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Published: 01 March 2012
Fig. A.29 Vacancy point defect. Source: Ref A.5 as published in Ref A.1 More
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Published: 01 March 2012
Fig. A.32 Foreign atom point defects. Source: Ref A.5 as published in Ref A.1 More
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Published: 01 June 2008
Fig. 2.1 Vacancy point defect. Source: Ref 1 More
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Published: 01 June 2008
Fig. 2.4 Foreign atom point defects. Source: Ref 1 More
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Published: 01 March 2000
Fig. 26 Streaking after anodizing with back-end defect. Source: Ref 16 More
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Published: 01 March 2000
Fig. 5 Progressing piping defects. Source: Ref 15 More
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Published: 01 March 2006
Fig. A.12 Point defects. (a) Vacancy. (b) Interstitial. (c) Foreign atom. Source: Ref A.22 More
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Published: 01 November 2012
Fig. 27 Relative severity of defects on compression fatigue strength. Source: Ref 7 More
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Published: 01 April 2013
Fig. 3 Oscilloscope displays using ultrasonic transducers of (a) high and low penetration (ability to detect defects at distances within the solid), and (b) high and low resolution (ability to separate echoes from closely spaced defects). Source: Ref 1 More
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Published: 01 January 2022
areas of the casting are solidified and helps to identify isolated areas that may produce casting defects. Source: Ref 13 . Courtesy of MAGMA Foundry Technologies More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240017
EISBN: 978-1-62708-251-8
..., the lattice vibrations become larger, and atoms have a tendency to jump out of their normal positions, leaving a vacant lattice site behind. Fig. 2.1 Vacancy point defect. Source: Ref 1 The number of vacancies increases exponentially with temperature according to: (Eq 2.1) n v = N...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... users save time, reduce cost, and diminish the risk processing errors. To further improve tool productivity, equipment manufacturers have developed innovative features such as live CAD-overlay to provide multiple sources of information that help users understand samples structure and defect source...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420363
EISBN: 978-1-62708-310-2
..., crystalline imperfections, and the formation of surface or planar defects. It also discusses the use of X-ray diffraction for determining crystal structure. crystalline structures line defects metallic structure planar defects plastic deformation point defects volume defects X-ray diffraction...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050175
EISBN: 978-1-62708-311-9
... and in nuts. Source: Ref 3 Fig. 9.7 Micrograph of a seam in cross section of a ¾ in. diam medium carbon steel bar, showing oxide and decarburization in the seam. 350×. Source: Ref 3 Surface Defect and Seam Detection Sometimes surface defects can be seen visually without magnification...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260187
EISBN: 978-1-62708-336-2
... strength Fig. 15 Typical insert die with backer and recommended insert details. Source: Ref 22 Extrusion Process and Defects Like regular aluminum alloys, direct or indirect extrusion processes are used to extrude aluminum-base MMCs. Because the flow stress of aluminum-base MMCs...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110285
EISBN: 978-1-62708-247-1
... the transistor. Two-probe measurements identifies type and location of defect within the material interfaces of the transistor. The type of two-probe measurements that are performed are Gate to Well, Gate to Source, Gate to Drain, Source to Well, Drain to Well, and Drain to Source (Gate off). These additional...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110219
EISBN: 978-1-62708-247-1
... defect localization within 3D packages exemplarily shown in Figure 1 . The technique allows to non-destructively localize resistive opens and electrical shorts within packaged devices by detecting and analyzing defect-related thermal sources caused by the dissipation of electrical power. Figure 1...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270005
EISBN: 978-1-62708-301-0
... concentration. Such inclusions nucleate cracks that propagate by fatigue under service conditions. Figure 2.8 shows a crack associated with one such inclusion. Fig. 2.8 Crack associated with an inclusion. Source: Ref 7 2.3.2 Failures due to Processing Defects introduced during the various...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2000
DOI: 10.31399/asm.tb.aet.t68260149
EISBN: 978-1-62708-336-2
... and assess important process variables such as runout, extrusion pressure, ram speed, and butt thickness. It also provides best practices for various operations and explains how to identify and remedy common extrusion defects. aluminum alloys extrudability extrusion extrusion defects heat treatment...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... developed to localize diffusions associated with IC defects. The high selectivity of LIVA permits examination of the entire IC die in a single, unprocessed image. LIVA examination of an IC’s surface from the frontside is performed using a visible laser light source. By using an infrared light source LIVA...