1-20 of 152 Search Results for

failure prevention

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130395
EISBN: 978-1-62708-284-6
... essential to understanding failure analysis of PM parts. This is followed by a section on case hardening of PM parts. The methods used for analyzing the failures are then discussed. Some case studies are given that illustrate different failures and the methods of prevention of these failures. failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... product by doing finger print of the trace elements in this small particle. Based on our failure Pareto, 30-40% of the field return failures in semiconductor products are caused by a process or material aberration. To solve the problem and prevent re-occurrence, our manufacturing...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.smnm.t52140039
EISBN: 978-1-62708-264-8
...; Rockwell, Brinell, Vickers, and Knoop hardness tests; and Charpy V-notch impact tests. The chapter also provides information on loading conditions that can lead to fatigue failure, and in some cases, counteract or prevent it. fatigue failure hardness test mechanical properties notched impact test...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.9781627083010
EISBN: 978-1-62708-301-0
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780189
EISBN: 978-1-62708-268-6
... into a failure analysis library. This library should be available as a reference tool to prevent future failures and to assist other failure analysis efforts on similar products. The library can be organized along product lines, processes, customers, or other factors significant to each business...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.fibtca.9781627082532
EISBN: 978-1-62708-253-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110269
EISBN: 978-1-62708-247-1
... negligible Marking of lokalized failures yes no Sometimes contact chains are not completely open but have a high resistance far beyond the specification because of a partially open contact. The leaking current through this faulty contact prevents charging and its localization with PVC. This...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780001
EISBN: 978-1-62708-268-6
..., repair centers, and fielded systems). Follow-up after corrective actions have been implemented to assess corrective action efficacy. Evaluate other potential failure causes as corrective action candidates, and incorporate preventive actions where it makes sense to do so. Incorporate failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... Abstract As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130503
EISBN: 978-1-62708-284-6
... Abstract Failure analysis of steel welds may be divided into three categories. They include failures due to design deficiencies, weld-related defects usually found during inspection, and failures in field service. This chapter emphasizes the failures due to various discontinuities in the steel...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130111
EISBN: 978-1-62708-284-6
... (corrosion) is also provided. failure analysis fracture distortion wear environmentally assisted corrosion FAILURE ANALYSIS is the process of collecting, examining, and interpreting damage evidence. The objective is to understand the possible conditions leading to a failure and perhaps prevent...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
.... Figure 7 shows another example of a maverick failure. Spittle contamination on the bondpad prevented the wirebond from making good contact as it would with a clean bondpad. The wirebond then becomes detached during operation, causing failure due to an open circuit at the wirebond. Fig 7 Weak...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.9781627082563
EISBN: 978-1-62708-256-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130043
EISBN: 978-1-62708-284-6
... FAILURES IN STEEL components, like any other material, may have various consequences, such as: Making the device or component completely inoperable Preventing an operable device from functioning satisfactorily Making the device or component unsafe or unreliable, with immediate removal from...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... Abstract X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780019
EISBN: 978-1-62708-268-6
... incomprehensible. It was precisely this hypothesized system failure that led to the creation of the fault-tree analysis technique. The U.S. Air Force realized it had no analytical tool that could adequately define (and thereby allow people to prevent) conditions that would result in such an event. To respond to...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130133
EISBN: 978-1-62708-284-6
... Abstract This article presents six case studies of failures with steel forgings. The case studies covered are crankshaft underfill; tube bending; spade bit; trim tear; upset forging; and avoidance of flow through, lap, and crack. The case studies illustrate difficulties encountered in either...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280323
EISBN: 978-1-62708-267-9
... Abstract This chapter discusses the failure of superalloy components in high-temperature applications where they are subject to the effects of microstructural changes, melting, and corrosion. It explains how overheating can deplete alloying elements and alter the composition and distribution of...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
... recommended for more details. Over the years, many processes have been developed to minimize/eliminate crystalline oxide growth [10 , 11] , such as preventing or removing contaminants, etc. With the demand for lower and lower ESR, from hundreds to tens and even to single digit milliohms, ESR failures...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
... Abstract Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of...