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electrical circuit

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Image
Published: 01 July 2000
Fig. 6.18 Electrochemical impedance spectroscopy (EIS): simplest electrical-circuit model More
Image
Published: 01 June 1988
Fig. 3.10 Electrical circuit illustrating the analogy between the transformer principle and induction heating. E P is primary voltage (V); I P is primary current (A); N P is number of primary turns; I S is secondary current (A); N S is number of secondary turns; E S is secondary voltage More
Image
Published: 01 June 1988
Fig. 8.1 Electrical circuit illustrating the analogy between induction heating and the transformer principle. E p = primary voltage (V); I p = primary current (A); N p = number of primary turns; I s = secondary current (A); N s = number of secondary turns; E s = secondary voltage (V); R More
Image
Published: 01 November 2019
Figure 8 Using EOTPR (top right) on the electrical open circuit path and compare the results with a reference device allows the localization of the defect within a few hundred micrometers (left). Optical imaging (bottom right) confirmed the defect position as circuit path opening. [22] More
Image
Published: 01 June 1988
Fig. 4.22 Simplified electrical tank circuit for a radio-frequency oscillator. From E. May, Industrial High Frequency Electric Power , Wiley, New York, 1950 ( Ref 5 ) More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220027
EISBN: 978-1-62708-341-6
... Abstract This chapter focuses on the transfer of energy between the power supply and the induction heating coil. The most efficient transfer requires that the induction heated load and coil be matched to the power supply and that the electrical circuit containing these elements be properly...
Image
Published: 01 November 2019
Figure 24 A top down SEM image of a circuit edit used to electrically isolate structures contained within the upper left rectangle from structures contained within the rectangle on the right. More
Image
Published: 01 December 2008
Fig. 5.21 (a) The model for solute drag effect on the migration of grain boundary (the solute drag effect decreases the mobility of the grain boundary M). (b) An electric circuit analogy More
Image
Published: 01 November 2013
of the electrical circuit in which the copper coil is the primary. Source: Ref 5 More
Image
Published: 01 November 2011
Fig. 3.7 Relation of weld nuggets to embossed regions of metal sheets used in projection welding: (a) electrical circuit loop is completed when current travels through embossed projection contact points; (b) addition of pressure after welding current is turned off causes plastic deformation More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780147
EISBN: 978-1-62708-268-6
... will be considerably higher. The engineer (using electrical circuit analyses, heat-transfer equations, and other engineering principles) must define the worst-case internal temperatures and apply these temperature requirements when procuring the electrical components and circuit card assemblies. Similarly...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2000
DOI: 10.31399/asm.tb.fec.t65940233
EISBN: 978-1-62708-302-7
..., the measured external current, I ex , may be out of phase with the applied potential, as indicated in Fig. 6.13 , due to physical processes that behave as capacitive or inductive elements (rather than resistive elements) in an electrical circuit considered to be “equivalent” to the electrochemical cell...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290061
EISBN: 978-1-62708-306-5
...: Electrical circuit, which consists of a welding transformer, tap switch, and a secondary circuit Control circuit, which initiates and times the duration of current flow and regulates the welding current Mechanical system, which consists of the frame, fixtures, and other devices that hold and clamp...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170596
EISBN: 978-1-62708-297-6
... that make and break electrical circuits. Contacts are made of either elemental metals or alloys made by the melt-cast method or composites manufactured by powder metallurgy (P/M) processes. Powder metallurgy facilitates combinations of metals that ordinarily cannot be achieved by conventional alloying...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090109
EISBN: 978-1-62708-462-8
... Abstract The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
...] in a semiconductor device as shown in Figure 1 . The concept of circuit edit goes back to the earliest days of electrical devices in which rewiring is used to improve the product. Circuit edit has been instrumental to the development of Focused Ion Beam (FIB) systems. When printed circuits came along it was quite...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090063
EISBN: 978-1-62708-462-8
... runtime needs. This represents a challenge for choosing the appropriate stimulus to simulate the failing conditions. In fact, an analog circuit block generally has multiple inputs that need to be configured to reproduce the same electrical conditions as the real electrical setup used in the bench...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110673
EISBN: 978-1-62708-247-1
... ). Soon afterwards, Texas Instruments, Motorola, National Semiconductor and others introduced their own lines of standard logic parts. In the late 1960’s much of the integrated circuit development was performed for the U.S. military. At this time, the military also began a push to increase the reliability...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... Mechanical fractures of components or electrical leads Use of the wrong component Reversed component installation Overheating Bent pins Short circuits When examining circuit card assemblies for the presence of any of the aforementioned conditions, the failure analysis team can use...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... imaging illustrates the current flow within the net list (left) and pin point the location of the electrical short within the circuit path. NIR imaging at different magnification confirm the root cause due to extra pattern (right) [22]. The second defect localization is done on a similar sample...