This chapter describes some common pitfalls encountered in failure investigations and provides guidance to help engineers recognize processes and “quick fixes” that companies often try to substitute for failure analysis. It discusses three important skills and characteristics that a professional engineer must improve to conduct an effective and successful failure investigation, namely technical skills, communication skills, and technical integrity. The chapter also provides information on the additional basic tools available for failure investigation and root cause determination: the Kepner-Tregoe structured problem-solving method, PROACT software for root cause analysis developed by the Reliability Center, Inc., and other processes and methods developed by the Failsafe Network, Inc., and Shainin LLC.

This chapter discusses the failure of an aileron control cable in an aircraft and explains how investigators determined the cause. Based on their observations and the results of SEM fractography, investigators concluded that the cable had been damaged by a shearing tool, leading to its failure.

This chapter describes some of the most effective tools for investigating boiler tube failures, including scanning electron microscopy, optical emission spectroscopy, atomic absorption spectroscopy, x-ray fluorescence spectroscopy, x-ray diffraction, and x-ray photoelectron spectroscopy. It explains how the tools work and what they reveal. It also covers the topic of image analysis and its application in the measurement of grain size, phase/volume fraction, delta ferrite and retained austenite, inclusion rating, depth of carburization/decarburization, scale thickness, pearlite banding, microhardness, and hardness profiles. The chapter concludes with a brief discussion on the effect of scaling and deposition and how to measure it.

This chapter discusses the role of failure analysis in cases involving product liability, property damage, and personal injury litigation. It also explains how material science and technology shed light on criminal activities such as smuggling, counterfeiting, theft, and the willful destruction of property.

This chapter describes the nine steps of a failure investigation. The steps add detail to the problem-solving process introduced in Chapter 3. The first five steps are (1) understanding and negotiating the investigation goals, (2) obtaining an understanding of the failure, (3) objectively and clearly identifying all possible root causes, (4) evaluating the likelihood of each root cause, and (5) converging on the most likely root cause(s). Many failure investigations stop at this point, but significant value is provided in the next four steps, which are (6) identifying all possible corrective actions, (7) evaluating each corrective action, (8) selecting the optimal corrective action(s), and (9) evaluating the effectiveness of each corrective action. Each step is discussed in detail with examples along with information on the procedures to be followed and resources needed for the investigation.

Failure investigation is an integral part of any design and manufacturing operation, providing critical information to solve manufacturing problems and assist in redesigns. This chapter addresses several aspects of failure investigation, beginning with the challenges of organizing such efforts and the need to define a clear and concise goal, direction, and plan prior to the investigation. It covers the causes of failure and the training and education organizations require to understand and prevent them. The chapter emphasizes the importance of discovering the root cause of failures, and uses examples to explain the factors involved and how to recognize them when the first appear.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

Statistics, data analysis, root cause analysis, and problem-solving processes play a key role in failure investigations. This chapter explains how to collect failure investigation data, how to build and maintain a database for company-related failures, and how to use corresponding statistics including type of failure, material, and root cause. It describes the purpose and benefits of conducting a root cause analysis and the factors, namely relative failure importance and company value, that determine when an investigation should be performed. The chapter also discusses the four-step problem-solving process as it applies to failure investigation, how to assemble an investigation team, and the details of organization and planning. It concludes with a case history of the Firestone 500 steel-belted tire failure, stressing the importance of a systematic approach to failure investigations.

This chapters discusses the basic steps in the failure analysis process. It covers examination procedures, selection and preservation of fracture surfaces, macro and microfractography, metallographic analysis, mechanical testing, chemical analysis, and simulated service testing.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

This chapter addresses the issue of die failures in hot and cold forging operations. It describes failure classifications, fatigue fracture and wear mechanisms, analytical wear models, and the various factors that limit die life. It also includes several case studies in which finite-element modeling is used to predict die failure and extend die life.

This chapter discusses the forming characteristics of dual-phase (DP) and transformation-induced plasticity (TRIP) steels. It begins with a review of the mechanical behavior of advanced high-strength steels (AHSS) and how they respond to stress-strain conditions associated with deformation processes such as stretching, bending, flanging, deep drawing, and blanking. It then describes the complex tribology of AHSS forming operations, the role of lubrication, the effect of tool steels and coatings, and the force and energy requirements of various forming presses. It also discusses the cause of springback and explains how to predict and compensating for its effects.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

In this overview of diagnosis of scan logic and diagnosis driven failure analysis, the authors explore the world of diagnosis of digital semiconductors devices. After shortly outlining the technology behind diagnosis, the main part of this article describes key improvements to the basic diagnosis tools, discussing their merits for the failure analysis engineer. The article also describes the various requirements and other considerations that typically need to be taken into account to set up a full working scan diagnosis system. It summarizes the principles of design with embedded compression technologies. Finally, several successful industrial applications of diagnosis are presented.

This chapter provides guidelines for conducting metallographic evaluations and offers suggestions on how to effectively report the results. It explains how the approach depends on the objective of the evaluation, which is usually to measure a structural feature, test a hypothesis, or investigate structure-related effects. The chapter addresses each case, tailoring its guidelines and suggestions accordingly.

This chapter discusses the basic steps of a failure investigation. It explains that the first step is to gather and document information about the failed component and its operating history. It advises investigators to visit the failure site as soon as possible to record damages and collect test specimens for subsequent examination and chemical analysis. It also discusses the role of mechanical property testing, the use of nondestructive evaluation, and the final step of generating a report.

Failure analysis is a systematic investigative procedure using the scientific method to identify the causes of a failure. This chapter begins by exploring what failure analysis is followed by a section describing the sequence of stages in the investigation and analysis of failure and the three principles that must be carefully followed during the analysis. It then provides information on the normal location of fracture and concludes with a list of questions to ask about fractures.

This chapter provides a detailed analysis of the deep drawing process. It begins by explaining that different areas of the workpiece are subjected to different types of forces and loads, equating to five deformation zones. After describing the various zones, it discusses the effect of key process parameters including the draw ratio, material properties, geometry, interface conditions, equipment operating speed, and tooling. It then walks through the steps involved in predicting stress, strain, and punch force using the slab method and finite element analysis and presents the results of simulations conducted to assess the influence of blank diameter, thickness, and holding force as well as strain-hardening and strength coefficients. It also discusses the cause of defects in deep drawn rectangular cups and presents the case study of a deep drawn rectangular cup made from an aluminum blank.

This chapter discusses the use of finite-element modeling in forging design. It describes key modeling parameters and inputs, mesh generation and computation time, and process modeling outputs such as metal flow, strain rate, loading profiles, and microstructure. It also includes a variety of application examples.