This chapter discusses coating technologies that are applicable to beryllium, including physical and chemical vapor deposition, thermal evaporation, electroplating, sputtering, ion plating, and plasma arc spraying. It describes the advantages and disadvantages of each method and the effect of temperature, pressure, and other process variables on the microstructures and properties developed.

This article summarizes the results of work completed by the ASM Thermal Spray Society Advisory Committee to identify key research challenges and opportunities in the thermal spray field. It describes and prioritizes research priorities related to emerging process methods, thermal spray markets and applications, and process robustness, reliability, and economics.

This chapter describes some of the most effective tools for investigating boiler tube failures, including scanning electron microscopy, optical emission spectroscopy, atomic absorption spectroscopy, x-ray fluorescence spectroscopy, x-ray diffraction, and x-ray photoelectron spectroscopy. It explains how the tools work and what they reveal. It also covers the topic of image analysis and its application in the measurement of grain size, phase/volume fraction, delta ferrite and retained austenite, inclusion rating, depth of carburization/decarburization, scale thickness, pearlite banding, microhardness, and hardness profiles. The chapter concludes with a brief discussion on the effect of scaling and deposition and how to measure it.

This chapter describes surface modification processes that go beyond conventional heat treatments, including plasma nitriding, plasma carburizing, low-pressure carburizing, ion implantation, physical and chemical vapor deposition, salt bath coating, and transformation hardening via high-energy laser and electron beams. The chapter compares methods and includes several example applications.

This chapter reviews the current understanding of high-pressure cold spraying for different materials, covering widely accepted general mechanisms for particle deposition and the processes and parameters involved. It begins by reviewing the mechanisms of bonding. An overview of the optimization of the critical process parameters for improving coating qualities is then provided. This is followed by a separate section dealing with bonding between different materials and addressing influences on adhesion to the substrate as well as the cohesion between dissimilar coating constituents. The knowledge of the basic science and mechanisms finally allows for discussion on the requirements for suitable cold spray equipment and of the parameter sets needed for successful coating deposition.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

This chapter discusses the design and operation of hydraulic presses. It begins by describing the role of each major component in a hydraulic system. It then explains the difference between pump-driven and accumulator-driven presses and the types of applications for which are suited. The chapter goes on to describe the load, energy, and time-dependent characteristics of hydraulic presses and the factors that determine accuracy. It also explains how hydraulic presses are used for deep drawing, fine blanking, and hydroforming as well as warm forming and hot stamping operations.

The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.

This chapter presents the theory and practice associated with the application of thin films. The first half of the chapter describes physical deposition processes in which functional coatings are deposited on component surfaces using mechanical, electromechanical, or thermodynamic techniques. Physical vapor deposition (PVD) techniques include sputtering, e-beam evaporation, arc-PVD, and ion plating and are best suited for elements and compounds with moderate melting points or when a high-purity film is required. The remainder of the chapter covers chemical vapor deposition (CVD) processes, including atomic layer deposition, plasma-enhanced and plasma-assisted CVD, and various forms of vapor-phase epitaxy, which are commonly used for compound films or when deposit purity is less critical. A brief application overview is also presented.

This chapter discusses the effects of corrosion on boiler tube surfaces exposed to water and steam. It describes the process of corrosion, the formation of scale, and the oxides of iron from which it forms. It addresses the primary types of corrosion found in boiler environments, including general corrosion, under-deposit corrosion, microbially induced corrosion, flow-accelerated corrosion, stress-assisted corrosion, erosion-corrosion, cavitation, oxygen pitting, stress-corrosion cracking, and caustic embrittlement. The discussion is supported by several illustrations and relevant case studies.

With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.

This chapter is a compilation of terms and definitions related to corrosion in the petrochemical industry.

Boiler tubes subjected to cyclic or fluctuating loads over extended periods of time are prone to fatigue failure. Fatigue can occur at relatively low stresses and is implicated in almost 80% of the tube failures in firetube boilers. This chapter covers the most common forms of boiler tube fatigue, including mechanical or vibrational fatigue, corrosion fatigue, thermal fatigue, and creep-fatigue interaction. It discusses the causes, characteristics, and impacts of each type and provides several case studies.

Ceramic-matrix composites possess many of the desirable qualities of monolithic ceramics, but are much tougher because of the reinforcements. This chapter explains how reinforcements are used in ceramic-matrix composites and how they alter energy-dissipating mechanisms and load-carrying behaviors. It compares the stress-strain curves for monolithic ceramics and ceramic-matrix composites, noting improvements afforded by the addition of reinforcements. It then goes on to discuss the key attributes, properties, and applications of discontinuously reinforced ceramic composites, continuous fiber ceramic composites, and carbon-carbon composites. It also describes a number of ceramic-matrix composite processing methods, including cold pressing and sintering, hot pressing, reaction bonding, directed metal oxidation, and liquid, vapor, and polymer infiltration.

The overall chemical composition of metals and alloys is most commonly determined by x-ray fluorescence (XRF) and optical emission spectroscopy (OES). High-temperature combustion and inert gas fusion methods are typically used to analyze dissolved gases (oxygen, nitrogen, and hydrogen) and, in some cases, carbon and sulfur in metals. This chapter discusses the operating principles of XRF, OES, combustion and inert gas fusion analysis, surface analysis, and scanning auger microprobe analysis. The details of equipment set-up used for chemical composition analysis as well as the capabilities of related techniques of these methods are also covered.

Increasing growth of high-pressure cold spraying applications on the industrial scale have forced global powder producers to face this challenge and develop specific powders for cold spray applications. This chapter provides information on the properties, classification, characteristics, manufacturing, and procedures for packaging of powders specific to cold spray applications.

This article provides a brief description of commercially important thermal spray processes and gives examples of applications and application requirements. The processes covered are flame, wire arc, plasma, high-velocity oxyfuel processes, detonation gun, and cold spray methods. Examples are provided of the applications in aerospace, automotive, and medical device industries as well as the use of thermal spray as an additive manufacturing technique.