1-20 of 1354 Search Results for

electron

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
... Abstract This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... Abstract The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220085
EISBN: 978-1-62708-259-4
... Abstract This chapter discusses the use of electron microscopy in metallographic analysis. It explains how electrons interact with metals and how these interactions can be harnessed to produce two- and three-dimensional images of metal surfaces and generate crystallographic and compositional...
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.9781627082921
EISBN: 978-1-62708-292-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
... Abstract Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... is that the system failed even though all parts in the system met their drawing requirements. The common failures discussed in this chapter include those associated with metallic components, composite materials, plastic components, ceramic components, and electrical and electronic components. ceramic...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... Abstract Most of the counterfeit parts detected in the electronics industry are either novel or surplus parts or salvaged scrap parts. This article begins by discussing the type of parts used to create counterfeits. It discusses the three most commonly used methods used by counterfeiters...
Image
Published: 01 November 2019
Figure 2 The pictorial representation of Auger electron process and electron beam interaction with solid specimen. More
Image
Published: 01 June 2016
Fig. 5.22 (a) Scanning electron micrograph and (b) electron backscatter diffraction (EBSD) map of feedstock aluminum powder particles showing polycrystalline powder. (c) Scanning electron micrograph of top surface of cold-sprayed coating. (d) Coating cross section. (e) EBSD map of top surface More
Image
Published: 01 November 2007
Fig. 3.21 Scanning electron micrograph (backscattered electron image) showing the oxide scales formed on the outside diameter of the heat-exchanger tube (from the same batch of tubes that showed surface chromium depletion) exposed to air for 6 months. Energy-dispersive x-ray spectroscopy (EDX More
Image
Published: 01 November 2007
Fig. 3.23 Scanning electron micrograph (backscattered electron image) showing the oxide scales formed on the outside diameter of Type 321 tube (from supplier A) exposed to air at approximately 620 to 670 °C (1150 to 1240 °F) for 1008 h. Energy-dispersive x-ray spectroscopy (EDX) analysis More
Image
Published: 01 November 2007
Fig. 10.20 Scanning electron micrograph (backscattered electron image) showing the corrosion scales formed on the fireside of the tube sample (shown in Fig. 10.19 ). The chemical compositions of the corrosion scales at different locations were analyzed semiquantitatively by energy dispersive More
Image
Published: 01 November 2007
Fig. 10.33 Scanning electron micrograph (backscattered electron image) showing one of the circumferential grooves formed on a T22 waterwall tube (2.25Cr-1Mo) as shown in Fig. 10.32 . Semiquantative energy dispersive x-ray spectroscopy (EDX) analysis in terms of weight percent at different More
Image
Published: 01 November 2007
Fig. 10.34 (a) Scanning electron micrograph (backscattered electron image) showing typical morphology of the circumferential groove formed on a T2 tube (0.5Cr-0.5Mo) in a supercritical boiler. The results (in wt%) obtained from the semiquantitative analysis using EDX on the corrosion products More
Image
Published: 01 November 2007
Fig. 10.41 Scanning electron micrograph (backscattered electron image) showing the corrosion products in a circumferential groove formed in Type 309 overlay on the waterwall of a supercritical boiler after 10 years of service. The results of the semiquantative EDX analysis of the corrosion More
Image
Published: 01 November 2007
Fig. 10.59 (a) Scanning electron micrograph (backscattered electron image) showing a circumferential thermal fatigue crack (from the sample shown in Fig. 10.57 ) along with (b) an EDX spectrum showing the corrosion product inside the crack to be essentially iron oxides. Source: Ref 40 More
Image
Published: 01 November 2007
Fig. 10.69 Scanning electron micrograph (backscattered electron image) showing the corrosion products formed on the maximum wastage area of Type 304H reheater shown in Fig. 10.67 . Semiquantative EDX analysis shows the compositions (wt%) at different locations as indicated below. Courtesy More
Image
Published: 01 November 2007
Fig. 10.76 Scanning electron micrograph (backscattered electron image) showing fly-ash deposits (46.4 Si-21.6Al-20.7Fe) (marked 1) on the surface of Type 304H reheater ( Fig. 10.75 ) that suffered the maximum wastage at location 30° away from the direct flue gas impingement point. The 304H More
Image
Published: 01 November 2007
Fig. 10.94 Scanning electron micrograph (backscattered electron image) showing various hardface particles in the proprietary tungsten carbide based hardfacing weld overlay, HF60. The results (wt%) of semiquantative EDX analyses of various phases are summarized as: Light color phases (A, B, C More
Image
Published: 01 November 2007
Fig. 12.12 Scanning electron micrograph (backscattered electron image) showing the deposits and corrosion scales formed on a carbon steel (SA178A) superheater tube suffering severe tube-wall wastage. Chemical compositions at different locations were analyzed by energy-dispersive x-ray More