Search Results for data trending

This chapter concentrates almost exclusively on inspection techniques related to pressure vessels and pipework. The discussion covers the general aspects associated with inspection and the key factors relevant to it. In addition, the chapter addresses processes involved in data collection and management, namely data acquisition, reporting, trending, reviewing, and auditing. Capabilities and limitations of in-service inspection techniques are discussed in the Appendix to this chapter.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

This chapter reviews the concepts of fracture mechanics and their application to materials evaluation and the design of cryogenic structures. Emphasis is placed on an explanation of technology, a review of fracture mechanics testing methods, and a discussion on the many factors contributing to the fracture behavior of materials at cryogenic temperatures. Three approaches of elastic-plastic fracture mechanics are covered, namely the crack opening displacement, the J-integral, and the R-curve methods. The chapter also discusses the influence of thermal and metallurgical effects on toughness at low temperatures.

A successful heat treating operation is determined by the ability to satisfy the customer's quality requirements consistently and economically. This chapter reviews the steps that are important to produce quality parts in heat treating with a brief practical explanation of each. The steps include selecting proper material and design of the part being treated; determining whether the process is capable of heat treatment; using statistical process control, control charting, and in-process inspection and testing; and applying statistical quality control and final testing (sampling) to verify the results.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

This chapter presents a relatively simple method for estimating forging loads and flow stresses. The method uses the slab analysis technique and accounts for material properties, friction and heat transfer, press ram speed, forging geometry, and billet and die temperatures. The chapter demonstrates the use of the method and compares the results with measured values.

Induction heating is a rapid, efficient technique for producing localized or through heating in a wide range of industries. The economics as well as the technical feasibility of induction heating should be important considerations prior to investing in such a system. A number of cost elements enter into the analysis. These include equipment and energy costs, production lot size and ease of automation, material savings, labor costs, and maintenance requirements. This chapter discusses each of these factors. It compares the cost elements of induction heating with those of its main competitor, gas-fired furnace heating. Several typical examples are provided to illustrate the economic considerations in design and application of induction heating processes.

This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.

Statistics, data analysis, root cause analysis, and problem-solving processes play a key role in failure investigations. This chapter explains how to collect failure investigation data, how to build and maintain a database for company-related failures, and how to use corresponding statistics including type of failure, material, and root cause. It describes the purpose and benefits of conducting a root cause analysis and the factors, namely relative failure importance and company value, that determine when an investigation should be performed. The chapter also discusses the four-step problem-solving process as it applies to failure investigation, how to assemble an investigation team, and the details of organization and planning. It concludes with a case history of the Firestone 500 steel-belted tire failure, stressing the importance of a systematic approach to failure investigations.

Combustion turbines consist of a compressor, a combustor, and a turbine. As commonly configured, the compressor and turbine mount on a single shaft that connects directly to a generator. This chapter reviews the materials of construction, damage mechanisms, and life-assessment techniques for nozzles and buckets. It also presents key information from a detailed review of the literature and the results of a survey on combustion-turbine material problems.

The coordinate measuring machine (CMM) is used for three-dimensional inspection of both in-process and finished parts. This chapter provides a detailed account of the operating principles, measurement techniques, capabilities, and applications of CMMs. The types of CMMs are described. Vertical CMMs include cantilever-type, bridge-type, and gantry CMMs; horizontal CMMs, such as the horizontal-arm type, are also covered. The CMM application for geometric measurement, contour measurement, and specialized surface measurement are discussed.

This chapter describes the definitions, designation, chemical composition, room-temperature properties, elevated-temperature properties, and corrosion resistance of cast high alloy steels and stainless steels. In addition, the corrosion resistance of cast corrosion-resistant alloys is also covered.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

Most quenched steels are tempered because the toughness of as-quenched steels is generally very poor. The tempering operation sacrifices strength for improvements in ductility and toughness. This chapter discusses the tempering process, the challenge of tempered martensite embrittlement, and the effect of wt% carbon on toughness. It also explains how alloying elements improve the hardenability and tempering response of plain carbon steels.

This chapter discusses the economic importance of powder metallurgy in various countries, the types of jobs created, and the role of powder metallurgy associations around the world.