Fig. 12 Pin delamination from the mold, resulting in a crack formation through the bond wire More

Figure 15 Crack to bottom (blue) and pin delamination More

Figure 15 Delamination in a MLCC detected by (a) C-SAM can be seen in the (b) cross sectioned view. More

Figure 8 Reflection at normal incidence of a plane wave at a delamination (left) and at a bonded interface (right). More

Figure 19 Delamination images of the same 68PLCC taken initially (A) and then after VPR exposure (B). 68PLCCs are 24mm square. More

Figure 60 Delamination detection of Cu-Cu bonded micropillars by acoustic GHz-microscopy. Top: Electron micrograph of a physical cross section. The red arrows indicate delamination between the BCB and the electrical routing. Bottom: Acoustic GHz-image of the sample site prior to physical More

Fig. 16.11 Subsurface crack observations during delamination failure of thermal spray WC-Co coating. Source: Ref 16.3 More

Fig. 12.59 Delamination fracture in a cold worked filament of eutectoid steel, used to manufacture twisted steel cords. More

Fig. 15.15 Examples of wire that failed by delamination (top) and by torsional deformation and transverse shear fracture (bottom). SEM micrographs. Source: Ref 15.39 More

Fig. 15.15 Steam pressure delamination curve for carbon/bismaleimide More

Fig. 18.7 Preventing stiffener delamination More

Fig. 8.26 Two types of delamination in unnotched laminates. Only two 90° plies and four angle plies ( n = 4, t = 6) are shown in these models. Source: Ref 8.28 More

Fig. 8.27 Prediction of delamination onset in –25/90 interfaces of [25/—25/90 n ] S laminates. Note that the G C value was separately determined by O’Brien (for the same material and stacking arrangement). Source: Analysis, Ref 8.28 ; test data points, Ref 8.34 More

Fig. 6 Schematics illustrating the causes of adhesive delamination for a metal adherend. (a) Results of moisture entry in the unstable oxide. (b) Corrosion of alcladding and base aluminum. A, adhesive primer system; B, oxide; C, alcladding; D, base aluminum More

Fig. 19.3 Multiple levels of delamination around the fastener hole. Source: Ref 1 More

Figure 25 Open IND Failure (a) external as-is image and (b) SEM image showing delamination in a cross-sectioned view. More

Figure 21 Illustration of current distribution in a good and a delaminated (failing) flip-chip bump. More

Fig. 15.16 Torque versus number of revolutions for a wire that did not delaminate (High Si-LS-AD-1) and for wires that did delaminate (High Si-LS-400/10 -2 and -3). Source: Ref 15.50 More

Fig. 13 Delaminations and matrix cracking due to impact damage. Source: Ref 1 More

Fig. 15.4 Micrograph taken at an area under the lightning strike zone showing delamination and microcracking in the composite. Epi-fluorescence, 390–440 nm excitation, 10× objective More