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dynamic mechanical analysis

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... components composite materials electrical components electronic components failure analysis mechanical components metallic components plastic components COMMON FAILURE characteristics exhibited by mechanical and electrical components are the focus of this chapter. Before delving into how to...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290207
EISBN: 978-1-62708-306-5
.... Sections of this chapter were adapted from “Machining and Assembly” and “Structural Joints—Bolted and Bonded” by F.C. Campbell, both in Structural Composite Materials , ASM International, 2010; “Failures in Mechanical Fasteners” by W.J. Jensen in Failure Analysis and Prevention , Vol 11, ASM Handbook...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... integrity. One of such interfaces is Al bond pad to copper via (pillar) with a thin Ti layer in between. There are several options to make such interface available for chemical analysis. If the adhesion is poor it is possible to mechanically separate the interfaces, by using aforementioned decap procedure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130241
EISBN: 978-1-62708-284-6
... of technological process applied. The condition of the surface layer is critical to wear resistance during the process of friction and to corrosion resistance. In the case of mechanical loading (especially fatigue resistance) and corrosion, a critical role is played by the substrate, its condition...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... failure modes and effects analysis (FMEA) to anticipate and eliminate potential failure mechanisms – for example by installing a spittle shield over the inspection and wirebonding microscopes. Configuration control – having a well-documented method of making the parts that is consistently followed – will...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130043
EISBN: 978-1-62708-284-6
... of specimens, mechanical testing, macroexamination, microexamination, metallographic examination, determination of the fracture mechanism, chemical analysis, exemplar testing, and analysis and writing the report. The chapter ends with a discussion on various processes involved in the determination of...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.mmfi.9781627083096
EISBN: 978-1-62708-309-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.9781627082815
EISBN: 978-1-62708-281-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
... failure analysis process can contribute to accelerate the technology development yield ramp-up. The current state-of-the-art scanning optical microscope (SOM) tool enables both static and dynamic fault isolation to be performed on the same tool. Figure 3 shows a wafer-level FI setup that...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780019
EISBN: 978-1-62708-268-6
... place to start. Most systems are complex, and it may be that no single engineer knows how the entire system is supposed to work. The failure analysis team may have to interview mechanical, electrical, and software engineers to learn how the system is supposed to operate. More complex systems have...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices. atomic force microscopy failure analysis magnetic force microscopy nanoscale semiconductor device process monitoring scanning capacitance microscopy scanning Kelvin probe microscopy...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130111
EISBN: 978-1-62708-284-6
... examination of the failed part Nondestructive and mechanical testing Selection, identification, preservation, and/or cleaning of specimens Macroscopic examination and analysis and photographic documentation Microscopic examination and analysis Selection, preparation, examination, and analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... Abstract Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780057
EISBN: 978-1-62708-268-6
... example, during the F-16 development program, the U.S. Air Force required that the F-16 not experience more than one aircraft loss every 100,000 flight hours. During development, a fault-tree analysis showed that this overall system failure rate would be exceeded. General Dynamics redesigned portions of...
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.9781627082921
EISBN: 978-1-62708-292-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
..., sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2007
DOI: 10.31399/asm.tb.smnm.t52140071
EISBN: 978-1-62708-264-8
... boundaries that causes grain growth. The process may be understood by considering the soap bubble grains of Fig. 8.1(a) , which also grow by the same mechanism. Figure 8.2 presents an analysis of a force balance on a short segment of grain boundaries snipped out of a small and a large grain. The...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... kinetic energy in electrical fields and scatter accompanied by light emission of a broad spectrum. The typical CMOS logic sends no PE signal in static mode. Switching inverters emit light, so dynamic measurements in picosecond resolution are used for circuit and delay analysis. Failing FETs and circuit...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130133
EISBN: 978-1-62708-284-6
... factors for cold and hot forging, respectively. Supporting topics that are discussed in the case studies include: Validity checks for buster and blocker design Lubrication and wear Mechanical surface phenomenon Forging process design Forging tolerances Table 1 Failure analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... analyzer (TMA), dynamic mechanical analyzer (DMA), hardness testers, Fourier transform infrared spectroscope (FTIR). Information on original part material may be needed Packaging evaluation Severity: non-destructive Tools/Equipment: scanning acoustic microscope (SAM), ion chromatography. Die...