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Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.lmcs.t66560453
EISBN: 978-1-62708-291-4
... Abstract This appendix provides information on the chemical composition, method of use, and applications of various etchants used in the metallography of carbon steels. chemical composition etchants etching Etchants are identified by an abbreviated form of their chemical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850533
EISBN: 978-1-62708-260-0
.... www.asminternational.org APPENDIX B MACROETCHANTS BASED ON COPPER-CONTAINING COMPOUNDS FOR ETCHING OF IRON AND STEEL 533 o z I * u -J E a0 I 2S 3 1-t T f ^H f s (N iri i i n 88 8 S 8S I E 8 88 ~H 1/1 ll I I I ' " 1 3 m i l 3oc a a £ «e 2 a 2 5- GS 3 B Sl OO 1/3 P^ <J = £« M s« o o g JS u Co Bo i2i = £> -t -a jy O N oC...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850712
EISBN: 978-1-62708-260-0
... Abstract This appendix is a list of etchants that are used to reveal dislocations in various metals, alloys, and compounds. dislocation etching etchants metals Metallography Principles and Practice George F. Vander Voort, p 712-731 DOI: 10.31399/asm.tb.mpp.t67850712 Copyright © 1999...
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Published: 01 November 2019
Figure 11 Chemical etching method with FIB gas assisted planar etching More
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Published: 01 December 1984
Figure 3-55 Example of grain-boundary etching without twin-boundary etching in AISI 304 austenitic stainless steel using Bell and Sonon’s 60% HNO 3 , aqueous etch, Pt cathode, and 0.6 V dc for 2 min (75 ×). More
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Published: 01 August 1999
Fig. 12.8 (Part 2) (e) Treated as for (b). The irregularly located dark-etching areas beneath the surface (arrows) are segregated regions differing slightly in M s temperature from the bulk of the material. 1% nital. 2×. (f) Austenitized, water quenched, tempered at 200 °C. Picral. 2×. More
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Published: 01 March 2002
Fig. 7.44 Basic laboratory setup for electropolishing and electrolytic etching More
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Published: 01 December 2003
Fig. 20 Comparison of zinc LMM Auger peak after 5 nm (50 Å) of sputter etching. (a) X laminate. (b) Y laminate More
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Published: 01 August 2018
Fig. 10.61 Crack in quenched steel (a) without etching (b). Etchant: aqua regia. Crack follows the prior austenitic grain boundaries. More
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Published: 01 August 2018
Fig. 13.31 Cross section of steel sheet galvanized by immersion. No etching. More
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Published: 01 August 2018
Fig. 13.33 Cross section of a steel sheet coated by galvalume. No etching. More
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Published: 01 August 2018
Fig. 15.29 Macrograph of the radial plane of a railway wheel. The etching with nital 4% shows the region subjected to accelerated cooling (lighter, under the illumination conditions used) that does not reach the wheel flange, in this case. This etchant is not adequate for the observation More
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Published: 01 August 2018
Fig. 17.18 Hypereutectic white cast iron. Etching with sodium picrate colors cementite gray (both pro-eutectic cementite and the cementite in ledeburite). Etchant: sodium picrate solution. More
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Published: 01 August 2018
Fig. 17.23 (a) Lamellar graphite in gray cast iron, subjected to deep etching to completely dissolve the metal matrix. Etchant: nital 10%, 2 h LSEM, SE. (b) Tridimensional reconstruction of lamellar graphite in gray cast iron. Section done by focused ion beam (FIB) and images obtained by SE More
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Published: 01 August 2018
Fig. 17.48 Gray cast iron with 2% P, annealed. Phosphorus-rich eutectic. The etching makes it impossible to completely differentiate the phases present in the eutectic. Etchant: picral. More
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Published: 01 September 2008
Fig. 11 Overtempered (darkened areas) in the flange revealed by temper etching (2.5 mm) More
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Published: 01 November 2019
Figure 5 An automated Jet Etching system used for regular chemical decapsulation More
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Published: 01 November 2019
Figure 11 Copper plane etched with Ga + only. The uneven etching is due to variation in copper grain orientations. Sample tilted relative to the beam to accentuate surface roughness. [19] More
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Published: 01 November 2019
Figure 12 Even copper etching using NH 4 OH that mitigates channeling effects on surface of SiO 2 . [19] More
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Published: 01 November 2019
Figure 18 SEM of an integrated circuit after wet etching down to the poly gate layer. More