Skip Nav Destination
Close Modal
Search Results for
degree of ionization
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Book Series
Date
Availability
1-20 of 27 Search Results for
degree of ionization
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
... of how CMOS elements respond to defects. Often circuit depth is lacking so this paper also targets failure analysts who need electronic knowledge, but who may have degree backgrounds in physics, chemistry, chemical engineering, materials science, or biology. It cannot replace a course in electronics...
Abstract
Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130177
EISBN: 978-1-62708-284-6
... and plastic properties, especially impact resistance and also steel hardenability. Grain size is characterized by the size of the austenite grain, and it is dependent on various factors, such as degree of cooling and the deoxidation process during steelmaking (Ref 95) . Generally, an ASTM grain size...
Abstract
This chapter provides information on various contributors to failure of carburized and carbonitrided components, with the primary focus on carburized components. The most common contributors covered include component design, selection of proper hardenability, increased residual stress, dimensional stability, and generation of quenching and grinding cracks. They also include insufficient case hardness and improper core hardness, influence of surface carbon content and grain size, internal oxidation, structure of carbides, and inclusion of noncarbide. Details on micropitting, macropitting, case crushing, pitting corrosion, and partial melting are also provided.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.9781627082815
EISBN: 978-1-62708-281-5
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290023
EISBN: 978-1-62708-306-5
.... With its low ionization potential, argon promotes easy arc starting and stable arc operation. Its lower thermal conductivity promotes the development of axial “spray” transfer in certain forms of GMAW. It is also used in applications where base material distortion must be controlled or where good gap...
Abstract
Arc welding applies to a large and diversified group of welding processes that use an electric arc as the source of heat to melt and join metals. This chapter provides a detailed overview of specific arc welding methods: shielded metal arc welding, flux cored arc welding, submerged arc welding, gas metal arc welding, gas tungsten arc welding, plasma arc welding, plasma-GMAW welding, electroslag welding, and electrogas welding. The basic characteristics of gases used for shielding during arc welding are briefly discussed.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420363
EISBN: 978-1-62708-310-2
... one nucleus into an orbital shared by two nuclei. Covalent bonds, because they do not ionize, will not conduct electricity and are nonconductors. Covalent bonds form the basis for many organic compounds, including long-chain polymer molecules. As the molecule size increases, the bond strength of the...
Abstract
This appendix provides a detailed overview of the crystal structure of metals. It describes primary bonding mechanisms, space lattices and crystal systems, unit cell parameters, slip systems, and crystallographic planes and directions as well as plastic deformation mechanisms, crystalline imperfections, and the formation of surface or planar defects. It also discusses the use of X-ray diffraction for determining crystal structure.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... Abstract The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the...
Abstract
The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110413
EISBN: 978-1-62708-247-1
... really came of age with the development of Gaseous Detection Devices capable of indirectly detecting secondary electrons at high pressure. The secondary electrons cause ionization in the gas and the gas ions are then collected and counted to produce the image signal. As the gas pressure is raised in...
Abstract
This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720233
EISBN: 978-1-62708-305-8
... light all travel in straight lines. Straight line propagation is the chief characteristic of radiation that permits formation of a sharply discernible shadow. The geometric relationships of source, object, and screen to each other determine the three main characteristics of the shadow: the degrees of...
Abstract
This chapter discusses radiography methods using x-rays, gamma rays, and neutrons. It begins with a discussion on the applications and principles of radiography followed by sections providing information on the sources of radiation, classifications, and characteristics of x-ray tubes. Three primary attenuation processes of electromagnetic radiation, namely photoelectric effect, Compton scattering, and pair production, are covered. The chapter then discusses the principles of shadow formation, the process involved in the conversion of radiation into a form suitable for observation, and the characteristics of x-ray film. It provides information on various exposure factors in film radiography. The chapter provides a description of the characteristics that differentiate neutron radiography from x-ray or gamma ray radiography. The application of neutron radiography is described in terms of its advantages for improved contrast on low atomic number materials, discrimination between isotopes, or inspection of radioactive specimens.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... energy that the electrons pick up by passing through the high field zone of the pinched off channel thus producing hot electrons or impact ionization. The electron distribution in the high field zone is obviously similar to a fermi distribution that again can be approximated by an exponential function...
