The appendix contains detailed simulation examples through which readers learn how to format and analyze problems using the LAMMPS molecular dynamics simulator. By means of simulation, readers will determine the thermal expansion coefficient of copper, generate stress-strain plots for aluminum at different temperatures, calculate the surface energy of copper for different crystal orientations, investigate diffusion effects in BCC iron, estimate the sliding friction between graphene layers, compare the stacking fault energy of silver and aluminum, and analyze the properties and behaviors of liquids and gases. All examples employ a systematic problem-solving approach and include necessary input code.

This chapter familiarizes readers with the basic theory of molecular dynamics and its application in the study of materials. It explains how material properties and behaviors are determined through the iterative calculation of motion equations for a collection of atoms under a given set of conditions. It also provides a walk-through on the use of LAMMPS, an open-source molecular dynamics simulator, discussing the selections and inputs of relevance to practical materials problems.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

The results of certain heat treating processes must be verified for case quality and case depth by destructively sectioning a part or parts that were subjected to the process. Test coupons or test pins are often used for diffusion processes such as carburizing, carbonitriding, nitriding, and ferritic nitrocarburizing to provide an accurate heat treating process evaluation. This appendix briefly describes the advantages and selection and design considerations of test coupons. A typical example of the use of test pins for monitoring carburizing and hardening of gears is provided.

This chapter is a brief account of various factors pertinent to the development of an engineering component. The discussion covers the disciplines and interactions of design development, engineering of component design, validation of design and process analysis, and matrix of design and manufacturing elements.

This chapter gives an overview of how steel castings may be effectively adapted to modern concurrent engineering processes. The chapter discusses computer aided design programs, solid modeling, solidification simulation programs, and rapid prototyping.

A typical mobile processor die may contain, among other things, a variety of high-performance as well as low-power processing cores along with 5G modems, Wi-Fi modules, image processors, GPUs, and security modules, with a total transistor count exceeding 10 billion. Such designs pose many challenges for yield ramp and diagnostics. This chapter examines these challenges and the growing demand for innovative solutions to help failure analysts quickly and accurately isolate faults. It also assesses the capabilities and future potential of ATPG scan diagnostics, streaming scan networks, and advanced fault models for diagnosing embedded memory.

Carbonitriding introduces and diffuses atomic nitrogen into the surface steel during carburization. This chapter focuses on case composition of a carbonitrided case, case depth, case hardenability, hardness gradients, void formation, and applications of carbonitriding. The chapter discusses furnaces suitable for carbonitriding, atmosphere constituents, batch furnace atmospheres, continuous furnace atmospheres, safety, temperature selection, quenching, tempering, and hardness testing of a carbonitrided case.

This chapter provides insights into the work of a stainless steel pioneer, Harry Brearley. It explains how Brearley's early life and experience led him to become a self-trained chemist and metallurgist.

This chapter explains how to take the known facts of a specific failure, place them in a systematic context to arrive at a logical conclusion, and point to a corrective measure. It presents example examinations to describe a systematic approach to failure examination.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

This article addresses critical aspects in bond testing of thermal spray coatings and provides step-by-step guidance for obtaining representative and reproducible test results based on ASTM C633 and other applicable industry standards. It clarifies details of ASTM C633 requirements and provides examples of the best practice confirmed by hundreds of tests performed worldwide, adopted by numerous industrial standards, and requested to comply with international technical standardization and certification organizations such ISO, AS, SAE, and Nadcap.

This chapter provides an overview of how the disciplines of design, material, and manufacturing contribute to engineering for functional performance. It describes the interaction of product designers and casting engineers in product development. It discusses the consequences of component failure, uncertainty in data and assumptions, and selection of the factor of safety. The chapter also presents an overview of the functional requirements for product performance and provides an overview of product design development. It also presents a partial list of the different tests that are performed on prototypes and examples of product testing. The chapter describes the requirements of a traceability system.

This appendix provides a brief introduction to Thermo-Calc, explains what it is, and lists its uses. Instructions for accessing a demonstration version of the software are also provided.

This chapter presents the usefulness of martensitic chromium stainless steels discovered in England and America, the usefulness of ferritic chromium stainless steels discovered in America, and the usefulness of chromium-nickel stainless steels discovered in Germany. It also provides a short note on the usefulness of chromium-silicon steels.