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Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230189
EISBN: 978-1-62708-351-5
... Abstract Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry...
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Published: 01 December 2015
Fig. 7 Fretting of cobalt-gold-plated copper flats in contact with solid gold in an electrical contact. (a) After 1000 cycles. (b) After 10 4 cycles. (c) After 10 5 cycles. (d) After 10 6 cycles. Source: Ref 8 More
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Published: 01 August 2005
Fig. 2.30 Gold-nickel phase diagram. The erosion of a nickel substrate by a gold-nickel braze and the associated change to the composition of the filler metal are indicated. More
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Published: 01 January 2000
Fig. 8 Potential-pH diagrams for iron and gold. The broad-banded, cross hatched area in the iron E -pH diagram represents a region of passivity. The narrow-banded cross-hatched areas represent where iron and gold will corrode. More
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Published: 01 March 2002
Fig. 6.23 A vacuum sputtering device used to deposit a thin coating of gold, or some other element, onto the surface of a SEM or EMPA specimen. Source: Polaron Instruments, Inc. More
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Published: 01 June 1988
Fig. 10.18 Hand-operated fixture for brazing of jewelry settings to gold rings by induction methods. From J. Libsch and P. Capolongo, Lepel Review , Vol 1, No. 5, p 1 ( Ref 9 ) More
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Published: 30 April 2021
Fig. 13.13 Corrosion on nickel-silver eyewear frames. The shiny area is gold plating. 50× optical magnification More
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Published: 01 November 2019
Figure 27 Secondary electron image of gold islands on a carbon substrate shows that very high resolution SEM images are possible under the right conditions. More
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Published: 01 November 2019
Figure 7 RF MEMS switch. This is a gold cantilever that makes contact to the pad on the right. More
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Published: 01 December 2015
Fig. 1 Two micrographs at different magnifications of porous gold created by dealloying Ag 0.75 Au 0.25 in 0.1 M HClO 4 at 650 mV saturated mercury-mercury sulfate (MSE). The sample was then heat treated at 250 °C (480 °F) for 30 min to coarsen the porosity. More
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Published: 01 December 2015
Fig. 6 Current-potential behavior of various silver-gold alloys in the 1 M AgClO 4 + 1 M HClO 4 solution. Percent silver is given on curves. No selective dissolution was observed for alloys containing less than 60 at.% Ag. Source: Ref 26 More
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Published: 01 December 2015
Fig. 8 Summary of critical potentials as a function of the atomic percent of gold in the alloy for all alloys in various M AgClO 4 + 1 M HClO 4 . The points correspond to the data, and the curves are fits using Eq 3 . Source: Ref 26 More
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Published: 01 June 2008
Fig. 3.8 Gold-copper phase diagram More
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Published: 01 July 2009
Fig. 15.3 Binary phase diagram of beryllium-gold. Source: Okamoto and Massalski 1987 More
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Published: 01 December 2001
Fig. 6 Color chart for gold-silver-copper alloys for jewelry and dental applications More
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Published: 01 March 2012
Fig. 14.8 The aluminum-gold phase diagram. Source: Ref 14.6 as published in Ref 14.2 More
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Published: 01 April 2004
Fig. 1.32 Temperature/pressure curve for diffusion bonding of gold, for a process time of 1 h. The line on the graph differentiates between joints of acceptable (above) and unsatisfactory (below) tensile joint strength after fabrication. More
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Published: 01 April 2004
Fig. 2.1 Gold-indium phase diagram More
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Published: 01 April 2004
Fig. 2.2 Erosion of a gold metallization by molten indium as a function of reaction time and temperature. Similar results are obtained for indium-base solders, including gold-indium, silver-indium, indium-lead, and indium-tin. More
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Published: 01 April 2004
Fig. 2.20 Gold-silicon phase diagram More