Abstract
Photon emission (PE) is one of the major optical techniques for contactless isolation of functional faults in integrated circuits (ICs) in full electrical operation. This article describes the fundamental mechanisms of PE in silicon based ICs. It presents the opportunities of contactless characterization for the most important electronic device, the MOS - Field Effect Transistor, the heart of ICs and their basic digital element, the CMOS inverter. The article discusses the specification and selection of detectors for proper PE applications. The main topics are image resolution, sensitivity, and spectral range of the detectors. The article also discusses the value and application of spectral information in the PE signal. It describes state of the art IC technologies. Finally, the article discusses the applications of PE in ICs and also I/O devices, integrated bipolar transistors in BiCMOS technologies, and parasitic bipolar effects like latch up.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290165
EISBN: 978-1-62708-306-5
... degree of skill is required to perform manual brazing operations; personnel limitations may rule out the process. Brazing fluxes and filler rods may evolve toxic fumes and poisonous vapors. Many types of solder contain lead, which is a poison. Many industries are attempting to move to lead-free solder...
Abstract
Brazing and soldering processes use a molten filler metal to wet the mating surfaces of a joint, with or without the aid of a fluxing agent, leading to the formation of a metallurgical bond between the filler and the respective components. This chapter discusses the characteristics, advantages, and disadvantages of brazing and soldering. The first part focuses on the fundamentals of the brazing process and provides information on filler metals and specific brazing methods. The soldering portion of the chapters provides information on solder alloys used, selection criteria for base metal, the processes involved in precleaning and surface preparation, types of fluxes used, solder joint design, and solder heating methods.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290099
EISBN: 978-1-62708-306-5
... be ground out and repair welded. Lack of fusion and lack of penetration result from improper electrode manipulation and the use of incorrect welding conditions. Fusion refers to the degree to which the original base metal surfaces to be welded have been fused to the filler metal. Penetration...
Abstract
During fusion welding, the thermal cycles produced by the moving heat source causes physical state changes, metallurgical phase transformations, and transient thermal stresses and metal movement. This chapter begins by discussing weld metal solidification behavior and the solid-state transformations of the main classes of metals and alloys during fusion welding. The main classes include work- or strain-hardened metals and alloys, precipitation-hardened alloys, transformation-hardened steels and cast irons, stainless steels, and solid-solution and dispersion-hardened alloys. The following section provides information on the residual stresses and distortion that remain after welding. The focus then shifts to distortion control of weldments. Inclusions and cracking are discussed in detail. The chapter also discusses the causes for reduced fatigue strength of a component by a weld: stress concentration due to weld shape and joint geometry; stress concentration due to weld imperfections; and residual welding stresses. Inspection and characterization of welds are described in the final section of this chapter.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550325
EISBN: 978-1-62708-307-2
...-reinforcement combinations offer extremely favorable strength-to-weight and stiffness-to-weight ratios. Transparency . Several plastics offer transparency and a high degree of optical clarity. Toughness . Many plastics offer toughness, most commonly regarded as freedom from the tendency to fracture...
Abstract
This chapter describes the molecular structures and chemical reactions associated with the production of thermoset and thermoplastic components. It compares and contrasts the mechanical properties of engineering plastics with those of metals, and explains how fillers and reinforcements affect impact and tensile strength, shrinkage, thermal expansion, and thermal conductivity. It examines the relationship between tensile modulus and temperature, provides thermal property data for selected plastics, and discusses the effect of chemical exposure, operating temperature, and residual stress. The chapter also includes a section on the uses of thermoplastic and thermosetting resins and provides information on fabrication processes and fastening and joining methods.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2013
DOI: 10.31399/asm.tb.mfub.t53740271
EISBN: 978-1-62708-308-9
... still retaining some degree of ductility. This ability of steels to be strengthened is a direct consequence of the amount of carbon present ( Fig. 1 ). As the carbon content is increased, higher strength levels are obtainable. Although the ductility decreases with increasing strength, it is still high...
Abstract
This chapter discusses the processes used in manufacturing to thermally alter the properties of metals and alloys. It begins with a review of the iron-carbon system, the factors that affect hardenability, and the use of continuous cooling transformation diagrams. It then explains how various steels respond to heat treatments, such as annealing, normalizing, spheroidizing, tempering, and direct and interrupted quenching, and surface-hardening processes, such as flame and induction hardening, carburizing, nitriding, and carbonitriding. It also addresses the issue of temper embrittlement and discusses the effect of precipitation hardening on aluminum and other alloys.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... cross-section TEM image NMOS transistor, tilted few degrees away from [110] Si zone-axis to minimize diffraction effects. (b) An image of reference hologram without the sample in the path of the beam, recorded after positively biasing the biprism wire. (c) Image of the hologram recorded with sample...
