Search Results for failure analyst

Education and training play an important role if the failure analyst is to be successful in his or her work. This article discusses the history of training activities in the failure/product analysis discipline and describes where this area is heading. It provides information on three areas of education and training that should be given to the analyst for him or her to be successful developing and fielding modern semiconductor components: analysis process, technology, and technique training.

This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design along with an example. The chapter then discusses the purposes of reliability engineering and introduces four basic statistical distribution functions useful in reliability engineering, namely normal, lognormal, exponential, and Weibull. It also provides information on three fundamental acceleration models used by reliability engineers: Arrhenius, Eyring, and power law models. The chapter concludes with information on failure rates and mechanisms and the two techniques for uncovering reliability issues, namely burn-in and outlier screening.

Designs and materials continue to become more complex, with novel technologies developed to create them, and novel instruments invented to analyze them. Engineers at all stages of the design and manufacturing process should appreciate the reasons why formal failure analysis is performed. This chapter describes why failure analysis is conducted and outlines the responsibilities of the failure analyst.

A typical mobile processor die may contain, among other things, a variety of high-performance as well as low-power processing cores along with 5G modems, Wi-Fi modules, image processors, GPUs, and security modules, with a total transistor count exceeding 10 billion. Such designs pose many challenges for yield ramp and diagnostics. This chapter examines these challenges and the growing demand for innovative solutions to help failure analysts quickly and accurately isolate faults. It also assesses the capabilities and future potential of ATPG scan diagnostics, streaming scan networks, and advanced fault models for diagnosing embedded memory.

Several components from the tail boom of a helicopter were found fractured at a crash site, including gusset plates, the hat section near the lower yoke, and a cable that controls the pitch of the tail rotor. The components were recovered from the wreckage and taken to a lab for closer examination. Based on their observations and the results of SEM fractography, failure analysts concluded that the gusset plates failed due to a downward bending overload in tension and that the tail rotor control cable snapped due to tensile overload. There were no indications of delayed failure in any of the areas examined.

During cyclic spin tests, the turbine disc in an aircraft engine broke apart with a loud noise, followed by a fire. Based on a detailed examination and the results of SEM fractography and hardness measurements, failure analysts concluded that a locking plate became dislodged due to the shearing of the screws that hold it in place. They also provided recommendations to remediate the problem.

A titanium alloy disc on the fourth stage of an aircraft engine compressor was found cracked in the course of a defect investigation. The disc had not yet reached the halfway point of its expected service life. The chapter explains how the crack was examined and provides relevant details about its location on the disc and various aspects of its appearance. It also explains how failure analysts concluded that the disc had been subjected to a fluctuating load of high magnitude and that the crack was the result of two fatigue cracks, originating from opposite sides of the diaphragm.

A pair of bolts on a connecting rod failed during a test run for a prototype engine. They were replaced by bolts made from a stronger material that also failed, one due to fatigue, the other by tensile overload. The fracture surfaces on all four bolts were examined using optical and electron microscopes, indicating that the operating loads on the bolts far exceeded the design loads. Based on their observations, which are summarized in the report, failure analysts concluded that the design of the connecting rod system needs to be reassessed.

This chapter outlines the topics covered in the book and explains why and to whom the book was written. The book is intended for engineers, metallurgists, and failure analysts who work with materials and components that operate in high-temperature corrosive environments. It covers eight basic modes of high-temperature corrosion as well as the effect of external and residual stresses. It also provides an extensive amount of engineering data associated primarily with commercial alloys.

Failure analysis is a systematic investigative procedure using the scientific method to identify the causes of a failure. This chapter begins by exploring what failure analysis is followed by a section describing the sequence of stages in the investigation and analysis of failure and the three principles that must be carefully followed during the analysis. It then provides information on the normal location of fracture and concludes with a list of questions to ask about fractures.

Since the introduction of chip scale packages (CSPs) in the early 90s, they have continuously increased their market share due to their advantages of small form factor, cost effectiveness and PCB optimization. The reduced package size brings challenges in performing failure analysis. This article provides an overview of CSPs and their classification as well as their advantages and applications, and reveals some of the challenges in performing failure analysis on CSPs, particularly for CSPs in special package configurations such as stacked die multi-chip-packages (MCPs) and wafer level CSPs (WLCSPs). The discussion covers special requirements of CSPs such as precision decapsulation for fine ball grid array packages, accessing the failing die for MCP packages, and careful handling for WLCSP. Solutions and best practices are shared on how to overcome these challenges. The article also presents a few case studies to demonstrate how failure analysis work on CSPs can be successfully completed.

This appendix focuses on procedures, techniques, and precautions associated with the investigation and analysis of metallurgical failures that occur in service. It describes the steps of an orderly failure analysis from collecting and examining samples to performing mechanical and nondestructive tests, preparing and examining fractographs and micrographs, determining failure mode, writing the report, and developing follow-up recommendations. It also examines the fundamental mechanisms of failure, why they occur, and how to identify them by their characteristic features.

This chapters discusses the basic steps in the failure analysis process. It covers examination procedures, selection and preservation of fracture surfaces, macro and microfractography, metallographic analysis, mechanical testing, chemical analysis, and simulated service testing.

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

The management of a failure analysis (FA) laboratory requires a broad range of activities to optimize the efficiency of the operation. The purpose of this article is to stimulate readers to consider the various aspects of FA laboratory operations and their respective business management requirements. The various aspects include: staffing, laboratory organization, lab design and operations, strategic development, financial management, and metrics and measurements. References for further reading and examples of resource materials are also included.

The relationship of stress and strength gradients must be considered simultaneously in analysis of a particular type of fracture. This chapter discusses the principal elastic stress distribution in members of various shapes under different types of pure loads. A basic understanding of both the stress and strength gradients of metal parts with and without stress concentrations and under different types of loading is provided. The chapter also describes the effect of service conditions on applied stresses.

Failure investigation is an integral part of any design and manufacturing operation, providing critical information to solve manufacturing problems and assist in redesigns. This chapter addresses several aspects of failure investigation, beginning with the challenges of organizing such efforts and the need to define a clear and concise goal, direction, and plan prior to the investigation. It covers the causes of failure and the training and education organizations require to understand and prevent them. The chapter emphasizes the importance of discovering the root cause of failures, and uses examples to explain the factors involved and how to recognize them when the first appear.

This chapter discusses field, visual, physical, and metallurgical examinations of gear failures. Physical examinations reviewed include nondestructive testing, including magnetic-particle inspection, tooth characteristic studies, surface hardness testing, ultrasonic testing, nital etching, profilometer measurements, and dimensional checking. Metallurgical examinations reviewed include the cross-sectional hardness survey, macroscopic examination, carbon gradient traverse, chemical analysis, case hardness traverse [microhardness], microscopic examination, and scanning electron microscopy.

Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis approaches used for these components. It discusses different types of capacitors along with their constructions and failure modes. The types include tantalum, aluminum electrolytic, multi-layered ceramics, film, and super capacitors. The article then provides a discussion on the two common types of inductors, namely, common mode choke coil and surface mount powder choke coil.