This chapter discusses some of the methods and measurements used to construct phase diagrams. It explains how cooling curves were widely used to determine phase boundaries, and how equilibrated alloys examined under controlled heating and cooling provide information for constructing isothermal and vertical sections as well as liquid projections. It also explains how diffusion couples provide a window into local equilibria and identifies typical phase diagram construction errors along with problems stemming from phase-boundary curvatures and congruent transformations.

This chapter provides an overview of the tools and techniques, as well as some of the underlying theory, that have proven useful for process modeling and simulation. It begins by presenting the framework of a thermoset cure model that accounts for kinetics, viscosity, heat transfer, flow, voids, and residual stress. It then discusses each variable in detail, explaining how it affects the cure process, how it is measured, and how it can be expressed mathematically in the form of a simple model. The discussions throughout the chapter are supported by numerous images, diagrams, and data plots.

Most of the counterfeit parts detected in the electronics industry are either novel or surplus parts or salvaged scrap parts. This article begins by discussing the type of parts used to create counterfeits. It discusses the three most commonly used methods used by counterfeiters to create counterfeits. These include relabeling, refurbishing, and repackaging. The article presents a systematic inspection methodology that can be applied for detecting signs of possible part modifications. The methodology consists of external visual inspection, marking permanency tests, and X-ray inspection followed by material evaluation and characterization. These processes are typically followed by evaluation of the packages to identify defects, degradations, and failure mechanisms that are caused by the processes (e.g., cleaning, solder dipping of leads, reballing) used in creating counterfeit parts.

This chapter discusses the use of thermoset and thermoplastic resins in polymer matrix composites. It begins by explaining how the two classes of polymer differ and how it impacts their use as matrix materials. It then goes on to describe the characteristics of polyester, vinyl ester, epoxy, bismaleimide, cyanate ester, polyimide, and phenolic resins and various toughening methods. The chapter also covers thermoplastic matrix materials and product forms and provides an introduction to the physiochemical tests used to characterize resins and cured laminates.