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die failure

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Published: 01 September 2008
Fig. 35 Example of die failure in a hot forging die caused by coarse grain size and strong precipitation of proeutectoid carbides on austenite grain boundaries. (a) Aspect of the tool. (b) and (c) Microstructure showing the coarse grain size (approximately ASTM 4; expecte d ASTM 8 to 10 More
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Published: 01 September 2008
Fig. 34 Die failure caused by excessive hardening temperature. Two tools were analyzed: one made of VHSUPER steel (commercial brand name) and the other of AISI H13. (a) One of the tools cracked in the position denoted by the arrow, where a sample was cut for analysis. (b) Typical More
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Published: 01 February 2005
Fig. 22.6 Process parameters leading to die failure [ Artinger, 1992 ] More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040295
EISBN: 978-1-62708-300-3
... Abstract This chapter addresses the issue of die failures in hot and cold forging operations. It describes failure classifications, fatigue fracture and wear mechanisms, analytical wear models, and the various factors that limit die life. It also includes several case studies in which finite...
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Published: 01 February 2005
Fig. 22.1 Typical failure modes and locations in precision-forging die [ Schey, 1983 ] More
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Published: 01 February 2005
Fig. 22.12 Forward extrusion die cross section used by Hettig for fatigue failure investigation [ Hettig, 1990 ] More
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Published: 01 January 1998
Fig. 17-5 Failure of die by cracking caused by the stress-concentration effect of deep stamp marks More
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Published: 01 January 1998
Fig. 17-6 Premature failure of a 5% Cr hot-work die steel caused by the severe stress-concentration effect of very sharp corners More
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Published: 01 January 1998
Fig. 17-7 Failure of holder for a cold-heading die insert caused by overstressing associated with forcing the insert into the poorly designed holder More
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Published: 01 January 1998
Fig. 17-18 Failure of a high-carbon, high-chromium drawing die due to grinding cracks. Grinding cracks around the inner diameter were revealed by deep etching More
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Published: 01 April 2004
Fig. 2.18 Cumulative failure data for TO-220 silicon semiconductor die, subject to power cycling. Joints were fabricated using preforms prepared using conventional casting (dark bars in chart) and mechanical working or rapid solidification technology (white bars on chart). Adapted from More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 1998
DOI: 10.31399/asm.tb.ts5.t65900325
EISBN: 978-1-62708-358-4
... Abstract This chapter presents an overview of some of the major causes of tool and die failures. The chapter describes fracture and fracture toughness of tool steels, and the influence of factors such as steel quality and primary processing, mechanical design, heat treatment, grinding...
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Published: 01 September 2008
(in a) the problems of a coarse white layer and nitrides on grain boundaries. (c) and (d) Extracted from a die-casting die failure analysis, also for surface and core respectively. Note the strong precipitation on grain boundaries in (c), whereas core regions are quite well heat treated (to approximately 44 HRC More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130311
EISBN: 978-1-62708-284-6
..., made of a high-speed steel, that cracked because of the large difference in section. Source Ref 1 . (b) The same for a D2 die, also assisted by poor machine finishing. Source: Ref 8 . (c) O-type steel die cracked through the sharp corners Source: Ref 8 . (d) Failure of die caused by stress...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
.... This article provides an overview of CSPs and their classification as well as their advantages and applications, and reveals some of the challenges in performing failure analysis on CSPs, particularly for CSPs in special package configurations such as stacked die multi-chip-packages (MCPs) and wafer level CSPs...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... Row Multiple Row Other Row Cross Periphery Logic Contiguous Block Systemic Defect Classification Rules Several important rules are used to classify defects. If a die fails more than 95% of the bits it is considered a gross failure, or sometimes referred to as a “chip kill...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090109
EISBN: 978-1-62708-462-8
... Abstract The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040211
EISBN: 978-1-62708-300-3
... forces into a variety of shapes. These shapes are usually axisymmetric with relatively small nonsymmetrical features, and, unlike impression-die forging (see Chapter 14, “Process Design in Impression-Die Forging” ), the process does not generate flash. The terms cold forging and cold extrusion...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090021
EISBN: 978-1-62708-462-8
... to transfer an already very thin silicon to another package makes it even more challenging to make the process successful. How to keep the die and the failure mode intact is a major challenge, not only when repackaging but even when trying to open access for fault isolation ( Fig. 32 ). Fig. 32...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Microscopy and Prep Transmission Electron Microscopy (TEM) has become a key analysis step for the failure analysis of 3D packaging. Stacking multiple die from different manufacturers leads to a number of different interfaces that may need to be analyzed. The fact that these interfaces are embedded...