Abstract
The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... ionization probability of the sputtered material while little enhancement is gained using a non-reactive beam. Oxygen is generally used to enhance the positive ion yield via the local breaking of oxide bonds, whereas cesium enhancement results from the change in work function induced by the cesiated surface...
Abstract
With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2013
DOI: 10.31399/asm.tb.mfub.t53740325
EISBN: 978-1-62708-308-9
... selection of a cleaning procedure greatly depends on the degree of cleanliness required and subsequent operations to be performed. Abrasive blasting produces the lowest degree of cleanliness. Solvent, solvent vapor degrease, emulsion soak, alkaline soak, alkaline electroclean, alkaline plus acid cleaning...
Abstract
This chapter covers a wide range of finishing and coating operations, including cleaning, honing, polishing and buffing, and lapping. It discusses the use of rust-preventative compounds, conversion coatings, and plating metals as well as weld overlay, thermal spray, and ceramic coatings and various pack cementation and deposition processes. It also discusses the selection and use of industrial paints and paint application methods.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170417
EISBN: 978-1-62708-297-6
... range from 425 to 595 °C (800 to 1100 °F). Titanium aluminide alloys show promise for applications at temperatures up to 760 °C (1400 °F). Titanium has the ability to passivate and thereby exhibits a high degree of immunity to attack by most mineral acids and chlorides. Titanium is non-toxic and...
Abstract
This article discusses the role of alloying in the production and use of titanium. It explains how alloying elements affect transformation temperatures, tensile and creep strength, elasticity, hardness, and corrosion behaviors. It provides composition and property data for commercial grades of titanium, addresses processing issues, and identifies operating environments where certain titanium alloys are susceptible to stress-corrosion cracking.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550223
EISBN: 978-1-62708-307-2
... have melting points higher than those of steels, but maximum useful temperatures for structural applications generally range from 425 to 595 °C (800 to 1100 °F). Titanium has the ability to passivate and thereby exhibit a high degree of immunity to attack by most mineral acids and chlorides. Titanium...
Abstract
Titanium is a lightweight metal used in a growing number of applications for its strength, toughness, stiffness, corrosion resistance, biocompatibility, and high-temperature operating characteristics. This chapter discusses the applications, metallurgy, properties, compositions, and grades of commercially pure titanium and alpha and near-alpha, alpha-beta, and beta titanium alloys. It describes primary and secondary fabrication processes, including melting, forging, forming, heat treating, casting, machining, and joining as well as powder metallurgy and direct metal deposition. It also compares and contrasts the properties of wrought, cast, and powder metal titanium products and discusses corrosion behaviors.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550033
EISBN: 978-1-62708-307-2
... a variety of decorative and functional uses. Aluminum typically displays excellent electrical and thermal conductivity, but specific alloys have been developed with high degrees of electrical resistivity. These alloys are useful, for example, in high-torque electric motors. Aluminum is often...
Abstract
This chapter provides basic engineering information on aluminum alloys with an emphasis on their use in applications where weight is a significant design factor. It discusses the advantages and limitations of various types of aluminum along with their compositions, designations, and achievable strengths. It explains how some alloys are hardened through solution strengthening and cold working, while others are strengthened by precipitation hardening. It also describes production and fabrication processes such as melting, casting, rolling, forging, forming, extruding, heat treating, and joining, and includes a section on the causes and effects of corrosion and how they are typically controlled.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280041
EISBN: 978-1-62708-267-9
..., and degree of chemistry control required. Table 4.1 lists common melting combinations for some frequently used superalloys. Table 4.1 Common melt methods for selected superalloys Alloy Melt method 600 EAF/AOD + ESR 625 EAF/AOD + ESR VIM + ESR VIM + VAR 706 VIM + ESR VIM...
Abstract
This chapter discusses the melting and conversion of superalloys and the solidification challenges they present. Superalloys have high solute content which can lead to untreatable defects if they solidify too slowly. These defects, called freckles, are highly detrimental to fatigue life. The chapter explains how and why freckles form as well as how they can be prevented. It describes the criteria for selecting the proper melting method for specific alloys based on melt segregation and chemistry requirements. It compares standard processes, including electric arc furnace/argon oxygen decarburization melting, vacuum induction melting, vacuum arc remelting, and electroslag remelting. It also addresses related issues such as consumable remelt quality, control anomalies, melt pool characteristics, and melt-related defects, and includes a section that discusses the processes involved in converting cast ingots into mill products.