Fatigue life analysis and crack growth life prediction require an accurate interpretation of the load spectrum. This appendix presents two methods for interpreting load spectra and provides several data plots and tables comparing fatigue test data with analytically predicted values.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

This article presents methods that enable one to consistently, uniformly and quickly remove substrate silicon from units without imparting damage to the structure of interest. It provides examples of electron beam probing and backside nano-probing techniques. The electron beam probing techniques are E-beam Logic State Imaging, Electron-beam Signal Image Mapping, and E-beam Device Perturbation. Backside nano-probing techniques discussed include: Electron Beam Absorbed Current, Electron Beam Induced Resistance Change, four terminal resistance measurements, resistive gate defect identification, and circuit editing. The article also presents methods to prepare electron beam probing samples where some remaining silicon is required for the transistor functions and transmission electron microscope samples from units where the substrate silicon has been partially or completely removed.

This chapter examines the early literature on stainless steel to gain an understanding of the state-of-the-art of stainless steel as it progressed through the first 37 years after the discoveries made in Sheffield and Essen.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

This appendix is a timeline of events related to the discovery, development, and commercialization of stainless steels.

This chapter reviews the general principles involved in codifying standards and describes the historical development of materials testing standards. It provides information on the standards related to the Brinell, Vickers, Rockwell, and Knoop methods as well as those for the instrumented indentation test and hardness conversions.

This chapter describes the heat treatments called annealing and normalizing for steels and examines the structures formed and the reasons for these treatments. It also provides a description of the special heat treatments, namely, martempering and austempering. Information on intercritical heat treatment is also included.

This appendix serves as a cross reference to chemically similar titanium alloys and the various designations by which they are known.

With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.

This chapter describes sheet metal forming operations, including cutting, blanking, piercing, and bending as well as deep drawing, spinning, press-brake and stretch forming, fluid forming, and drop hammer and electromagnetic forming. It also discusses the selection and use of die materials and lubricants along with superplastic forming techniques.

This chapter discusses the compositions, properties, and applications of nonferrous metals, including zirconium, hafnium, beryllium, lead, tin, gold, silver, and platinum group metals. It also addresses fusible alloys and provides melting temperatures for several compositions.

This appendix describes the information contained in titanium alloy datasheets and defines the many abbreviations that are used.