Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

Fatigue life analysis and crack growth life prediction require an accurate interpretation of the load spectrum. This appendix presents two methods for interpreting load spectra and provides several data plots and tables comparing fatigue test data with analytically predicted values.

This article presents methods that enable one to consistently, uniformly and quickly remove substrate silicon from units without imparting damage to the structure of interest. It provides examples of electron beam probing and backside nano-probing techniques. The electron beam probing techniques are E-beam Logic State Imaging, Electron-beam Signal Image Mapping, and E-beam Device Perturbation. Backside nano-probing techniques discussed include: Electron Beam Absorbed Current, Electron Beam Induced Resistance Change, four terminal resistance measurements, resistive gate defect identification, and circuit editing. The article also presents methods to prepare electron beam probing samples where some remaining silicon is required for the transistor functions and transmission electron microscope samples from units where the substrate silicon has been partially or completely removed.

This chapter is a compilation of terms and definitions related to heat treating.

This appendix serves as a cross reference to chemically similar titanium alloys and the various designations by which they are known.

This chapter is a compilation of terms and definitions related to component failure analysis.

This appendix is a compilation of terms and definitions related to corrosion.

This chapter is a compilation of terms and definitions related to component failure analysis.

This appendix is a compilation of terms and definitions related to metallurgy.

This appendix provides a list of universal constants, units, and conversion factors.

This appendix is a glossary of terms related to induction heat treating.

This chapter contains a corrosion rate conversion table and a figure that shows the relationships among some of the units commonly used for corrosion rates of metals.

This appendix provides datasheets on high purity titanium, describing its processing characteristics, mechanical and fabrication properties, and heat treating practices.

This chapter is a compilation of terms and definitions related to corrosion in the petrochemical industry.

This appendix provides datasheets describing the chemical composition, processing characteristics, mechanical and fabrication properties, and heat treating of commercially pure and modified titanium. The datasheets address four grades of unalloyed titanium (ASTM Grade 1, UNS R50250; ASTM Grade 2, UNS R50400; ASTM Grade 3, UNS R50550; and ASTM Grade 4, UNS R50700), two grades of modified titanium (ASTM Grade 7, UNS R52400; and ASTM Grade 11, UNS R52250), and alloy Ti-0.3Mo-0.8Ni (ASTM Grade 12, UNS R53400).