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Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field analysis have proven the validity of using MFI for 3D FI and 3D current mapping. This article briefly discusses the fundamentals of the technique, paying special attention to critical capabilities like sensitivity and resolution, limitations of the standard technique, sensor requirements and, in particular, the solution to the 3D problem, along with examples of its application to real failures in devices.

This chapter discusses three measurements parameters: temperature, strain, and magnetic field strength. It stresses the measurement of temperature because it is the primary variable in nearly all low-temperature material properties. The chapter contains information on methods and auxiliary materials. Areas of frequent concern, such as thermal contact, heat leak, thermal anchoring, thermal conductivity of greases, insulators, lead wires, ground loops, and feedthroughs are also reviewed. The chapter provides an overview and historical development of temperature scales because the practical use of all thermometers is associated with some approximation of the thermodynamic temperature scale. A short section is devoted to types of temperature measuring devices. The characteristics of commercially available resistance-type strain gauges at low temperatures are stressed.