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dynamic recovery

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240117
EISBN: 978-1-62708-251-8
... working is required to obtain an equivalent amount of recrystallization at a given time and temperature. As the cold working temperature increases, dynamic recovery begins to occur during the deformation process. Therefore, there is less stored energy in the metal to serve as a driving force...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.t69980141
EISBN: 978-1-62708-342-3
... the influence of the high and low stacking fault energy. Fig. 4.50 Dynamic recovery and recrystallization processes in extrusion. (a) High stacking fault energy. (b) Low stacking fault energy [ McQ 75 ] In the shear zones (at the liner wall, at the funnel of the dead metal zones in flat dies...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2020
DOI: 10.31399/asm.tb.phtbp.t59310127
EISBN: 978-1-62708-326-3
... of recovery, recrystallization, and grain growth. This is followed by discussions on annealing processes, namely subcritical annealing, critical-range annealing, full annealing, isothermal annealing, annealing for microstructure, and solution or quench annealing. Next, the chapter describes two undesirable...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780185
EISBN: 978-1-62708-281-5
... Abstract This article briefly introduces some commonly used methods of mechanical testing of plastics for determining mechanical properties, also describing the test methods and providing comparative data for the mechanical property tests. In addition, creep testing and dynamic mechanical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780359
EISBN: 978-1-62708-281-5
..., thermogravimetric analysis, thermomechanical analysis, and dynamic mechanical analysis. The article also discusses various analytical methods used to characterize the molecular weight distribution of a polymeric material. It provides information on a wide range of mechanical tests that are available to evaluate...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240265
EISBN: 978-1-62708-251-8
..., which is characterized by a reduction of area approaching 100%, occurs at high stresses and high temperatures. This type of failure can occur during hot working at high strain rates. Dynamic recovery and recrystallization are usually associated with rupture failures. Since it is not really a creep...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780343
EISBN: 978-1-62708-281-5
... analysis, namely differential thermal analysis, thermogravimetric analysis, thermal-mechanical analysis, and dynamic mechanical analysis. The following sections provide details on X-ray diffraction for analyzing crystalline phases and on a minimal scheme for polymer analysis and characterization to assist...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040247
EISBN: 978-1-62708-300-3
..., Microstructural Evolution ,” Met. Trans. A. , p 335 – 349 . 10.1007/BF02656802 [Jonas, 1976] Jonas J.J. , “ Recovery, Recrystallization and Precipitation under Hot Working Conditions ,” Proceedings of the Fourth International Conference on Strength of Metals and Alloys ( Nancy, France ), p 976...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2015
DOI: 10.31399/asm.tb.spsp2.t54410133
EISBN: 978-1-62708-265-5
.... , A New Approach to Dynamic Recrystallization , Deformation, Processing, and Structure , Krauss G. , Ed., American Society for Metals , 1984 , p 185 – 228 8.42 McQueen H.J. , The Role of Dynamically Recovered Substructure in Dynamic Recrystallization , Deformation, Processing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780105
EISBN: 978-1-62708-281-5
.... “ Recommended Practices for Testing Polymeric Powders and Powder Coatings ,” D 3451-92, Vol 6.02 , Annual Book of ASTM Standards , American Society for Testing and Materials 13. “ Standard Practice for Rheological Measurement of Polymer Melts Using Dynamic Mechanical Procedures ,” D 4440-95a, Plastics...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2015
DOI: 10.31399/asm.tb.spsp2.t54410405
EISBN: 978-1-62708-265-5
... , p 90 – 94 18.8 Owen W.S. and Roberts M.J. , Dynamic Aging Effects in Ferrous Martensite , Trans. Jpn. Inst. Met. , Vol 9 , 1968 , p 911 – 918 18.9 Roberts M.J. and Owen W.S. , Unstable Flow in Martensite and Ferrite , Metall. Trans. , Vol 1 , 1970 , p...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610415
EISBN: 978-1-62708-303-4
... fracture, and intergranular fracture, as illustrated in Fig. 17 . Rupture, which is characterized by a reduction of area approaching 100%, occurs at high stresses and high temperatures. This type of failure can occur during hot working at high strain rates. Dynamic recovery and recrystallization...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.tb.hpcspa.t54460121
EISBN: 978-1-62708-285-3
... electron microscopy Phase identification, dislocation structure, recovery processes and recrystallization, coating chemistry 7 Electron backscattered diffraction Coating texture, extent of recrystallization, deformation map in the substrate, nature of bonding in the coating and coating substrate...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... in the electronics industry are either new or surplus parts or salvaged scrap parts. The packaging of these parts is altered to modify their identity or to disguise the effects of salvaging. The modification can be as simple as the removal of old marking and then adding new marking, or as complicated as recovery...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2015
DOI: 10.31399/asm.tb.spsp2.t54410621
EISBN: 978-1-62708-265-5
... steels are soaked at high temperatures and hot worked by forging, extrusion, or rolling in the temperature range of austenite or austenite-carbide stability. Roberts ( Ref 24.29 ) has reviewed the dynamic recovery and recrystallization phenomena that affect the flow behavior of austenite during hot work...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.lmcs.t66560125
EISBN: 978-1-62708-291-4
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.9781627083423
EISBN: 978-1-62708-342-3
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240279
EISBN: 978-1-62708-251-8
... , Mechanical Testing and Evaluation , Vol 8 , ASM Handbook , ASM International , 2000 4. Mankins W.L. , Recovery, Recrystallization, and Grain-Growth Structures , Metallography and Microstructures, Vol 9 , ASM Handbook , ASM International , 2004 5. Lahoti G.D. , Flat, Bar...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780295
EISBN: 978-1-62708-281-5
... in Severe Environments , Plenum Press , 1980 , p 607 10.1007/978-1-4613-3156-8_38 16. Li J.C.M. , Dislocation Dynamics in Deformation and Recovery , Can. J. Phys. , Vol 45 , 1967 , p 493 10.1139/p67-043 17. Kubát J. , Peterman J. , and Rigdahl M. , Internal...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
... enables both static and dynamic fault isolation to be performed on the same tool. Figure 3 shows a wafer-level FI setup that involves docking a standard production tester to an inverted scanning optical microscope (SOM). Figure 3 Prober configuration for wafer-level testing and dynamic fault...