Figure 3.12 Transmission of a Fabry-Perot etalon vs. frequency showing laser frequency and change in rf sideband frequency to maintain resonance with thermal expansion. More

Fig. 5.63 Schematic influence of loading frequency on fatigue crack growth for three classes of environments. (a) Little or no effect of frequency, as in vacuum, inert gas, or air. (b) Fatigue crack growth increases with decreasing frequency, as in methanol. (c) Cyclic stress-corrosion More

Fig. 5.70 Three-dimensional representation of effects of frequency and temperature on fatigue crack growth rate in air. Source: Ref 5.85 More

Fig. 7.17 Effect of cyclic frequency on fatigue crack growth rates in (a) PS and (b) PC. Source: Ref 7.25 More

Figure 33 This is a thermal infrared image of a GaAs radio frequency amplifier. The circuit isn’t powered and there is no external illumination. The detected infrared is all from the IC and all of the contrast is due to emissivity differences. The metal lines and pads emit much less infrared More

Figure 12 Image obtained with transducer T1. Received transducer frequency was measured at 75 MHz. More

Figure 35 Using signal amplitude for focus determination of high frequency transducers can be misleading. A 180 MHz transducer was positioned over a flip chip at the proper pulse-echo focus position. It was then moved through the focus, closer to the die. The out-of-focus position produces More

Figure 36 Using signal amplitude for focus determination of high frequency transducers can be misleading. One workaround is to perform a high digital resolution focus series such as shown here. The numbers refer to the front surface reflection water path time of flight. For this die thinned More

Figure 39 A bump anomaly detected by high-frequency PE-SAM (A: arrow). A slight shift in the data gate produces a SAM image that reveals cracking just outside the bump perimeter (B: arrow), confirmed in an SEM cross-section (C: arrow). More

Figure 41 Optical (A) and high frequency PE-SAM (B) image comparison shows SAM capability for three types of defects. A Broken bump (1) and massive solder bridging (3) are clear in the SAM image. Solder bumps of reduced size (2) are not detected by SAM. The “edge effect” phenomenon, which More

Figure 10 Effect of increased frequency on the propagation of the signal [14] . More

Figure 3 Schematic of a stacked die device (top). The phase shift to frequency characteristic (bottom) is calculated and measured enabling a fingerprinting of the defect site related to the die level [4] , [5] . More

Figure 11 Relative Intensity Noise (RIN) vs. frequency for a super-luminescent diode (SLD), a laser source (HSL), and a cooled high-power incoherent light source (cHIL). Measurements were acquired at 1.3um. Figure has been reproduced with kind permission from Hamamatsu Photonics. More

Figure 13 (a) (c) Reflected laser image and (b) (d) frequency map signals on random digital logic of a 28 nm technology device. (a) and (b) are performed on a water-cooled tester; (c) and (d) are performed on an air-cooled tester. Bounding boxes indicate scan cells locations More

Figure 6-12 Arithmetic frequency histogram of the random intercept measurements of the duplex grain structure shown in Fig. 6-11 . More

Figure 6-13 Logarithmic frequency distribution curve of the random intercept measurements of the duplex grain structure shown in Fig. 6-11 . More

Figure 6-25 Frequency histogram of shape factors measured on flake, compacted, and nodular graphite samples. More

Fig. 2 Typical power-frequency regions of induction heat treatment applications. Source: Ref 15 , 19 More

Fig. 11 Induction heating system for gear wheel heating by double frequency (medium/high). Source: Ref 27 More

Fig. 35 Influence of high-frequency generator on selection of power density and heating time with given thickness of surface induction-hardened layer. Source: Ref 2 , 20 More