Quantifying a fault-tree analysis is a useful tool for assessing the most likely causes of a system failure. This chapter addresses fault-tree analysis event probabilities and ranking of failure causes based on these probabilities. Failure rates, failure-rate sources, probability determinations, mean times between failure, and related topics are also discussed. The discussion covers the practices observed in fault-tree analysis quantification and processes involved in calculating the probability of the top undesired event.

This chapter discusses the importance of failure analysis and the role it plays in a society driven by technological advancement. It explains why failure rates are highest in the early and later stages of the life of any product and shows the extent to which failure rates increase when products are subjected to an aggressive operating environment.

This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design along with an example. The chapter then discusses the purposes of reliability engineering and introduces four basic statistical distribution functions useful in reliability engineering, namely normal, lognormal, exponential, and Weibull. It also provides information on three fundamental acceleration models used by reliability engineers: Arrhenius, Eyring, and power law models. The chapter concludes with information on failure rates and mechanisms and the two techniques for uncovering reliability issues, namely burn-in and outlier screening.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.

In some cases, the failure analysis team finds that all components meet their requirements, the system was properly assembled, and it was not operated or tested in an out-of-specification manner, yet it still failed. When this occurs, the only conclusion the failure analysis team can reach is that it missed something in its analysis or that the design is defective. This chapter focuses on the latter possibility by discussing the various factors that a failure analysis team should consider to identify the causes of defects in system design. These include requirements identification and verification, circuit performance, mechanical failures, materials compatibility, and environmental factors. Examples that illustrate the value of design analysis are also presented.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

This chapter addresses the challenge of selecting an appropriate stress-corrosion cracking (SCC) test to evaluate the serviceability of a material for a given application. It begins by establishing a generic model in which SCC is depicted in two stages, initiation and propagation, that further subdivide into several zones plus a transition region. It then discusses SCC test standards before describing basic test objectives and selection criteria. The chapter explains how to achieve the required loading conditions for different tests and how to prepare test specimens to determine elastic strain, plastic strain, and residual stress responses. It also describes the difference between smooth and precracked specimens and how they are used, provides information on slow-strain-rate testing and how to assess the results, and discusses various test environments and procedures, including tests for weldments. The chapter concludes with a section on how to interpret time to failure, threshold stress, percent survival, stress intensity, and propagation rate data, and assess the precision of the associated tests.

Failure investigation is an integral part of any design and manufacturing operation, providing critical information to solve manufacturing problems and assist in redesigns. This chapter addresses several aspects of failure investigation, beginning with the challenges of organizing such efforts and the need to define a clear and concise goal, direction, and plan prior to the investigation. It covers the causes of failure and the training and education organizations require to understand and prevent them. The chapter emphasizes the importance of discovering the root cause of failures, and uses examples to explain the factors involved and how to recognize them when the first appear.

The ability to accurately assess the remaining life of components is essential to the operation of plants and equipment, particularly those in service beyond their design life. This, in turn, requires a knowledge of material failure modes and a proficiency for predicting the near and long term effects of mechanical, chemical, and thermal stressors. This chapter presents a broad overview of the types of damage to which materials are exposed at high temperatures and the approaches used to estimate remaining service life. It explains how operating conditions in power plants and oil refineries can cause material-related problems such as embrittlement, creep, thermal fatigue, hot corrosion, and oxidation. It also discusses the factors and considerations involved in determining design life, defining failure criteria, and implementing remaining-life-assessment procedures.

The susceptibility of plastics to environmental failure, when exposed to organic chemicals, limits their use in many applications. Environmental factors can be classified into two categories: chemical and physical effects. This article discusses the effects of these environmental factors on the mechanical properties of plastics.

This article discusses the material and engineering issues associated with plastic components subjected to impact. The first part covers the effects of loading rate, temperature, and state of stress on both deformation and mode of failure. It discusses standard impact tests, along with their associated results. A brief discussion on the linear elastic fracture mechanics method is presented, along with an example of its effectiveness as a predictive tool for impact performance. Various issues with a bearing on impact performance, such as processing, chemical attack, and aging, are also described. The second part describes the engineering calculations used to predict the performance of thin plastic beams, plates, and shells. The issue of assuming small displacements for the calculation of plastic structure performance is discussed and its limitations described. An example of the consequence of the very low modulus of elasticity associated with plastics and some plastic design solutions are offered.