In a perfect crystalline structure, there is an orderly repetition of the lattice in every direction in space. Real crystals contain a considerable number of imperfections, or defects, that affect their physical, chemical, mechanical, and electronic properties. Defects play an important role in processes such as deformation, annealing, precipitation, diffusion, and sintering. All defects and imperfections can be conveniently classified under four main divisions: point defects, line defects, planar defects, and volume defects. This chapter provides a detailed discussion on the causes, nature, and impact of these defects in metals. It also describes the mechanisms that cause plastic deformation in metals.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

This appendix provides a detailed overview of the crystal structure of metals. It describes primary bonding mechanisms, space lattices and crystal systems, unit cell parameters, slip systems, and crystallographic planes and directions as well as plastic deformation mechanisms, crystalline imperfections, and the formation of surface or planar defects. It also discusses the use of X-ray diffraction for determining crystal structure.

This chapter discusses the extrusion characteristics of hard aluminum alloys, particularly those in the 5000 and 7000 series. It begins with a review of two studies, one showing how the extrudability of 7 xxx alloys varies with the presence and amount of different alloying elements, the other relating minimum wall thickness with circumscribing circle diameter. It then explains how oxides on either the billet or container complicate the control of extrusion as well as auxiliary processes and how material flow and the movement of trapped gasses in different regions of the extrusion can lead to defects and variations in strength. It also discusses the extrusion of aluminum matrix composites and explains how composite billets are made.

This chapter discusses the extrusion characteristics of relatively soft aluminum alloys. It begins by identifying alloy designations within the class and the types of extrusions made from them. It then explains how extruded shapes and cross-sections are defined and how to analyze and assess important process variables such as runout, extrusion pressure, ram speed, and butt thickness. It also provides best practices for various operations and explains how to identify and remedy common extrusion defects.

Ultrasonic inspection is a nondestructive method in which beams of high frequency acoustic energy are introduced into a material to detect surface and subsurface flaws, to measure the thickness of the material, and to measure the distance to a flaw. This chapter begins with an overview of ultrasonic flaw detectors, ultrasonic transducers, and search units and couplants. It then discusses the principles of operation, presentation, and interpretation of data of pulse echo and transmission methods. This is followed by sections providing information on general characteristics of ultrasonic waves and the factors influencing ultrasonic inspection. The advantages, disadvantages, and applications of ultrasonic inspection are finally compared with other methods of nondestructive inspection of metal parts.

This article addresses the ancillary issues regarding the nanoprobing and characterization of transistors, probing copper metallization layers, and the various imaging techniques. The discussion includes several characterization examples of known transistor failure types, namely four probe transistor characterization, two probe transistor characterization, and probing and characterizing metallization issues. The imaging techniques discussed are those that are specific to atomic force nanoprober or scanning electron microscope based tools. They are current contrast imaging, scanning capacitance imaging, e-beam absorbed current imaging, e-beam induced current imaging, e-beam induced resistance change imaging, and active voltage contrast imaging.

This chapter explains how to recognize decarburization and related defects. It includes images showing how decarburization appears in various steels, discusses stock removal practices, and describes common defects and flaws such as quench cracks and where they are typically found.

This chapter describes three approaches for 3D hot-spot localization of thermally active defects by lock-in thermography (LIT). In the first section, phase-shift analysis for analyzing stacked die packages is performed. The second example employs defocusing sequences for the localization of resistive electrical shorts in 3D architectures, and the third operates in cross sectional LIT mode to investigate defects in the insulation liner of Through Silicon Vias. All three approaches allow for a precise localization of thermally active defects in all three spatial dimensions to guide subsequent high-resolution physical analyses.

