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dynamic random access memory
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110499
EISBN: 978-1-62708-247-1
... Abstract This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement...
Abstract
This article provides an introduction to the dynamic random access memory (DRAM) operation with a focus to localization techniques of the defects combined with some physical failure analysis examples and case studies for memory array failures. It discusses the electrical measurement techniques for array failure analysis. The article then presents know-how-based analysis techniques of array failures by bitmap classification. The limits of bitmapping that lead to well-known localization techniques like thermally induced voltage alteration and optical beam induced resistance change are also discussed. The article concludes by providing information on soft defect localization techniques.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090155
EISBN: 978-1-62708-462-8
..., and interlayer dielectric (ILD) and high aspect ratio cross sectioning and imaging. Memory The memory market is segmented into three types of devices: Volatile (dominated by dynamic random access memory, or DRAM) Non-volatile (dominated by vertical NAND, VNAND) Emerging (magnetoresistive...
Abstract
This chapter summarizes critical gaps and long-term needs in failure analysis technology as it relates to logic and memory devices and IC packages. It assesses the impact of vertical integration, new materials, and expansion in the third dimension on volume analysis, sample preparation and measurement methods, and cross-sectioning and imaging.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... and dopant images of Embedded Dynamic Random Access Memory (EDRAM) cells are shown. The cross section was polished such that the surface finish had a RMS Roughness (R q ) of <5 Å [11 , 12] . The small R q is critical in order to minimize noise in the data. The sample was oxidized [9] prior...
Abstract
Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090021
EISBN: 978-1-62708-462-8
... (AP) with a dynamic random access (DRAM) package using a high-density redistribution layer (RDL) and TIV. InFO on substrate (InFO_oS) is another variant of InFO that features a higher-density 2/2 μm RDL line width/space to integrate multiple chiplets. This package technology features hybrid pitches...
Abstract
Recent trends in electronic packaging, including the growing use of 3D designs and heterogeneous integration, are greatly adding to the complexity of isolating faults in semiconductor products. This chapter reviews the latest IC packaging and integration solutions and assesses the readiness level of fault isolation tools and techniques. It examines the capabilities, limitations, and optimization potential of x-ray tomography and magnetic field imaging, describes various approaches for optical fault isolation, and compares and contrasts pre-OFI sample preparation methods. The chapter also explains how time-domain and electro-optical terahertz pulse reflectometry are used to find shorts and opens in ICs and how challenges related to heterogenous integration may be met through design for testability (DFT) and built-in self-test (BIST) accommodations and the use of passive interposers.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090109
EISBN: 978-1-62708-462-8
... interactions. Continuous uniformity improvements will be needed. Advanced automation of PFIB delayering, including end-pointing, will also be needed for throughput and success rate. Fig. 5 Plasma FIB delayering of 14 nm FinFET devices in static random access memory (SRAM) array showing localized metal...
Abstract
The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its microstructure in order to identify the root cause of failure. This chapter assesses the tools and techniques used for those purposes and the challenges brought on by continued transistor scaling, advanced 3D packages, and new IC architectures. The areas covered include sample preparation, nanoprobing, microscopy, FIB circuit edit, and scanning probe microscopy.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends...
Abstract
This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 30 September 2023
DOI: 10.31399/asm.tb.stmflw.t59390456
EISBN: 978-1-62708-459-8
... are high enough to prevent dynamic recrystallization and if there are no second-phase particles that could initiate microcracks. This means that shear cannot take place in an infinitely narrow plane; instead, a more diffused primary shear zone is found ( Fig. 13.3 ). The chip becomes thicker...
Abstract
In contrast to most plastic deformation processes, the shape of a machined component is not uniquely defined by the tooling. Instead, it is affected by complex interactions between tool geometry, material properties, and frictional stresses and is further complicated by tool wear. This chapter covers the mechanics and tribology of metal cutting processes. It discusses the factors that influence chip formation, including tool and process geometry, cutting forces and speeds, temperature, and stress distribution. It reviews the causes and effects of tool wear and explains how to predict and extend the life of cutting tools based on the material of construction, the use of cutting fluids, and the means of lubrication. It presents various methods for evaluating workpiece materials, chip formation, wear, and surface finish in cutting processes such as turning, milling, and drilling. It also discusses the mechanics and tribology of surface grinding and other forms of abrasive machining.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180061
EISBN: 978-1-62708-256-3
... to support the theory or too much information and data have been collected that support a different theory. Now the fun begins. Random testing and evaluations begin on the residual pieces of the failure in an attempt to close in on the root cause. However, many of the samples have been destroyed...
Abstract
Statistics, data analysis, root cause analysis, and problem-solving processes play a key role in failure investigations. This chapter explains how to collect failure investigation data, how to build and maintain a database for company-related failures, and how to use corresponding statistics including type of failure, material, and root cause. It describes the purpose and benefits of conducting a root cause analysis and the factors, namely relative failure importance and company value, that determine when an investigation should be performed. The chapter also discusses the four-step problem-solving process as it applies to failure investigation, how to assemble an investigation team, and the details of organization and planning. It concludes with a case history of the Firestone 500 steel-belted tire failure, stressing the importance of a systematic approach to failure investigations.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.9781627082600
EISBN: 978-1-62708-260-0
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.9781627083485
EISBN: 978-1-62708-348-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2017
DOI: 10.31399/asm.tb.sccmpe2.t55090367
EISBN: 978-1-62708-266-2
... specimens Dynamic loading Selection of test environments Special considerations for testing of weldments Interpretation of test results Most crucial to any SCC evaluation program are selection of an appropriate test method and interpretation of test results. 17.1 General State of the Art...
Abstract
This chapter addresses the challenge of selecting an appropriate stress-corrosion cracking (SCC) test to evaluate the serviceability of a material for a given application. It begins by establishing a generic model in which SCC is depicted in two stages, initiation and propagation, that further subdivide into several zones plus a transition region. It then discusses SCC test standards before describing basic test objectives and selection criteria. The chapter explains how to achieve the required loading conditions for different tests and how to prepare test specimens to determine elastic strain, plastic strain, and residual stress responses. It also describes the difference between smooth and precracked specimens and how they are used, provides information on slow-strain-rate testing and how to assess the results, and discusses various test environments and procedures, including tests for weldments. The chapter concludes with a section on how to interpret time to failure, threshold stress, percent survival, stress intensity, and propagation rate data, and assess the precision of the associated tests.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850060
EISBN: 978-1-62708-260-0
... are excessive. The location from which the test sample is taken is often chosen on the basis of convenience in sectioning. While random sampling is usually desirable from a statistical viewpoint, it is usually impractical, because the cutting operation would render the balance of the product unsalable. Even...
Abstract
This chapter explains how to prepare metallographic samples for light microscopy and how to anticipate and avoid related problems. It describes standard practices and procedures for sectioning, mounting, grinding, and polishing and identifies common defects along with their causes and cures. It also provides recommendations for handling specific materials and addresses safety concerns.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.9781627082679
EISBN: 978-1-62708-267-9
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2000
DOI: 10.31399/asm.tb.ttg2.9781627082693
EISBN: 978-1-62708-269-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.9781627083386
EISBN: 978-1-62708-338-6
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.9781627083232
EISBN: 978-1-62708-323-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.9781627082976
EISBN: 978-1-62708-297-6