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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
..., and be combined to a 3D image. This is called computer tomography (CT). Fig. 1 X-ray system based on geometrical magnification. Compared with imaging techniques based on electron and visible light, X-rays offer several favorable traits that makes them uniquely well suited for non-destructive...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... Abstract Most of the counterfeit parts detected in the electronics industry are either novel or surplus parts or salvaged scrap parts. This article begins by discussing the type of parts used to create counterfeits. It discusses the three most commonly used methods used by counterfeiters...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... is that the system failed even though all parts in the system met their drawing requirements. The common failures discussed in this chapter include those associated with metallic components, composite materials, plastic components, ceramic components, and electrical and electronic components. ceramic...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270076
EISBN: 978-1-62708-301-0
... to overload conditions. It also recommends the use of twin suspension hooks to make attachment points more stable under difficult flight conditions. fractography scanning electron microscopy support structures visual examination Summary In an aircraft carrying electronic pods, while...
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Published: 01 November 2019
Figure 2 Attenuation length (1/e) of several materials commonly used in electronic devices as a function of x-ray energy. More
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Published: 01 November 2019
Figure 12 Spin-resolved electronic band structure for Ni and Fe, two typical ferromagnetic transition metals. Dotted line represents Fermi energy level. More
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Published: 01 March 2002
Fig. 5.56 A view of a electronic shutter speed control for the metallograph in Fig. 5.54 More
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Published: 01 June 1983
Figure 2.7 Temperature dependence of the electronic contribution to the specific heat. More
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Published: 01 June 1983
Figure 2.12 Electronic specific heat for superconducting vanadium expressed as C ES / γT C vs. T C / T . Experimental data ( Corak, Goodman, Satterthwaite, and Wexler, 1954 ) are well represented by the energy-gap formula (---) over the entire temperature range whereas the T 3 More
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Published: 01 June 1983
Figure 4.7 Resistance to electronic heat conduction: temperature dependencies and imperfection (defect) densities progressing from pure, annealed metals to highly alloyed metals. More
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Published: 01 June 1983
Figure 4.8 Typical electronic component of thermal conductivity for metals: temperature dependencies and imperfection (defect) densities progressing from pure, annealed metals to highly alloyed metals. More
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Published: 01 April 2004
Fig. 1.2 An electronic module in which the semiconductor dies have been interconnected using fine wire attached by thermocompression bonding More
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Published: 01 June 1988
Fig. 11.20 Hermetic solder sealing of electronic case assemblies Source: Lepel Corp. More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
... Abstract This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... Abstract The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
... Abstract Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
... Abstract Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220085
EISBN: 978-1-62708-259-4
... Abstract This chapter discusses the use of electron microscopy in metallographic analysis. It explains how electrons interact with metals and how these interactions can be harnessed to produce two- and three-dimensional images of metal surfaces and generate crystallographic and compositional...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110513
EISBN: 978-1-62708-247-1
... Abstract Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure...