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fail-active designs

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2017
DOI: 10.31399/asm.tb.sccmpe2.t55090341
EISBN: 978-1-62708-266-2
... concentrations at flaw tips. As a result, even relatively small flaws (20 to 50 μm in radius) can cause glasses and ceramics to fail. This chapter examines the propensity of flaws to grow in glass and ceramic materials exposed to different environments, especially water, at stresses well below those that would...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780147
EISBN: 978-1-62708-268-6
... components meet their requirements, the system was properly assembled, and it was not operated or tested in an out-of-specification manner, yet it still failed. When this occurs, the only conclusion the failure analysis team can reach is that it missed something in its analysis or that the design is...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130001
EISBN: 978-1-62708-284-6
... through a detailed stress analysis or by using approximate formulas that account for the most common cases. Design should be verified to confirm whether there are stress-concentration points that may activate failure mechanisms due to brittle fracture, corrosion, or fatigue. Examples of peak stresses...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.tb.cub.t66910301
EISBN: 978-1-62708-250-1
... occasionally overlooked is the surrounding environment. For example, the instrument tubing at a new facility, built at an existing chemical plant in West Virginia, consisted of a combination of copper (C12200) tubing and yellow brass (C27000) fittings. However, within a few weeks, the fittings had failed by...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030235
EISBN: 978-1-62708-282-2
... (real-world) approaches vary from plant to plant (or component to component) and include: The avoid-failure approach The keep-it-working approach The let-it-fail-then-repair approach Aspects germane to these approaches are summarized in Table 1 ( Ref 29 , 37 ). Table 1 Design...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870489
EISBN: 978-1-62708-314-0
... for carbon/epoxy tape The strength that a structure must possess is based on the ultimate combination of loads that will be applied under the most severe environmental conditions for the structure. However, to ensure that the structure will not fail at this ultimate load condition, a safety...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780055
EISBN: 978-1-62708-281-5
... that a design engineer can use to help determine the best material for an application. The strength of a resin over a range of temperatures may aid the engineer in determining if the part will fail under load. The impact performance of the resin, as indicated by the ductility ratio, can also be quite...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2018
DOI: 10.31399/asm.tb.aceg.t68410009
EISBN: 978-1-62708-280-8
... potential ways either a design or the process can fail, impairing the product quality or consistency, and what preventive measures or controls need to be implemented to prevent these potential failures. The designer prepares a design failure mode analysis (DFMEA) and the casting engineer prepares a process...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060407
EISBN: 978-1-62708-261-7
.... What is meant by conceptual design is the conscious activity of generating numerous ideas that are evaluated according to how well they meet the requirements of the design specification. An important part of concept evaluation is searching for weak spots. Many times the concept for a design has...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780064
EISBN: 978-1-62708-281-5
... modified. Injection molding of thermoplastics and compression molding of thermosetting plastics will continue to be the most useful, cost-effective ways of producing high-quality, high-volume parts. Other processes should be considered, however, when these basic methods fail to satisfy specific...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
... design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system. 22 nm technology device accelerated yield device failing memory test failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... does not necessarily locate aggressor operations, for all address, stuck-at, bridging, transition, and 2-cell coupling faults. An aggressor operation is a memory access that activates one or more bit cells into a failing state. The trade off for having a shorter test is the lack of ability to locate...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
..., and 5 nm in development. This has resulted in a corresponding increase in the number of design rules for a modern application specific IC (ASIC) to expand to nearly 100,000 on average, far beyond what a human designer can manage [3] . More than 60 percent of first silicon designs fail testing; recent...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780183
EISBN: 978-1-62708-268-6
... problem. The FMA&A is a good tool to use for this purpose. The failure analysis team may find that the root cause of the problem can be eliminated with a design change. An example is a bearing that failed because it was installed in a reversed manner. A design change that incorporates a taper...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2020
DOI: 10.31399/asm.tb.bpapp.t59290251
EISBN: 978-1-62708-319-5
... great resource for looking forward to where technology advances may take us. The ideas of flying, travel to the moon, submarines, robots, wristwatch radios, and atomic power all had precursors in comic books and novels. Then too, many of the stories envisioned new directions that failed to materialize...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050057
EISBN: 978-1-62708-311-9
... concentrators have long life expectancies and usually fail because of a workpiece hitting the coil or an arc. Coils with concentrators have shorter life cycles, with some producing as few as 10,000 parts before failure. When coils with concentrators fail, the failures may be very gradual over a period of time...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550033
EISBN: 978-1-62708-307-2
... precipitate particles become smaller than the critical size for thermodynamic stability and redissolve. In addition, aluminum alloys do not have a true endurance limit, meaning that they will fail at even low stress levels if the number of stress cycles becomes great enough. High-strength 2 xxx and 7 xxx...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ahsssta.t53700225
EISBN: 978-1-62708-279-2
... showed that by using the feedback controller, successful cup drawing increased by almost 50% compared to drawing without the controller. Figure 15.5 shows a photo of a successful and a failed cup. Fig. 15.5 Successful and failed cups. Source: Ref 15.2 Although this experiment was...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780067
EISBN: 978-1-62708-268-6
... 8.1 shows the FMA&A associated with the light bulb fault-tree analysis. Fig. 8.1 Indicator light fault-tree analysis develops potential causes for the light bulb failing to illuminate. The development of this fault-tree analysis is described in Chapter 5 . Table 8.1 Indicator...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110101
EISBN: 978-1-62708-247-1
... fail manufacturing test. Traditionally, scan diagnosis tools relied on the stuck-at fault model and could diagnose down to a logic net in the design. Although this approach is useful for localization, it has some limitations. Stuck-at patterns typically detect a vast variety of defect types, including...