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This chapter is dedicated mostly to the metallurgical effects on the corrosion behavior of corrosion-resistant alloys. It begins with a section describing the importance of alloying elements on the corrosion behavior of nickel alloys. The chapter considers the metallurgical effects of alloy composition for heat-resistant alloys, nickel corrosion-resistant alloys, and nickel-base alloys. This chapter also discusses the corrosion implications of changing the alloy microstructure via solid-state transformation, second-phase precipitation, or cold work. It concludes with a comparison of corrosion behavior between cast and wrought product forms.

This chapter is dedicated mostly to the metallurgical effects on the corrosion behavior of corrosion-resistant alloys. It begins with a section describing the importance of alloying elements on the corrosion behavior of nickel alloys. The chapter considers the metallurgical effects of alloy composition for heat-resistant alloys, nickel corrosion-resistant alloys, and nickel-base alloys. This chapter also discusses the corrosion implications of changing the alloy microstructure via solid-state transformation, second-phase precipitation, or cold work. It concludes with a comparison of corrosion behavior between cast and wrought product forms.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.

This chapter describes incremental sheet forming processes, including single-point, two-point, and kinematic (two tool) techniques. It provides information on the tooling and equipment used, work flow and forming parameters, process mechanics and forming limits. It also discusses multistage forming strategies, process modeling and simulation, and advanced hybrid forming processes.

The temperature and atmosphere conditions must be precisely controlled in order to achieve the desired metallurgical results during heat treating operations. In order to ensure the repeatability of operation, a heat treating system must have the necessary sensors, timers, and variable (temperature, atmosphere, etc.) controllers to hold the process within prescribed or specified limits. This chapter discusses temperature and atmosphere sensors used in a heat treating system. The temperature sensors covered are contact and noncontact types. The atmosphere sensors covered are oxygen probe, dew point, and infrared. The chapter concludes with an overview of the development of integrated control systems.

This chapter is a detailed account of the tensile testing procedure used for evaluating metals and alloys. The discussion covers the stress-strain behavior of metals determined by tensile testing, properties determined from testing, test machines for measuring mechanical properties, and general procedures of tensile testing. Three distinct aspects of standard test methods for tension testing of metallic materials are discussed: test piece preparation, geometry, and material condition; test setup and equipment; and test procedure.

There are several analytical methods available that can be used in-line on whole wafers as well as off-line on de-processed products that are returned from the field. These techniques are surface analytical techniques that can be used to characterize the bulk of the material. The main six methods used in semiconductor industry are: Auger spectroscopy, dynamic secondary ion mass spectroscopy, time of flight static secondary ion mass spectroscopy (ToF-SIMS), X-ray photoelectron spectroscopy, scanning electron microscope-energy dispersive X-ray spectroscopy (SEM-EDX), and transmission electron microscope-EDX. This review specifically addresses ToF-SIMS and describes some typical examples of the application of Auger and SEM-EDX.

The management of a failure analysis (FA) laboratory requires a broad range of activities to optimize the efficiency of the operation. The purpose of this article is to stimulate readers to consider the various aspects of FA laboratory operations and their respective business management requirements. The various aspects include: staffing, laboratory organization, lab design and operations, strategic development, financial management, and metrics and measurements. References for further reading and examples of resource materials are also included.

This chapter sheds light on the challenges involved in diagnosing faults in analog, mixed-signal, and RF circuits. It describes some of the work being done to leverage the benefits of standardization, improve fault simulation tools, and overcome limitations on optical fault isolation techniques. One of the solutions being considered is to integrate LEDs throughout the analog circuit, thereby using light to report the status of internal signals.

This chapter discusses the engineering significance of steel and briefly describes its chemical composition, crystal structure, Fe-C phases, and associated characterization techniques.

This chapter describes a process for recovering beryllium from industrial waste associated with beryllium-copper production. It presents several detailed flowsheets along with typical operating parameters such as flow rates, chemical concentrations, particle sizes, and compositional ranges.

This article provides a high-level overview of thermal spray technologies and their applications and benefits. It is intended to educate members of government, industry, and academia to the benefits of thermal spray technology. The article describes the value of thermal spray technology with examples of application success stories. A few applications critical to thermal spray and market growth are briefly discussed. The article also summarizes the key research areas in thermal spray technology.

Stainless steels and nickel-base alloys are recognized for their resistance to general corrosion and other categories of corrosion. This chapter examines the effects of specific alloying elements, metallurgical structure, and mechanical conditioning on the corrosion resistance of these alloys. Some categories of corrosion covered are pitting, crevice, intergranular, stress-corrosion cracking, general, and high-temperature corrosion.

Prior to forging, it is often necessary to preform billet stock to achieve adequate material distribution. This chapter discusses the equipment used for such operations, including transverse rolling machines, electric upsetters, ring-rolling mills, horizontal presses, and rotary (orbital) and radial forging machines. It describes their basic operating principles as well as advantages and disadvantages.