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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... at different angles, and be combined to a 3D image. This is called computer tomography (CT). Fig. 1 X-ray system based on geometrical magnification. Compared with imaging techniques based on electron and visible light, X-rays offer several favorable traits that makes them uniquely well suited...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
...Abstract Abstract Most of the counterfeit parts detected in the electronics industry are either novel or surplus parts or salvaged scrap parts. This article begins by discussing the type of parts used to create counterfeits. It discusses the three most commonly used methods used...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... is that the system failed even though all parts in the system met their drawing requirements. The common failures discussed in this chapter include those associated with metallic components, composite materials, plastic components, ceramic components, and electrical and electronic components. ceramic...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270076
EISBN: 978-1-62708-301-0
... to overload conditions. It also recommends the use of twin suspension hooks to make attachment points more stable under difficult flight conditions. fractography scanning electron microscopy support structures visual examination Summary In an aircraft carrying electronic pods, while...
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Published: 01 April 2004
Fig. 1.2 An electronic module in which the semiconductor dies have been interconnected using fine wire attached by thermocompression bonding More
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Published: 01 June 1983
Figure 2.7 Temperature dependence of the electronic contribution to the specific heat. More
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Published: 01 June 1983
Figure 2.12 Electronic specific heat for superconducting vanadium expressed as C ES / γT C vs. T C / T . Experimental data ( Corak, Goodman, Satterthwaite, and Wexler, 1954 ) are well represented by the energy-gap formula (---) over the entire temperature range whereas the T 3 More
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Published: 01 June 1983
Figure 4.7 Resistance to electronic heat conduction: temperature dependencies and imperfection (defect) densities progressing from pure, annealed metals to highly alloyed metals. More
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Published: 01 June 1983
Figure 4.8 Typical electronic component of thermal conductivity for metals: temperature dependencies and imperfection (defect) densities progressing from pure, annealed metals to highly alloyed metals. More
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Published: 01 June 1988
Fig. 11.20 Hermetic solder sealing of electronic case assemblies Source: Lepel Corp. More
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Published: 01 March 2002
Fig. 5.56 A view of a electronic shutter speed control for the metallograph in Fig. 5.54 More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
...Abstract Abstract This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
...Abstract Abstract The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
...Abstract Abstract Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220085
EISBN: 978-1-62708-259-4
...Abstract Abstract This chapter discusses the use of electron microscopy in metallographic analysis. It explains how electrons interact with metals and how these interactions can be harnessed to produce two- and three-dimensional images of metal surfaces and generate crystallographic...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
...Abstract Abstract Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis...
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Published: 01 November 2007
Fig. 10.59 (a) Scanning electron micrograph (backscattered electron image) showing a circumferential thermal fatigue crack (from the sample shown in Fig. 10.57 ) along with (b) an EDX spectrum showing the corrosion product inside the crack to be essentially iron oxides. Source: Ref 40 More
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Published: 01 November 2007
Fig. 10.69 Scanning electron micrograph (backscattered electron image) showing the corrosion products formed on the maximum wastage area of Type 304H reheater shown in Fig. 10.67 . Semiquantative EDX analysis shows the compositions (wt%) at different locations as indicated below. Courtesy More
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Published: 01 November 2007
Fig. 10.76 Scanning electron micrograph (backscattered electron image) showing fly-ash deposits (46.4 Si-21.6Al-20.7Fe) (marked 1) on the surface of Type 304H reheater ( Fig. 10.75 ) that suffered the maximum wastage at location 30° away from the direct flue gas impingement point. The 304H also More
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Published: 01 November 2007
Fig. 10.94 Scanning electron micrograph (backscattered electron image) showing various hardface particles in the proprietary tungsten carbide based hardfacing weld overlay, HF60. The results (wt%) of semiquantative EDX analyses of various phases are summarized as: Light color phases (A, B, C, E More