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extraction
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230055
EISBN: 978-1-62708-298-3
... Abstract This chapter provides a fundamental understanding of beryllium reduction thermodynamics as a prerequisite for subsequent chapters on extraction, chemical processing, and corrosion. It examines a number of reduction methods along with a potential refining process, highlighting...
Abstract
This chapter provides a fundamental understanding of beryllium reduction thermodynamics as a prerequisite for subsequent chapters on extraction, chemical processing, and corrosion. It examines a number of reduction methods along with a potential refining process, highlighting the challenges encountered with each.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230071
EISBN: 978-1-62708-298-3
... Abstract This chapter describes some of the chemical processes that have been developed to extract beryllium from different types of ore. It covers the Kjellgren-Sawyer sulfate method, the Degussa method, Copaux-Kawecki fluoride extraction, solvent extraction, and leaching and settling. It also...
Abstract
This chapter describes some of the chemical processes that have been developed to extract beryllium from different types of ore. It covers the Kjellgren-Sawyer sulfate method, the Degussa method, Copaux-Kawecki fluoride extraction, solvent extraction, and leaching and settling. It also provides information on electrolytic extraction and the use of electrorefining.
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Published: 30 April 2020
Fig. 7.11 Binder-extraction data at two temperatures for solvent-immersion extraction of paraffin wax. Source: Camargo et al. ( Ref 5 )
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2015
DOI: 10.31399/asm.tb.tpmpa.t54480001
EISBN: 978-1-62708-318-8
.... It then describes the physical and mechanical properties of pure titanium and numerous grades of wrought titanium alloys and explains how they compare with other aerospace materials in terms of processing complexity and cost. The chapter also includes information on extractive metallurgy, current and emerging...
Abstract
This chapter provides an overview of the production and use of titanium and its significance as an engineering material. It begins by identifying important deposits and ores and assessing current and future production capacities and how they align with global consumption trends. It then describes the physical and mechanical properties of pure titanium and numerous grades of wrought titanium alloys and explains how they compare with other aerospace materials in terms of processing complexity and cost. The chapter also includes information on extractive metallurgy, current and emerging processes, product forms, and related costs.
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in The Expanded Metallographic Laboratory
> Metallographer’s Guide: Practices and Procedures for Irons and Steels
Published: 01 March 2002
Fig. 6.16 An extraction replica showing titanium-molybdenum carbides in a high-strength, low-alloy steel. 130,000×
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in The Expanded Metallographic Laboratory
> Metallographer’s Guide: Practices and Procedures for Irons and Steels
Published: 01 March 2002
Fig. 6.28 A STEM micrograph of titanium-molybdenum carbides in an extraction replica of a HSLA steel. Micrograph taken in dark field, thus the precipitates appear white in a dark matrix. 230,000×. Courtesy of K.A. Taylor, Bethlehem Steel Corporation
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Image
Published: 01 March 2002
Fig. 12.10 Grain-boundary films of MC (black) in Waspaloy (extraction replica—black objects were standing vertically in grain boundary prior to extraction). Waspaloy was intentionally forged under poor conditions to cause grain-boundary films.
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in Solidification, Segregation, and Nonmetallic Inclusions
> Metallography of Steels: Interpretation of Structure and the Effects of Processing
Published: 01 August 2018
Fig. 8.4 Solidification progress in a metallic mold, when heat extraction occurs preferentially by the sides and bottom of the mold. Heat extraction by the top is less important.
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in Case Studies of Powder-Binder Processing Practices
> Binder and Polymer Assisted Powder Processing
Published: 30 April 2020
Fig. 10.34 Supercritical extraction of paraffin wax from injection-molded 0.6 μm alumina treated in compressed carbon dioxide for over 6 h at 85 °C (185 °F) and 28 MPa (4.1 ksi). Source: Chartier et al. ( Ref 20 , 21 )
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Published: 30 April 2020
Fig. 7.12 Solvent-extraction data from Fig. 7.11 replotted using the linearized form suggested by Eq 7.3
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Published: 30 April 2020
Fig. 7.17 Thermogravimetric analysis for binder extraction during heating at 5 °C/min (9 °F/min) in nitrogen to compare the burnout of pure binder versus the combination of powder and binder. Source: Li et al. ( Ref 6 )
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Published: 30 April 2020
Fig. 7.35 Supercritical extraction data for 1.3 μm WC-Ni treated in carbon dioxide at 75 °C (167 °F) for various times and CO 2 pressures. The trials are for 3 mm (0.1 in.) thick components.
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Published: 01 July 2009
Fig. 7.2 Beryllium extraction from beryl and bertrandite ores at the Delta Plant in Utah by Brush Resources, Inc. Note: CCD thickeners are used in the countercurrent decantation (CCD) process to separate sludge and concentrate from solution.
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Published: 01 July 2009
Fig. 7.3 Solvent extraction of beryllium from sulfate solutions at the Delta plant in Utah by Brush Resources, Inc. HDEHP, di-(2-ethylhexyl) phosphoric acid
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in X-Ray Imaging Tools for Electronic Device Failure Analysis[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 9 Stacked die interconnect analysis. Projection image of extracted volume (center); 3D image of 25 μm diameter Cu-pillar microbump and virtual cross section (left); 3D image and virtual plan-view slice (right) of BEOL metal 6 interconnect (28 nm Si node). [14] .
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in Overview of Wafer-level Electrical Failure Analysis Process for Accelerated Yield Engineering
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 9 Test signal extracted (a) from the bottom side of the probe card and (b) routed through probe card PCB to the front side.
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in Chip-Scale Packaging and Its Failure Analysis Challenges
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 7 A Flash memory device was extracted from the FBGA package, and then wire-bonded into a new TSOP package.
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in Low Toughness and Embrittlement Phenomena in Steels
> Steels: Processing, Structure, and Performance
Published: 01 January 2015
Fig. 19.9 Thin aluminum nitride particles (arrows) extracted from an intergranular fracture surface of an as-cast medium-carbon steel. Dark particles are carbides. Transmission electron micrograph from a carbon extraction replica, original magnification 82,500×; shown here at 75% of original
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110042
EISBN: 978-1-62708-247-1
... Abstract Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small...
Abstract
Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small details. It begins with the basic microscope column and construction. The article discusses microscope adjustments, brightfield and darkfield illumination, and microscope concepts important to liquid crystal techniques. It also discusses solid immersion lenses, infrared and ultraviolet microscopy and concludes with laser microscopy techniques such as thermal induced voltage alteration and external induced voltage alteration.
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