This chapter examines some of the behaviors that suit materials for electrical and electronic applications. It begins by explaining how charge carriers move in metals and semiconductors and how properties such as conductivity, mobility, and resistivity are derived. It discusses the significance of energy bands, intrinsic and extrinsic conduction, and the properties of compound semiconductors. It also covers semiconductor devices, including p-n junctions, light emitting diodes, transistors, and piezoelectric crystals.

This chapter presents topics pertaining to resistance at cryogenic temperatures: measurement, the resistive mechanisms, and available data. The chapter also presents brief descriptions of the various mechanisms that are operative in producing resistance at low temperatures. The alloys discussed are the nondilute mixtures of metals. An introduction to low-temperature electrical properties of specific metals and alloys is included.

This chapter provides a brief account of galvanic corrosion, which occurs when a metal or alloy is electrically coupled to another metal or conducting nonmetal in the same electrolyte. It begins by describing the galvanic series of metals and alloys useful for predicting galvanic relationships, followed by a brief section on polarization of metals or alloys. The effects of area, distance, and geometric shapes on galvanic-corrosion behavior are then discussed. Various alloys susceptible to galvanic corrosion are briefly reviewed. The chapter also discusses various modes of attack that lead to galvanic corrosion, along with methods for predicting and controlling galvanic corrosion.

This article discusses the composition, properties, and behaviors of copper and its alloys. It begins with an overview of the characteristics, applications, and commercial grades of wrought and cast copper. It then discusses the role of alloying, explaining how zinc, tin, aluminum, silicon, and nickel affect the physical and mechanical properties of coppers and high-copper alloys as well as brasses, bronzes, copper-nickels, and nickel silvers. It also explains how alloying affects electrical conductivity, corrosion resistance, stress-corrosion cracking, and processing characteristics.

This article explains how alloying elements affect the properties and behaviors of electrical contacts. It describes the composition, strength, hardness, and conductivity of a wide range of contact alloys and composites based on silver, copper, gold, platinum, palladium, tungsten, and molybdenum, and related oxides and carbides.

Ceramics normally have high melting temperatures, excellent chemical stability and, due to the absence of conduction electrons, tend to be good electrical and thermal insulators. They are also inherently hard and brittle, and when loaded in tension, have almost no tolerance for flaws. This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process.

The ability to accurately assess the remaining life of components is essential to the operation of plants and equipment, particularly those in service beyond their design life. This, in turn, requires a knowledge of material failure modes and a proficiency for predicting the near and long term effects of mechanical, chemical, and thermal stressors. This chapter presents a broad overview of the types of damage to which materials are exposed at high temperatures and the approaches used to estimate remaining service life. It explains how operating conditions in power plants and oil refineries can cause material-related problems such as embrittlement, creep, thermal fatigue, hot corrosion, and oxidation. It also discusses the factors and considerations involved in determining design life, defining failure criteria, and implementing remaining-life-assessment procedures.

Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor technology from design to manufacturing and the characterization methods are discussed. The focus is on two prominent MOS structures: planar MOS device and FinFET device. The article covers the device parameters and device properties that determine the design criteria and the device tuning procedures. The discussion includes the effects of drain induced barrier lowering, velocity saturation, hot carrier degradation, and short channel on these devices.

This chapter discusses three related corrosion mechanisms, galvanic, deposition, and stray-current corrosion, explaining why they occur and how they affect the corrosion process. It includes information on testing and prevention methods along with examples of the type of damage associated with these corrosion mechanisms.

The physical properties of a material are those properties that can be measured or characterized without the application of force and without changing material identity. This chapter discusses in detail the common physical properties of metals, namely density, electrical properties, thermal properties, magnetic properties, and optical properties. Some physical properties for a number of metals are given in a table.

This chapter is a review of magnetic materials and how they behave. It begins by discussing the significance of ferromagnetism and comparing the Curie temperature of several ferromagnetic elements. It then discusses the concept of magnetic domains and illustrates how flux paths, and magnetostatic energy, vary based on the size of the domain. It also discusses the process of magnetization and compares and contrasts hard and soft magnetic materials.

The basic concept for most methods of corrosion protection is to remove one or more of the electrochemical cell components so that the pure metal or metal alloy of interest will not corrode. Another widely used corrosion protection approach is to change the nature of the anode so that it becomes the cathode (cathodic protection). This chapter briefly reviews these methods of corrosion protection. The factors affecting corrosion behavior are covered. In addition, the chapter provides information on coatings and inhibitors, which are used in corrosion protection.

This chapter presents basic principles and the theoretical results of heat transport in solids. Thermal conductivity and thermal diffusivity are the principal properties discussed. Discussions are also included on the effects of temperature, magnetic field, and metallurgical variations caused by composition, processing, and heat-treatment differences. Numerous graphs illustrate the qualitative and quantitative effects of these variables. Measurement methods and associated accuracies and pertinent empirical correlations are presented.

This appendix is a compilation of terms and definitions related to corrosion.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

This chapter covers the failure modes and mechanisms of concern in steam turbines and the methods used to assess remaining component life. It provides a detailed overview of the design considerations, material requirements, damage mechanisms, and remaining-life-assessment methods for the most-failure prone components beginning with rotors and continuing on to casings, blades, nozzles, and high-temperature bolts. The chapter makes extensive use of images, diagrams, data plots, and tables and includes step-by-step instructions where relevant.

This chapter provides a view of magnetism in materials used at low temperatures. The discussion covers the concepts, definitions, and systems of units that are unique to the study of magnetic properties. The chapter provides a description of some of the techniques and devices used for determining magnetic properties.