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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... Failure Analysis Desk Reference , Fourth Edition , ASM International , 2002 . [3] Effects of x-ray irradiation on the channel hot-carrier reliability of thin-oxide re-channel MOSFETs ,” J. Y. C. Sunet al., Conf. Solid State Devices and Mater . ( Japan ), 1986 , pp. 479 . [4] Comparison...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... probing techniques are E-beam Logic State Imaging, Electron-beam Signal Image Mapping, and E-beam Device Perturbation. Backside nano-probing techniques discussed include: Electron Beam Absorbed Current, Electron Beam Induced Resistance Change, four terminal resistance measurements, resistive gate defect...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices. atomic force microscopy failure analysis magnetic force microscopy nanoscale semiconductor device process monitoring scanning capacitance microscopy scanning Kelvin...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
..., and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
.... and Kamino T. , Proceedings from the 25 th International symposium for Testing and Failure Analysis , 1999 , p 449 . 22. Hartfield C. , Hammer M. , Amador G. , and Moore T. , Electronic Device Failure Analysis , 13 , Issue 3 , 2011 , P 18 . 23. Leslie A. J...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110279
EISBN: 978-1-62708-247-1
...Abstract Abstract Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720021
EISBN: 978-1-62708-305-8
..., and measurement of material dimensions. It discusses the mechanisms, advantages, limitations, components, and applications of various visual inspection tools, namely magnifying devices, lighting for visual inspection, measuring devices, miscellaneous measuring equipment, record-keeping devices, and macroetching...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220241
EISBN: 978-1-62708-341-6
... heating rates of induction are needed for processing nonconductors. This chapter describes broad methods of accomplishing such objectives: modification of the field of magnetic induction, use of devices to prevent auxiliary equipment or certain portions of a workpiece from being heated, and techniques...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
...Abstract Abstract Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... of contactless characterization for the most important electronic device, the MOS - Field Effect Transistor, the heart of ICs and their basic digital element, the CMOS inverter. The article discusses the specification and selection of detectors for proper PE applications. The main topics are image resolution...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110652
EISBN: 978-1-62708-247-1
...Abstract Abstract In the Semiconductor I/C industry, it has been well documented that the proportion of factory and customer field returns attributed to device damage resulting from electrical over-stress (EOS) and electro-static discharge (ESD) can amount to 40 to 50%. This study entailed EOS...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300363
EISBN: 978-1-62708-323-2
... of biotribology in the context of dental care, orthopedic implants, haptics, eyewear, and stents and fixation devices. It also addresses the issue of biocompatibility and the effects of friction and contact pressure on skin. Selected References Selected References • Bartinea G.M. and Lavrentev...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780153
EISBN: 978-1-62708-281-5
... of xenon arc lamp for the weatherometer and fadeometer and the use of fluorescent sunlamp in test devices. References References 1. Hirt R.C. and Searle N.D. , Energy Characteristics of Outdoor and Indoor Exposure Sources and Their Relation to the Weatherability of Plastics...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ems.t53730037
EISBN: 978-1-62708-283-9
.... It discusses the significance of energy bands, intrinsic and extrinsic conduction, and the properties of compound semiconductors. It also covers semiconductor devices, including p-n junctions, light emitting diodes, transistors, and piezoelectric crystals. electrical behavior light emitting diodes...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220069
EISBN: 978-1-62708-259-4
... of surface roughness, the factors that contribute to it, and its effect on image quality. It discusses the use of fixturing and holding devices, includes photographic examples of polishing defects and drying marks, and provides an overview of micrographic etchants and the features they reveal. It also...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220077
EISBN: 978-1-62708-341-6
... equipped with a recuperator that returns waste heat to the plant air-circulation system Source: Water Saver Systems, Inc. Abstract Abstract This chapter describes two types of auxiliary equipment required in most induction heating installations: cooling systems and device timers. Water- and vapor...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220143
EISBN: 978-1-62708-341-6
... controllers and heat-regulating devices. Integration of control functions is illustrated with examples related to heating of steel slabs, surface hardening of steel parts, vacuum induction melting for casting operations, and process optimization for electric-demand control. Distributed control within larger...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050025
EISBN: 978-1-62708-311-9
... on fixtures and work-handling devices, quench systems, and load matching and tuning procedures. References References 1. Haimbaugh R.E. , Induction Heat Treating Corp. , personal communication 2. Loveless D.L. et al. , Power Supplies for Induction Heating , Ind. Heat. , June...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
.... Figure 3 shows a wafer-level FI setup that involves docking a standard production tester to an inverted scanning optical microscope (SOM). It is apparent that the test setup remains unchanged; the only difference lies in the prober. The probe pins on the probe card electrically couples the devices...