The casting engineer contributes to a successful component design by offering expertise in molding, core making, and material characteristics and by recommending the most suitable casting process to use to meet quality and cost targets. The casting engineer's responsibilities include recommending locator positioning; advising about lugs, hooks, or holes for casting handling through all processes; determining the choice of a parting plane and pouring orientation; designing cores for accurate positioning, suitable venting, and proper cleaning; guiding decisions about wall thicknesses and junctions; making suggestions about casting design to eliminate distortion; optimizing the gating design for slag-free metal; and establishing the feeding techniques to eliminate shrink porosity. This chapter provides the guidelines for these responsibilities. In addition, the guidelines for the use of chaplets and chills in cast iron castings; guidelines for drafts, machine stock, tolerances, and contraction or shrink rule; and guidelines for pattern layouts and nesting are also covered.

This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.

This chapter identifies the primary causes of service failures and discusses the types of defects from which they stem. It presents more than a dozen examples of failures attributed to such causes as design defects, material defects, and manufacturing or processing defects as well as assembly errors, abnormal operating conditions, and inadequate maintenance. It also describes the precise usage of terms such as defect, flaw, imperfection, and discontinuity.

Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.

This appendix provides detailed information on design deficiencies, material and manufacturing defects, and service-life anomalies. It covers ingot-related defects, forging and sheet forming imperfections, casting defects, heat treating defects, and weld discontinuities. It shows how application life is affected by the severity of service conditions and discusses the consequences of using inappropriate materials.

Many defects generate excessive heat during operation; this is due to the power dissipation associated with the excess current flow at the defect site. There are several thermal detection techniques for failure analysis and this article focuses on infrared thermography with lock-in detection, which detects an object's temperature from its infrared emission based on blackbody radiation physics. The basic principles and the interpretation of the results are reviewed. Some typical results and a series of examples illustrating the application of this technique are also shown. Brief sections are devoted to the discussion on liquid-crystal imaging and fluorescent microthermal imaging technique for thermal detection.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.

This chapter discusses the use of nondestructive inspection methods, including visual, ultrasonic, radiographic, and thermographic techniques, and the types of flaws and damages they can reveal in composite parts and assemblies. It describes the basic principles behind each method along with best practices and procedures.

Unlike metals, in which fatigue failures are due to a single crack that grows to a critical length, the effects of fatigue in composites are much more distributed and varied. As the chapter explains, there are five major damage mechanisms that contribute to the progression of composite fatigue, those being matrix cracking, fiber breaking, crack coupling, delamination initiation, and delamination growth. The chapter describes each mechanism in detail along with related factors. It also discusses the primary differences between composites and metals, the effect of manufacturing defects, damage tolerance, and testing and certification.

During fusion welding, the thermal cycles produced by the moving heat source causes physical state changes, metallurgical phase transformations, and transient thermal stresses and metal movement. This chapter begins by discussing weld metal solidification behavior and the solid-state transformations of the main classes of metals and alloys during fusion welding. The main classes include work- or strain-hardened metals and alloys, precipitation-hardened alloys, transformation-hardened steels and cast irons, stainless steels, and solid-solution and dispersion-hardened alloys. The following section provides information on the residual stresses and distortion that remain after welding. The focus then shifts to distortion control of weldments. Inclusions and cracking are discussed in detail. The chapter also discusses the causes for reduced fatigue strength of a component by a weld: stress concentration due to weld shape and joint geometry; stress concentration due to weld imperfections; and residual welding stresses. Inspection and characterization of welds are described in the final section of this chapter.

Alloying, heat treating, and work hardening are widely used to control material properties, and though they take different approaches, they all focus on imperfections of one type or other. This chapter provides readers with essential background on these material imperfections and their relevance in design and manufacturing. It begins with a review of compositional impurities, the physical arrangement of atoms in solid solution, and the factors that determine maximum solubility. It then describes different types of structural imperfections, including point, line, and planar defects, and how they respond to applied stresses and strains. The chapter makes extensive use of graphics to illustrate crystal lattice structures and related concepts such as vacancies and interstitial sites, ion migration, volume expansion, antisite defects, edge and screw dislocations, slip planes, twinning planes, and dislocation passage through precipitates. It also points out important structure-property correlations.