicatio...
Available to PurchasePublished: 01 December 2001
Fig. 6 Color chart for gold-silver-copper alloys for jewelry and dental applications
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Secondary electron image of gold islands on a carbon substrate shows that v...
Available to PurchasePublished: 01 November 2019
Figure 27 Secondary electron image of gold islands on a carbon substrate shows that very high resolution SEM images are possible under the right conditions.
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RF MEMS switch. This is a gold cantilever that makes contact to the pad on ...
Available to Purchase
in Failure Analysis Techniques and Methods for Microelectromechanical Systems (MEMS)[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 7 RF MEMS switch. This is a gold cantilever that makes contact to the pad on the right.
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Temperature/pressure curve for diffusion bonding of gold, for a process tim...
Available to PurchasePublished: 01 April 2004
Fig. 1.32 Temperature/pressure curve for diffusion bonding of gold, for a process time of 1 h. The line on the graph differentiates between joints of acceptable (above) and unsatisfactory (below) tensile joint strength after fabrication.
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Erosion of a gold metallization by molten indium as a function of reaction ...
Available to PurchasePublished: 01 April 2004
Fig. 2.2 Erosion of a gold metallization by molten indium as a function of reaction time and temperature. Similar results are obtained for indium-base solders, including gold-indium, silver-indium, indium-lead, and indium-tin.
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Gold-rich portion of the Au-Si-Sn phase diagram. The system can be divided ...
Available to PurchasePublished: 01 April 2004
Fig. 2.26 Gold-rich portion of the Au-Si-Sn phase diagram. The system can be divided into three regions by melting point. The circle indicates the alloy composition selected as the solder. Adapted from Prince, Raynor, and Evans [1990 ]
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Erosion of gold by molten tin as a function of reaction time and temperatur...
Available to PurchasePublished: 01 April 2004
Fig. 2.36 Erosion of gold by molten tin as a function of reaction time and temperature
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